1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Update boilerplate. Editorial corrections throughout. 98-10-16 Raymond Monnin B Add case outline “Y“ to drawing. - glg 00-01-19 Raymond Monnin C Boilerplate update and part of five year review. tcr 07-04-02 Robert M. Heber REV
2、 SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Kenneth Rice DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL D
3、EPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16 X 4 SRAM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 10 August 1989 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-89694 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E275-07.Prov
4、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89694 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requ
5、irements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89694 01 Y A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead fin
6、ish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 7C190 16 X 4 SRAM 25 ns 02 7C190-30 16 X 4 SRAM 30 ns 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: O
7、utline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F16 16 Flat package X CQCC2-N20 20 Square chip carrier package 1/ Y CQCC2-N20 20 Square chip carrier package 1/ 1.2.3 Lead finish. The lead finish is as specified in MIL
8、-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage to ground potential- -0.5 V dc to +7.0 V dc DC voltage applied to outputs in high Z state- -0.5 V dc to +7.0 V dc DC input voltage- -3.0 V dc to +7.0 V dc DC output current - 20 mA Maximum power dissipation 1/- 500 mW Lead temperat
9、ure (soldering, 10 seconds) - +260C Thermal resistance, junction-to-case (JC):- See MIL-STD-1835 Junction temperature (TJ) 2/- +150C Storage temperature range- -65C to +150C Temperature under bias- -55C to +125C 1.4 Recommended operating conditions. Supply voltage (VCC) - +4.5 V dc to +5.5 V dc Grou
10、nd voltage (GND)- 0 V dc Input high voltage (VIH) - 2.0 V dc minimum Input low voltage (VIL) - 0.8 V dc maximum Operating case temperature range (TC)- -55C to +125C 1/ See Figure 1 terminal connections for pinout differences. 2/ Must withstand the added PDdue to short circuit test (e.g., IOS). 3/ Ma
11、ximum junction temperature may be increased to 175C during burn-in and steady state life. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89694 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO
12、N LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are thos
13、e cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Ou
14、tlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Or
15、der Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and
16、regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qual
17、ified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-
18、PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark
19、 in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall
20、 be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
21、 characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking.
22、Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
23、 option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordan
24、ce with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89694 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC
25、 FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supp
26、ly shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this dra
27、wing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Off
28、shore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, a
29、nd shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control a
30、nd shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electr
31、ical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 incl
32、uding groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINand COUTmeasurement) shall be measured
33、only for the initial test and after process or design changes which may affect input capacitance. d. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life te
34、st conditions, method 1005 of MIL-STD-883. (1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,
35、 and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
36、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89694 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Gr
37、oup A subgroups Device types Limits Unit Min Max Output high voltage VOHVCC= 4.5 V, IOH= -5.2 mA, VIN= VIH, VIL1, 2, 3 All 2.4 V Output low voltage VOLVCC= 4.5 V, IOL= 16 mA, VIN= VIH, VIL1, 2, 3 All 0.45 V Input high voltage 2/ VIH1, 2, 3 All 2.0 V Input low voltage 2/ VIL1, 2, 3 All 0.8 V Input le
38、akage current IIXVIN= 5.5 V to GND 1, 2, 3 All -10 10 A Output leakage current IOZVOUT= 5.5 V to GND, VCC= 5.5 V 1, 2, 3 All -40 40 A Output short circuit current 3/ 4/ IOSVCC= 5.5 V, VOUT= GND 1, 2, 3 All -90 mA Operating supply current ICCVCC= 5.5 V, IOUT= 0 mA 1, 2, 3 All 70 mA 01 4 Input capacit
39、ance 4/ CINVI= 0.0 V, VCC= 5.5 V TA= +25C, f = 1 Mhz, (see 4.3.1c) 4 02 8 pF 01 7 Output capacitance 4/ COUTVO= 0 V, VCC= 5.5 V TA= +25C, f = 1 Mhz, (see 4.3.1c) 4 02 8 pF 01 25 Read cycle time tRC9, 10, 11 02 30 ns 01 15 Chip select to output valid tACS9, 10, 11 02 20 ns Chip select inactive to hig
40、h Z 4/ 5/ tHZCS9, 10, 11 All 15 ns Chip select active to low Z 4/ tLZCS9, 10, 11 All 15 ns Output hold from address change tOHASee figure 4 9, 10, 11 All 5 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC
41、ROCIRCUIT DRAWING SIZE A 5962-89694 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TC+125C 4.5 V VCC 5.5 V Group A subgroups Device types Limits Unit unl
42、ess otherwise specified Min Max Address access time tAASee figure 4 9, 10, 11 01 25 ns 02 30 Write cycle time tWC9, 10, 11 01 20 ns 02 30 Write enable active tHZWE9, 10, 11 All 20 ns to high Z 4/ 5/ Write enable inactive tLZWE9, 10, 11 All 20 ns to low Z 4/ Write enable inactive tAWE9, 10, 11 All 20
43、 ns to output valid Write enable pulse width tPWE9, 10, 11 All 20 ns Data setup to write end tSD9, 10, 11 All 20 ns Data hold from write end tHD9, 10, 11 All 0 ns Address setup to write tSA9, 10, 11 All 0 ns start Address hold from write tHA9, 10, 11 All 0 ns end 1/ AC tests are performed with input
44、 rise and fall times of 5 ns or less, timing references levels of 1.5 V, input pulse levels of 0 to 3.0 v, and the output load in figure 3, circuit a. 2/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included. 3/ Not more than 1 output s
45、hould be shorted at one time. Duration of the short circuit should not exceed 30 seconds. 4/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the limits specified in table I. 5/ Transition is measured at steady state high level
46、 -500 mV or steady state low level +500 mV on the output from 1.5 V level on the input with the load in figure 3, circuit b. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89694 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device types All Case outlines E, F X Y Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 A0CS WE D0O0D1O1GND O2D2O3D3A3A2A1VCC - - - - - - - - - - - -A0CS NC WE
