1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - drw 05-07-19 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7
2、 8 9 10 11 12 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, ELECTRO
3、LUMINESCENT ROW DRIVER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-01-02 MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-86054 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E381-05 Provided by IHSNot for ResaleNo reproduction or networking permitted withou
4、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits
5、 in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86054 01 X A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit
6、 function as follows: Device type Generic number Circuit function 01 55551 Electroluminescent row driver (see figures 1 and 5) 02 55552 Electroluminescent row driver (see figures 1 and 5) 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descript
7、ive designator Terminals Package style X CQCC1-N44 44 Square leadless chip carrier Y CQCC2-J44 44 Square J-lead chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 18 V dc Input voltage -0.3 V dc to VCC+
8、0.3 V dc Q off state output voltage. 225 V Common terminal current (pulsed mode). 1.5 mA Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds) +300C Power dissipation (PD) . 1475 mW 2/ Junction temperature (TJ) 150C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 1.4
9、 Recommended operating conditions. Supply voltage (VCC) 10.8 V dc to 13.2 V dc High level input voltage: VCC= 10.8 V. 8.1 V dc minimum VCC= 13.2 V. 9.9 V dc minimum Low level input voltage: VCC= 10.8 V. 2.7 V dc minimum VCC= 13.2 V. 3.3 V dc minimum Clock frequency (fCLK) (TA= +25C). 6.25 MHz Ambien
10、t operating temperature range (TA) -55C to +125C _ 1/ All voltages are referenced to GND terminal. 2/ 1475 mW for operation between -55C to +25C. For operating above +25C free-air temperature, derate linearly at 14.6 mW/C.Provided by IHSNot for ResaleNo reproduction or networking permitted without l
11、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and hand
12、books form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT O
13、F DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents
14、 are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the re
15、ferences cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-3
16、8535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processe
17、d as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form,
18、 fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction,
19、 and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shal
20、l be as specified on figure 2. 3.2.4 Truth table. The truth table shall be as specified on figure 3. 3.2.5 Switching diagrams. The switching diagrams shall be as specified on figure 4. 3.2.6 Typical operating sequence. The typical operating sequence shall be as specified on figure 5. 3.3 Electrical
21、performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specifie
22、d in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A
23、SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C VCC= 12 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max High level output voltage, serial outputs VOHSIOUT= -100 A 1, 2, 3 All 10 V Low level output v
24、oltage, serial outputs VOLSIOUT= 100 A 1, 2, 3 All 1.5 V Low level output voltage, Q outputs VOLQIOUT= 50 mA 1, 2, 3 All 50 V Low level Q output current IOLVCC= 10.8 V, TA= +25C 2/ 1 All 50 mA VCC= 15 V, TA= +25C 2/ 80 High level input current IIHVIN= 12 V 1, 2, 3 All 5 A Low level input current IIL
25、VIN 0 V 1, 2, 3 All -5 A Off state output current IOFFVO= 200 V 1, 2, 3 All 50 A Supply current from VCCICCOutputs open 1, 2, 3 All 0.5 mA Functional tests See 4.3.1c 7, 8 All Clock frequency fCLKTA= +25C 9 All 6.25 MHz Turn on time, Q outputs from enable tONRL= 2 k, 100 V supply, TA= +25C 9 All 700
26、 ns Pulse duration clock high or low tWSee figure 4, TA= +25C 9 All 200 ns Data setup time before falling clock tSUSee figure 4, TA= +25C 9 All 180 ns Falling clock tHSee figure 4, TA= +25C 9 All 180 ns Delay time, high to low level serial output from clock tDHLCL= 25 pF to ground, See figure 4, TA=
27、 +25C 9 All 200 ns Delay time, low to high level serial output from clock tDLH CL= 25 pF to ground, See figure 4, TA= +25C 9 All 200 ns 1/ Voltage measured with respect to GND unless otherwise noted. 2/ Output current measurement duty cycle 1 percent. Provided by IHSNot for ResaleNo reproduction or
28、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 Device types 01 02 Case outlines X and Y X and Y Terminal number Terminal symbol 1 Q16 Q17 2 Q17 Q
29、16 3 Q18 Q15 4 Q19 Q14 5 Q20 Q13 6 Q21 Q12 7 Q22 Q11 8 Q23 Q10 9 Q24 Q9 10 Q25 Q8 11 Q26 Q7 12 Q27 Q6 13 Q28 Q5 14 Q29 Q4 15 Q30 Q3 16 Q31 Q2 17 Q32 Q1 18 DATA OUT DATA OUT 19 NC NC 20 NC NC 21 NC NC 22 NC NC 23 ENABLE ENABLE 24 CLOCK CLOCK 25 GND GND 26 VCCVCC27 STROBE STROBE 28 DATA IN DATA IN 29
30、NC NC 30 Q1 Q32 31 Q2 Q31 32 Q3 Q30 33 Q4 Q29 34 Q5 Q28 35 Q6 Q27 36 Q7 Q26 37 Q8 Q25 38 Q9 Q24 39 Q10 Q23 40 Q11 Q22 41 Q12 Q21 42 Q13 Q20 43 Q14 Q19 44 Q15 Q18 NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
31、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO
32、CIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Control inputs Function Clock Enable Strobe Internal shift register Q (serial output is always enabled) X X Load and shift data Load no X X No change Determined b
33、y enable and strobe X L H All Q outputs off Enable X H H Determined by R1 through R32 Strobe X X L Determined by clock All Q outputs on FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8
34、6054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 FIGURE 4. Switching diagrams. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY
35、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 NOTE: During operation clock, data in, enable, and strobe are referenced to the composite row drive signal received at the common pin of the device. FIGURE 5. Typical operating sequence.Provided by IHSNot for Re
36、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A
37、. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certi
38、fication/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is
39、 used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall af
40、firm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 N
41、otification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore docum
42、entation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be
43、 conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be
44、 made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test p
45、arameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59
46、62-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 11 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. 1/ MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - -
47、- Final electrical test parameters (method 5004) 1, 2, 3, 7, 8, 9 2/ Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 1/ Any or all subgroups may be combined when using a high speed tester. 2/ PDA applies to subgroup 1. 4.3
48、 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified
