1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change max. low level input voltage (VIL) from 0.8 V to 0.7 V. Delete min. on prop. delay times. Change prop. delay times, tPLH1, tPHL1, tPZH, tPZL. Revise to Military Drawing format. 87-04-02 N. A. Hauck B Changes in accordance with NOR 5962-R13
2、2-92 92-02-20 Monic L. Poelking C Changes in accordance with NOR 5962-R243-92 92-07-10 Monic L. Poelking D Redraw with changes. Update to current requirements. Editorial changes throughout. - gap 05-11-10 Raymond Monnin CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF
3、SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Monica Grosel DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGIT
4、AL, ADVANCED LOW-POWER SCHOTTKY, OCTAL BUS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-06-01 TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 14933 84033 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E035-06 Provided by IHSNot for
5、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883
6、 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84033 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device ty
7、pe(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS645A ALS octal bus transceivers with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive des
8、ignator Terminals Package style R GDIP1-T20 or GDIP2-T20 20 Dual-in-line S GDFP2-F20 or GDFP3-F20 20 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc Inpu
9、t voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 1/ . 346.5 mA Lead temperature range (soldering 10 seconds) +300C Thermal resistance, junction to case (JC): . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 R
10、ecommended operating conditions. Supply voltage (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C Normalized fanout (each input) 2/ 20 maximum _ 1/ Must wit
11、hstand the added PDdue to short circuit test (e.g., IOS). 2/ The device shall fanout in both high and low levels to the specified number of inputs of the same device type as that being tested.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M
12、ICROCIRCUIT DRAWING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing t
13、o the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - T
14、est Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assi
15、st.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this d
16、rawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84033 DEFENSE S
17、UPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to thi
18、s drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activ
19、ity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herei
20、n. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Ca
21、se outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figur
22、e 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the s
23、ubgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certif
24、ication/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is
25、used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall aff
26、irm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 No
27、tification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore docume
28、ntation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC F
29、ORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Min Max Unit VOH1VCC= 4.5 V, VIN= 0.7 V or 2.0 V, IOH= -3 mA 1, 2, 3 2.4 V High level output voltage VOH2VCC= 4.5 V, VIN= 0.7 V or 2.0 V, IOH= -12
30、 mA 1, 2, 3 2.0 V Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V, IOL= 12 mA 1, 2, 3 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 -1.5 V Low level input current IILVCC= 5.5 V, VIN= 0.4 V DIR and G ABG and GBA 1, 2, 3 -100 A IIH1VCC= 5.5 V, VIN= 2.7 V DIR and G ABG and GBA 1,
31、2, 3 20 A IIH2VCC= 5.5 V, VIN= 5.5 V I/O ports 1, 2, 3 100 A High level input current IIH3VCC= 5.5 V, VIN= 7.0 V DIR and G ABG and GBA 1, 2, 3 100 A Output current, high level, outputs off IOZH/IIH1VCC= 5.5 V, VOUT= 2.7 V I/O ports 1, 2, 3 20 mA Output current, low level, outputs off IOZL/IILVCC= 5.
32、5 V, VOUT= 0.4 V I/O ports 1, 2, 3 -100 mA Output current IOVCC= 5.5 V, VOUT= 2.25 V 1/ 1, 2, 3 -20 -112 mA Supply current ICCHVCC= 5.5 V 1, 2, 3 48 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU
33、IT DRAWING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions -55C TC+125C unless otherwise specified Group A subgroups Min Max Unit Supply cur
34、rent, outputs low ICCLVCC= 5.5 V 1, 2, 3 60 mA Supply current, outputs disabled ICCZVCC= 5.5 V 1, 2, 3 63 mA Propagation delay time, low-to high level, A or B to B or A tPLH19, 10, 11 19 ns Propagation delay time, high-to low level, A or B to B or A tPHL19, 10, 11 14 ns Propagation delay time, disab
35、le to high level, G to A or B tPZH9, 10, 11 30 ns Propagation delay time, disable to low level, G to A or B tPZL9, 10, 11 29 ns 9 16 Propagation delay time, high level to disable, G to A or B tPHZ10, 11 25 ns 9, 10, 11 30 Propagation delay time, low level to disable, G to A or B tPLZVCC= 4.5 V to 5.
36、5 V, CL= 50 pF, R1= R2= 500 ns 1/ The output conditions have been chosen to produce a current that produce a current that closely approximates one-half of the true short-circuit output current, IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STA
37、NDARD MICROCIRCUIT DRAWING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW
38、ING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Enable G Direction control DIR Operation L L B data to A bus L H A data to B bus H X Isolation H = High voltage level L = Low voltage level X = Irrelevant FIGURE 3. Truth table. F
39、IGURE 4. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling an
40、d inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria sh
41、all apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
42、 inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to
43、burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3
44、, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Qua
45、lity conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5
46、005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI
47、SION LEVEL D SHEET 10 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the m
48、anufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with
