1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update boilerplate paragraphs to current requirements. - ro 12-08-29 C. SAFFLE CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE
2、 REV PAGE REV STATUS OF PAGES REV A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY TOM HESS TITLE MICROCIRCUIT, DIGITAL, TEMPERATURE SENSOR, MONOLITHIC SILICON 05-11-1
3、5 APPROVED BY RAYMOND MONNIN SIZE A CODE IDENT. NO. 16236 DWG NO. V62/06608 REV A PAGE 1 OF 10 AMSC N/A 5962-V095-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V6
4、2/06608 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance temperature sensor microcircuit, with an operating temperature range of -40C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identifica
5、tion. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/06608 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function
6、01 TMP121-EP Temperature sensor 02 TMP123-EP Temperature sensor 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 6 MO-178-AB Plastic small outline package 1.2.3 Lead finishes. The lead finishes are as specified below or ot
7、her lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other 1.3 Absolute maximum ratings. 1/ Power supply voltage (V+) . 7.0 V Input voltage range (VIN) . -0.3 V to 7.0 V 2/ Input curren
8、t . 10 mA Operating temperature range (TA) -55C to +150C Storage temperature range (TSTG) -60C to 150C Maximum junction temperature (TJ) . 150C Leading temperature (soldering) 300C Thermal resistance, junction to ambient (JA) 200C/W typical _ 1/ Stresses beyond those listed under “absolute maximum r
9、ating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods m
10、ay affect device reliability. 2/ Input voltage rating applies to all device types input voltages. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06608 REV A PAGE
11、3 1.4 Recommended operating conditions. 3/ Supply voltage range (V+) 2.7 V to 5.5 V Operating free-air temperature range (TA) . -40C to +125C 2. APPLICABLE DOCUMENTS JEDEC Solid State Technology Association JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for cop
12、ies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Man
13、ufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating cond
14、itions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2
15、2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and
16、/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06608 REV A PAGE
17、 4 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions VDD= 2.7 V to 5.5 VTemperature, TADevice type Limits Unit Min Max Temperature input section. Range -40C to +125C 01, 02 Accuracy (temperature error) -25C to +85C 01, 02 1.5 C -40C to +125C 2 -40C to +150C 1.5 typical Accur
18、acy versus supply -40C to +125C 01, 02 0.1 typical C/V Resolution -40C to +125C 01, 02 0.0625 typical C Digital input/output section. High input logic level VIH-40C to +125C 01, 02 0.7 (V+) V Low input logic level VIL-40C to +125C 01, 02 0.3 (V+) V Input current, SO, SCK, CS IIN0 V VIN V+ -40C to +1
19、25C 01, 02 1 A Output logic levels VOLSO ISINK= 3 mA -40C to +125C 01, 02 0.4 V VOHSO ISOURCE= 2 mA -40C to +125C 01, 02 (V+)-0.4 Resolution -40C to +125C 01, 02 12 typical bits Input capacitance, SO, SCK, CS CIN-40C to +125C 01, 02 2.5 typical pF Conversion time 12 bit -40C to +125C 01, 02 320 ms C
20、onversion period 2/ 12 bit -40C to +125C 01, 02 640 ms See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06608 REV A PAGE 5 TABLE I. E
21、lectrical performance characteristics Continued. 1/ Test Symbol Conditions VDD= 2.7 V to 5.5 VTemperature, TA Device type Limits Unit Min Max Power supply section. Operating range -40C to +125C 01, 02 2.7 5.5 V Quiescent current IQSerial bus inactive -40C to +125C 01, 02 50 A Shutdown current ISDSer
22、ial bus inactive -40C to +125C 01 1 A -40C to +125C 02 3 Temperature range section. Specified range -40C to +125C 01, 02 Operating range -55C to +150C 01, 02 Storage range -60C to +150C 01, 02 Thermal resistance JACase X -40C to +125C 01, 02 200 typical C/W 1/ Testing and other quality control techn
23、iques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performan
24、ce is assured by characterization and/or design. 2/ Period indicates time between conversion starts. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06608 REV A PA
25、GE 6 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06608 REV A PAGE 7 Case X Symbol Dimensions Inches Millimeters Min Max Min Max
26、A - 0.057 - 1.45 A1 0.000 0.005 0.00 0.15 b 0.009 0.019 0.25 0.50 c 0.003 0.008 0.08 0.22 D 0.108 0.120 2.75 3.05 E 0.057 0.068 1.45 1.75 E1 0.102 0.118 2.60 3.00 e 0.037 BSC 0.95 BSC L 0.011 0.021 0.30 0.55 L1 0.009 BSC 0.25 BSC n 6 6 NOTES: 1. Controlling dimensions are millimeter, inch dimensions
27、 are given for reference only. 2. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 mm ( 0.005 inch ) per side. 3. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation. 4. Falls within JEDEC MO-178 variation AB, except minimum l
28、ead width. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06608 REV A PAGE 8 Device types 01 02 Case outline X Terminal number T
29、erminal symbol 1 (See note 1) NC (See note 2) GND 2 GND NC (See note 2) 3 V+ V+ 4 SCK SCK 5 CS CS 6 SO SO Terminal symbol I / O Description SCK I Serial clock. GND - Ground. CS I Chip select SO O Serial output V+ - Supply voltage. NC - No connection. NOTES: 1. Pin 1 of case X package is determined b
30、y orienting the package marking. 2. Pins labeled NC should be left floating or connected to GND. FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 1623
31、6 DWG NO. V62/06608 REV A PAGE 9 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/06608 REV A PAGE 10 4. VERIFICATION 4.1 Product assurance
32、 requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, a
33、s applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are
34、classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.
35、3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all current sources of supply at http:/www.
36、landandmaritime.dla.mil/Programs/Smcr/. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Package 2/ Package marking Vendor part number V62/06608-01XE 01295 SOT23-6 (DBV) 121E TMP121AQDBVREP V62/06608-02XE 01295 SOT23-6 (DBV) 123E TMP123AQDBVREP 1/ The vendor item dr
37、awing establishes an administrative control number for identifying the item on the engineering documentation. 2/ Available in reel of 3000. 3/ Product preview. For additional ordering and product information, please contact the manufacturer. CAGE code Source of supply 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
