1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03 and 04. Convert to standard military drawing format and change drawing CAGE code. Add figure 4, test circuit and switching waveforms. Inactivate device types 01 and 02 for new design. Editorial changes throughout. 88-12-20 M.
2、A. Frye B Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 05-02-08 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6
3、7 8 9 10 11 12 13 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUITS, DIGITAL, TTL, OCTAL
4、D-TYPE TRANSPARENT LATCH, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 85-05-08 MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 14933 84179 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E139-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without l
5、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in acco
6、rdance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84179 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as fo
7、llows: Device type Generic number Circuit function 01, 03 8282 Octal, D-type, transparent latch with 3-state outputs 02, 04 8283 Octal, D-type, transparent latch with inverted 3-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter
8、Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line 3 CQCC1-N28 28 leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range. -0.5 V dc to +7.0 V dc Input voltage range
9、 . -1.0 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 1 W Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply
10、 voltage : Device types 01 and 02 4.5 V dc minimum to 5.5 V dc maximum Device types 03 and 04 4.75 V dc minimum to 5.25 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.8 V dc Case operating temperature range (TC) -55C to +125C Input to STB setup
11、 time t(setup)0 ns minimum Input to STB hold time t(hold)25 ns minimum input pulse width (tP) (Strobe) . 15 ns minimum _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networkin
12、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, sta
13、ndards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification f
14、or. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of
15、 these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this dr
16、awing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordanc
17、e with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
18、 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall
19、not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The desig
20、n, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The tru
21、th tables shall be as specified on figure 2. 3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking
22、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characte
23、ristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking s
24、hall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-P
25、RF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be l
26、isted as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7
27、 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9
28、 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or
29、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C unless otherwi
30、se specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= minimum, IOH= -5 mA 1, 2, 3 All 2.4 V Low level output voltage VOLVCC= minimum, IOL= 20 mA 1, 2, 3 All 0.45 V Input clamp voltage VI CVCC= minimum, IIN= -5 mA, TC= +25C 1 All -1 V High level input voltage
31、 VIHVCC= 5 V, IOH= -5 mA, CL= 300 pF 1, 2, 3 All 2.0 V Low level input voltage VILVCC= 5 V, IOL= 20 mA, CL= 300 pF 1, 2, 3 All 0.8 V High level input current IIHVCC= maximum, VIH= 5.25 V 1, 2, 3 All 50 A Low level input current IILVCC= maximum, VIL= 0.45 V 1, 2, 3 All -200 A Supply current ICCVCC= m
32、aximum 1, 2, 3 All 160 mA Output current, high level, outputs OFF IOZHVCC= maximum, VOH= 2.7 V 1, 2, 3 All 50 A Output current, low level, outputs OFF 2/ IOZLVCC= maximum, VOH= 0.45 V 1, 2, 3 All -50 A Functional tests See 4.3.1c 7 All See footnotes at end of table Provided by IHSNot for ResaleNo re
33、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -5
34、5C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max Transition time, low to high (from 0.8 V to 2.0 V) 2/ tTLH9, 10, 11 All 20 ns Transition time, high to low (from 2.0 V to 0.8 V) 2/ tTHLCL= 300 pF 10%, RL= 78, See figure 4 9, 10, 11 All 12 ns tPLH19, 10, 11 01,
35、03 55 ns Propagation delay time to high level (STB to output) 3/ 4/ VCC= 5.0 V, CL= 300 pF 10%, RL= 78, See figure 4 02, 04 45 tPHL19, 10, 11 01, 03 55 ns Propagation delay time to low level (STB to output) 3/ 4/ 02, 04 45 tPLH29, 10, 11 01, 03 35 ns Propagation delay time to high level (data to out
36、put) 4/ 02, 04 25 tPHL29, 10, 11 01, 03 35 ns Propagation delay time to low level (data to output) 4/ 02, 04 25 Output control ON to high level output tPZH9, 10, 11 All 10 2/ 50 ns Output control ON to low level output tPZLCL= 300 pF 10%, RL= 78, See figure 4 9, 10, 11 All 10 2/ 50 ns High level out
37、put to output control OFF tPHZ9, 10, 11 All 25 ns Low level output to output control OFF tPLZ9, 10, 11 All 25 ns 1/ VCC= 4.5 V minimum to 5.5 V maximum for device types 01 and 02, unless otherwise specified. VCC= 4.75 V minimum to 5.25 V maximum for device types 03 and 04, unless otherwise specified
38、. 2/ Tested only initially and after any design change. 3/ For device types 02 and 04 only, output may be momentarily invalid following the high going STB transition. 4/ Device types 02 and 04 limits shown are guaranteed by design but tested to the applicable device types 01 and 03 limits. Provided
39、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 and 03 02 and 04 Case outlines R 3 R 3 Terminal n
40、umber Terminal symbol Terminal symbol 1 1D NC 1D NC 2 2D 1D 2D 1D 3 3D 2D 3D 2D 4 4D 3D 4D 3D 5 5D NC 5D NC 6 6D 4D 6D 4D 7 7D 5D 7D 5D 8 8D NC 8D NC 9 OE 6D OE 6D 10 GND 7D GND 7D 11 STB NC STB NC 12 8Q 8D 8 Q 8D 13 7Q OE 7Q OE 14 6Q GND 6 Q GND 15 5Q NC 5 Q NC 16 4Q STB 4 Q STB 17 3Q 8Q 3 Q 8Q 18
41、2Q 7Q 2 Q 7Q 19 1Q NC 1 Q NC 20 VCC6Q VCC6 Q 21 - - - 5Q - - - 5 Q 22 - - - NC - - - NC 23 - - - 4Q - - - 4 Q 24 - - - 3Q - - - 3 Q 25 - - - NC - - - NC 26 - - - 2Q - - - 2 Q 27 - - - 1Q - - - 1 Q 28 - - - VCC- - - VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or n
42、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device types 01 and 03 OUTPUT ENABLE STROBE DATA OUTPUT OE STB D Q H X X Z L L Q0L H L L L H H H Device
43、types 02 and 04 OUTPUT ENABLE STROBE DATA OUTPUT OE STB D Q H X X ZL L Q0L H L L L H H H H = High level (steady state) L = Low level (steady state) Z = High impedance state X = Irrelevant Q0= The level of Q or Q before the indicated input conditions were established FIGURE 2. Truth tables. Provided
44、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reprodu
45、ction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram - Continued. Provided by IHSNot for ResaleNo reproduction or networki
46、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 11 DSCC FORM 2234 APR 97 AC testing: Inputs are driven at 2.4 V for a logic “1“ and 0.45 V for a logic “0“. Timing measurements are mad
47、e at 1.5 V for both a logic “1“ and “0“. Input rise and fall times are measured from 0.8 V to 2.0 V and are driven at 5 ns 2 ns. FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
48、WING SIZE A 84179 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 12 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-8
