1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 07-05-10 Robert M. Heber CURRENT CAGE CODE 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHE
2、ETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Monica Grosel DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGIT
3、AL, BIPOLAR OCTAL BUFFER, NON-INVERTING THREE-STATE, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-04-01 MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 14933 5962-87536 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E215-07 Provided by IHSNot for ResaleNo reproduction o
4、r networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JA
5、N class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87536 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The de
6、vice type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AM25S244 Octal non-inverting three-state buffer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package s
7、tyle R GDIP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range -1.5 V dc to 7.0 V dc Storag
8、e temperature range . -65C to +150C Maximum power dissipation (PD) 1/ . 2.2 W Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +150C DC input current -30 mA to +5.0 mA DC output current, into output . +30 mA 1.4 Recom
9、mended operating conditions. Supply voltage (VCC) +4.5 V to 5.5 V dc maximum Minimum high-level input voltage (VIH) 2.0 V dc Maximum low-level input voltage (VIL) . 0.8 V dc Ambient temperature range (TA) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided b
10、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standa
11、rds, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integra
12、ted Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-H
13、DBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In
14、 the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. Th
15、e individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been
16、 granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to
17、 the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Desi
18、gn, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be a
19、s specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics. U
20、nless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
21、tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97
22、3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufac
23、turer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mar
24、k in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance subm
25、itted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall b
26、e provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the ma
27、nufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Scre
28、ening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, C, or D. The test circuit shall be maintained
29、 by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-
30、STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitt
31、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C Group A subgroups Limits Unit
32、unless otherwise specified Min Max High-level output voltage VOHVCC= +4.5 V 1, 2, 3 2.4 V VIN= 0.8 V or 2.0 V G1 = G2 = 0.8 V IOH= -3.0 mA VCC= +4.5 V 2.0 V IN= 0.8 V or 2.0 V G1 = G2 = 0.5 V IOH= -12.0 mA Low-level output voltage VOLVCC= +4.5 V 1, 2, 3 0.55 V VIN0.8 V or 2.0 V OL= 48.0 mA Hysteresi
33、s (VT+-VT-) VHYSTVCC= +4.5 V 1, 2, 3 0.2 V Input clamp voltage 1/ VICVCC= +4.5 V 1, 2, 3 -1.2 V IIN= -18 mA High-level input current 1/ IIH1VCC= +5.5 V 1, 2, 3 50 A VIN= 2.7 V IH2VCC= +5.5 V 1, 2, 3 1.0 mA IN= 5.5 V Low-level input current 1/ IILVCC= +5.5 V VIN= 0.5 V Any A 1, 2, 3 -0.4 mA Any B -2.
34、0 Output short circuit current IOSVCC= +5.5 V 1, 2, 3 -50 -225 mA VOUT= 0 V 2/ Off-state current IOZHVCC= +5.5 V 1, 2, 3 50 A OUT= 2.4 V IOZLVCC= +5.5 V 1, 2, 3 -50 A VOUT= 0.5 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
35、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C Group A subgroups Limits Unit unless other
36、wise specified Min Max Supply current ICCVCC= +5.5 V All outputs open 1, 2, 3 65 mA G1 = 0.0 V G2 = 0.0 V DATA = 3.0 V All outputs low 1, 2, 3 105 mA G1 = 0.0 V G2 = 0.0 V DATA = 0.0 V All outputs Hi-Z 1, 2, 3 120 mA G1 = 3.0 V G2 = 3.0 V DATA = 0.0 V Propagation delay from tPLHCL= 50 pF 3/ 9 9 ns A
37、i to Yi RL1= 1 k 4/ 9, 10, 11 12 tPHLRL2= 90 3/ 9 9 ns / 9, 10, 11 12 Propagation delay from tPZH3/ 9 12 ns output enable to Yi 4/ 9, 10, 11 13 tPZL3/ 9 15 ns / 9, 10, 11 18 Propagation delay from tPHZ13/ 9 18 ns output enable to Yi tPLZ13/ 9 18 ns Propagation delay from tPHZ2CL= 5 pF 3/ 9 9 ns outp
38、ut enable to Yi RL1= 1 k 4/ 9, 10, 11 12 tPLZ2RL2= 90 3/ 9 15 ns / 9, 10, 11 18 1/ Input thresholds are tested during dc tests and may be done in combination with testing of other dc parameters. 2/ Not more than one output should be shorted at a time, and the duration of the short circuit condition
39、should not exceed one second. 3/ VCC= 5.0 V 4/ VCC= 4.5 V to 5.5 V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC
40、FORM 2234 APR 97 FIGURE 1. Terminal connections. Inputs Outputs G A Y H X Z L H H L L L FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CEN
41、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Switch matrix Parameter SW1SW2tPLHClosed Closed tPHLClosed Closed tZLOpen Closed tZHClosed Open tLZClosed Closed tHZClosed Closed FIGURE 4. Switching circuits and waveforms. Provided by IHSNot for ResaleNo reproduc
42、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. Pulse generator for all pulses: Rate 1.0 MHz; Z0= 50 ohm; tr 15 ns; tf 6.0 ns. 2
43、. CLincludes probe and jig capacitance. 3. All diodes are IN916 or IN3064. FIGURE 4. Switching circuits and waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87536 DEFENSE SUPPLY CENTER C
44、OLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters
45、(method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in table I. 4
46、.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgrou
47、ps 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005
48、 of MIL-STD-883. (1) Test condition A, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA=
