DLA SMD-5962-87677 REV C-2009 MICROCIRCUIT LINEAR HIGH SPEED SAMPLE AND HOLD AMPLIFIER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R217-92. 92-07-10 M. A. FRYE B Drawing updated to reflect current requirements. -ro 02-09-18 R. MONNIN C Update standard SMD paragraphs. -rrp 09-02-09 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BE

2、EN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY CHARLES E. BESORE DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D.H. JOHNSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABL

3、E FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED SAMPLE AND HOLD AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-05-02 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-87677 SHEET 1 OF 10 DSCC FORM 2233 AP

4、R 97 5962-E505-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing

5、 describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87677 01 C X Drawing number Device type (see 1.2.1) Case outli

6、ne(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HA-5330 High speed sample and hold amplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follo

7、ws: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Voltage between +V and supply/signal g

8、round . +20 V dc Voltage between -V and supply/signal ground -20 V dc Voltage between supply ground and signal ground . 2.0 V dc Differential input voltage 24 V dc Digital input voltage ( S /H pin) +8.0 V dc, -6.0 V dc Output current . 17 mA 1/ Maximum power dissipation (PD): Case C 1.33 W 2/ Case 2

9、 . 1.32 W 3/ Storage temperature range . -65C to +150C Junction temperature (TJ) . +175C Lead temperature (soldering, 10 seconds) +275C Thermal resistance, junction-to-case (JC): Cases C and 2 . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case C 75C/W Case 2 . 76C/W _ 1/ Internal

10、power dissipation may limit output current below 17 mA. 2/ Derate linearly above TA= +75C at 13.3 mW/C. 3/ Derate linearly above TA= +75C at 13.2 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DE

11、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Operating supply voltage (VSUPPLY) 15 V dc Analog input voltage (VS) 10 V dc Input logic low voltage (VIL) . 0 V dc to 0.8 V dc Input logic high voltage (VIH) .

12、 2.0 V dc to 5.0 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified,

13、 the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interfac

14、e Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization D

15、ocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable

16、 laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced

17、 by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance

18、 with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certific

19、ation mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outli

20、ne shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply o

21、ver the full ambient operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97

22、TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIO1,2,3 01 2.0 mV Input bias current +IB1,2,3 01 500 nA -IB500 Input offset current IIO1,2,3 01 500 nA Open loop

23、voltage gain +AVOLRL= 1 k, VOUT= +10 V 1,2,3 01 2x106V/V -AVOLRL= 1 k, VOUT= -10 V 2x106Common mode rejection ratio -CMRR +V = 25 V, -V = -5.0 V, VOUT= 10 V, S /H = 10.8 V 1,2,3 01 86 dB +CMRR +V = 5.0 V, -V = -25 V, VOUT= -10 V, S /H = -9.2 V 86 Output current +IOUTVOUT= +10 V 1,2,3 01 10 mA -IOUTV

24、OUT= -10 V -10 Output voltage swing +VOUTRL= 1 k 1,2,3 01 +10 V -VOUT-10 Power supply current +ICC1,2,3 01 22 mA -ICC-23 Power supply rejection ratio +PSRR +V = +13.5 V, +16.5 V, -V = -15 V, -15 V 1,2,3 01 86 dB -PSRR +V = +15 V, +15 V, -V = -13.5 V, -16.5 V 86 See footnotes at end of table. Provide

25、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued

26、. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Digital input current IIN1VIN1= 0 V 1,2,3 01 40 A IIN2VIN2= 5.0 V 40 Digital input voltage VIL1,2,3 01 0.8 V VIH2.0 Output voltage droop rate VDSee figure 2 2/ 1,3 01 10 V/s See figu

27、re 2 2 100 Acquisition time 0.1 % +tacq1(0.1%) VOUT= -5 V to +5 V, 2/ RL= 2 k, CL= 50 pF, 9 01 600 ns AV= +1 10,11 700 -tacq1(0.1%) VOUT= +5 V to -5 V, 2/ RL= 2 k, CL= 50 pF, 9 600 AV= +1 10,11 700 Positive slew rate +SR RL= 2 k, CL= 50 pF, 2/ AV= +1, VIN= -10 V to 9 01 55 V/s +10 V step measured fr

28、om 25% to 75%, 10,11 40 Negative slew rate -SR RL= 2 k, CL= 50 pF, 2/ AV= +1, VIN= +10 V to 9 01 -55 V/s -10 V step measured from 75% to 25%, 10,11 -40 1/ +V = +15 V, -V = -15 V, VIL= 0.8 V (sample), VIH= 2.0 V (hold), CH= internal = 90 pF, -IN tied to output and signal ground = supply ground, unles

29、s otherwise specified. 2/ If not tested, shall be guaranteed to the limits specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

30、REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C 2 Terminal number Terminal symbol 1 +IN NC 2 NC +IN 3 OFFSET ADJUST NC 4 OFFSET ADJUST OFFSET ADJUST 5 -V NC 6 NC OFFSET ADJUST 7 OUTPUT NC 8 S /H CONTROL -V 9 NC NC 10 +V OUTPUT 11 SUPPLY GROUND NC 12 SIGNAL GROUND S /H C

31、ONTROL 13 NC NC 14 -IN +V 15 - NC 16 - SUPPLY GROUND 17 - NC 18 - SIGNAL GROUND 19 - NC 20 - -IN NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENS

32、E SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 NOTE: Droop rate = (A18 A17) / (A20 A19) x A20 - A19 = 10 ms FIGURE 2. Droop rate waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI

33、CROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are des

34、cribed in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limit

35、ations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML

36、“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate

37、 of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535,

38、 appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the opti

39、on to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.

40、4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circu

41、it shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified

42、in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality

43、conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 500

44、5 of MIL-STD-883 shall be omitted. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87677 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Elect

45、rical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*, 2, 3 Group A test requirements (method 5005) 1, 2, 3, 9, 10, 11 Groups C and D end-

46、point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit

47、 shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

48、 method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

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