DLA SMD-5962-87677 REV C-2009 MICROCIRCUIT LINEAR HIGH SPEED SAMPLE AND HOLD AMPLIFIER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R217-92. 92-07-10 M. A. FRYE B Drawing updated to reflect current requirements. -ro 02-09-18 R. MONNIN C Update standard SMD paragraphs. -rrp 09-02-09 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BE
2、EN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY CHARLES E. BESORE DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D.H. JOHNSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABL
3、E FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED SAMPLE AND HOLD AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-05-02 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-87677 SHEET 1 OF 10 DSCC FORM 2233 AP
4、R 97 5962-E505-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing
5、 describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87677 01 C X Drawing number Device type (see 1.2.1) Case outli
6、ne(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HA-5330 High speed sample and hold amplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follo
7、ws: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Voltage between +V and supply/signal g
8、round . +20 V dc Voltage between -V and supply/signal ground -20 V dc Voltage between supply ground and signal ground . 2.0 V dc Differential input voltage 24 V dc Digital input voltage ( S /H pin) +8.0 V dc, -6.0 V dc Output current . 17 mA 1/ Maximum power dissipation (PD): Case C 1.33 W 2/ Case 2
9、 . 1.32 W 3/ Storage temperature range . -65C to +150C Junction temperature (TJ) . +175C Lead temperature (soldering, 10 seconds) +275C Thermal resistance, junction-to-case (JC): Cases C and 2 . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case C 75C/W Case 2 . 76C/W _ 1/ Internal
10、power dissipation may limit output current below 17 mA. 2/ Derate linearly above TA= +75C at 13.3 mW/C. 3/ Derate linearly above TA= +75C at 13.2 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DE
11、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Operating supply voltage (VSUPPLY) 15 V dc Analog input voltage (VS) 10 V dc Input logic low voltage (VIL) . 0 V dc to 0.8 V dc Input logic high voltage (VIH) .
12、 2.0 V dc to 5.0 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified,
13、 the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interfac
14、e Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization D
15、ocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable
16、 laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced
17、 by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance
18、 with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certific
19、ation mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outli
20、ne shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply o
21、ver the full ambient operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97
22、TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIO1,2,3 01 2.0 mV Input bias current +IB1,2,3 01 500 nA -IB500 Input offset current IIO1,2,3 01 500 nA Open loop
23、voltage gain +AVOLRL= 1 k, VOUT= +10 V 1,2,3 01 2x106V/V -AVOLRL= 1 k, VOUT= -10 V 2x106Common mode rejection ratio -CMRR +V = 25 V, -V = -5.0 V, VOUT= 10 V, S /H = 10.8 V 1,2,3 01 86 dB +CMRR +V = 5.0 V, -V = -25 V, VOUT= -10 V, S /H = -9.2 V 86 Output current +IOUTVOUT= +10 V 1,2,3 01 10 mA -IOUTV
24、OUT= -10 V -10 Output voltage swing +VOUTRL= 1 k 1,2,3 01 +10 V -VOUT-10 Power supply current +ICC1,2,3 01 22 mA -ICC-23 Power supply rejection ratio +PSRR +V = +13.5 V, +16.5 V, -V = -15 V, -15 V 1,2,3 01 86 dB -PSRR +V = +15 V, +15 V, -V = -13.5 V, -16.5 V 86 See footnotes at end of table. Provide
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