1、 REVISIONS LTR DESCRIPTION DATE (YR MO DAY APPROVED E Change to military drawing format. Add two new device types. Add vendor CAGE 61394. Add vendor for device types 01 and 02 in DIP only. 87-06-29 Michael A. Frye F Add the Z package to device types 08 and 09. Add vendor CAGE 61394 to devices 01ZX,
2、02ZX, 08ZX, AND 09ZX. Deleted vendor similar part number AM27128-45/BUA from devices 01ZX and 02ZX in paragraph 6.4. Changes to table I and table II. Also changes to recommend operating conditions and figure 2. Editorial changes throughout. 88-11-01 Michael A. Frye G Boilerplate updated to allow for
3、 alternative die/fabrication requirements. ksr 02-09-05 Raymond Monnin H Correction to marking paragraph 3.5. Update boilerplate paragraphs. ksr 05-03-09 Raymond Monnin J Updated boilerplate paragraphs, part of a five year review. ksr 11-02-14 Charles F. Saffle CURRENT CAGE CODE 67268 THE ORIGINAL F
4、IRST SHEET OF THE DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY James Jamison DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Mon
5、nin THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY Michael. A. Frye MICROCIRCUIT, MEMORY, DIGITAL, 16K X 8 UV ERASEABLE PROGRAMMABLE READ ONLY MEMORY (EPROM), MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 83 10 11 AMSC N/A REVISION LEVEL J SIZE
6、A CAGE CODE 14933 82025 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E165-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82025 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 223
7、4 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 82025 01 Y A Drawing numbe
8、r Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit Access 01 (see 6.4) 16,384 x 8 - Bit UV EPROM 450 ns 02 (see 6.4) 16,384 x 8 - Bit UV EPROM 250 ns 03 (see
9、6.4) 16,384 x 8 - Bit UV EPROM 200 ns 04 (see 6.4) 16,384 x 8 - Bit UV EPROM 300 ns 05 (see 6.4) 16,384 x 8 - Bit UV EPROM 250 ns 06 (see 6.4) 16,384 x 8 - Bit UV EPROM 150 ns 07 (see 6.4) 16,384 x 8 - Bit UV EPROM 110 ns 08 (see 6.4) 16,384 x 8 - Bit UV EPROM 200 ns 09 (see 6.4) 16,384 x 8 - Bit UV
10、 EPROM 300 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style 1/ Y GDIP1-T28 and CDIP2-T28 28 dual-in-line package Z CQCC1-N32 32 rectangular chip carrier package 1.2.3 Lead finish. The lead fi
11、nish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage (VCC): Device types 01, 02, 08, 09 . -0.3 V dc to +7.0 V dc Device types 03 - 07 -0.6 V dc to +6.0 V dc .25 V dc Storage temperature range -65C to +150C Maximum power dissipation, (PD) 1.0 W Lead tempe
12、rature (soldering, 10 seconds). +300C Junction temperature (TJ): Device types 01, 02, 08, 09 . +175C Device types 03 - 07 +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 All input or output voltages with respect to ground (device types 03 - 07) -0.6 V dc to +6.25 V dc Input voltage
13、range: Device types 01, 02, 08, 09 . -0.3 V dc to +7.0 V dc Endurance 10,000 cycles/byte (minimum) Data retention 20 years (minimum) _ 1/ Lid shall be transparent to permit ultraviolet light erasure. 2/ All voltages referenced to VSS. Provided by IHSNot for ResaleNo reproduction or networking permit
14、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82025 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Case operating temperature range - -55C to +125C Input low voltage, VIL- -0.1 V dc to +0.8
15、V dc Input high voltage, VIH- 2.0 V dc to VCC+1 V dc Supply voltage (VCC) - 4.5 V dc to 5.5 V dc High level program input voltage VIN(PR) - 21.0 V dc .5 V dc (devices 1,2,8, and 9) High level program input voltage VIN(PR) - 12.5 V dc .5 V dc (devices 3 7 ) 2. APPLICABLE DOCUMENTS 2.1 Government spec
16、ification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PR
17、F-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircui
18、t Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event
19、of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individua
20、l item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted tr
21、ansitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requir
22、ements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has be
23、en modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as spe
24、cified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). See 3.2.3.1 and 3.2.3.2 3.2.3.1 Unprogrammed or erased de
25、vices. The truth table for unprogrammed devices shall be as specified on figure 2. 3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI
26、CROCIRCUIT DRAWING SIZE A 82025 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 4 DSCC FORM 2234 APR 97 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical perfor
27、mance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Mark
28、ing. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compl
29、iance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturers
30、QM plan, the “QD” certification mark shall be used in place of the “Q“ or “QML“ certification mark. 3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.6.1 Erasure of EPROMS. When specified, devices shall
31、 be erased in accordance with the procedures and characteristics specified in 4.4. 3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures and characteristics specified in 4.5. 3.6.3 Verification of erasure or programmability of EPRO
32、MS. When specified, devices shall be verified as either programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroups 7 and 8) to verify that all bits are in proper state. Any bit that does not verify to be in the proper state shal
33、l constitute a device failure and shall be removed from the lot. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Lan
34、d and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall
35、be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change. Notification to DLA Land and Maritime-VA of change of product (see 6.3 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.10 Verification and revi
36、ew. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and ins
37、pection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall a
38、pply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, out
39、puts, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82025 DLA LAND AND MARITIME COLUMBUS, OHIO
40、 43218-3990 REVISION LEVEL J SHEET 5 DSCC FORM 2234 APR 97 (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. c. A data retent
41、ion stress test shall be included as part of the screening procedure. Margin test methods shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. 4.3 Quality conformance inspection. Quality conform
42、ance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883
43、shall be omitted. c. Subgroup 4 (CINand COmeasurement) shall be measured only for the initial test and after process or design changes which may affect input capacitance. A minimum sample of five (5) devices with zero failures shall be required. d. All devices selected for testing shall be programme
44、d with a checkerboard pattern or equivalent. After completion of all testing, the devices shall be erased and verified (except devices submitted for groups C and D testing). 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state
45、 life test conditions, method 1005 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, out
46、puts, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4 Erasing procedure. The device is erased by exposure to high intens
47、ity shortwave ultraviolet light at a wavelength of 253.7 nm. The recommended integrated dose (i.e., UV intensity X exposure time) is 15 W-s/cm2. An example of an ultraviolet source which can erase the device in 30 minutes is the model S52 shortwave ultraviolet lamp. The lamp should be used without short wave filters and the EPROM should be placed about one inch from the lamp tubes. After erasure, all bits are in the high state. 4.5 Programming
