1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add RHA data and radiation features. Change ICCH, ICCL, tOSLH, and tOSHLlimits in table I. Add new output rise and fall time tests to table I. Modify figure 4 to include the new tRISEand tFALLtests. Update the boilerplate to remove classes B and
2、S, and to reflect the changes required by MIL-PRF-38535. Editorial changes throughout. - TVN 03-02-12 Thomas M. Hess B Add radiation hardness assurance level F. - jak 03-09-22 Thomas M. Hess C Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 10-03-25 Thomas M. Hess D Ad
3、d new device type 02 and SEP test limits in table IB. Add case outline X for device type 02 in section 1.2.4. Correct truth table in figure 2. - MAA 10-10-18 Thomas M. Hess REV SHET REV D D D D D SHEET 15 16 17 18 19 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11
4、12 13 14 PMIC N/A PREPARED BY Larry T. Gauder DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Thomas J. Ricciuti APPROVED BY Monica L. Poelki
5、ng MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 1-TO-8 MINIMUM SKEW CLOCK DRIVER, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-12-08 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-92174 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E378-10 Provided by IHSNot for ResaleNo reproduction or networking permitt
6、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92174 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes
7、Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the fol
8、lowing example: 5962 F 92174 01 V C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PR
9、F-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(
10、s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC2525 1-to-8 minimum skew clock driver 02 AC2525 Radiation hardness, 1-to-8 minimum skew clock driver 1.2.3 Device class designator. The device class designator is a single letter identifying the product a
11、ssurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case out
12、line(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack X CDFP3-F14 14 Flat pack2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead f
13、inish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92174 DLA LAND AND MARITIME
14、COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) for device type 01 . -0.5 V dc to +6.0 V dc Supply voltage range (VCC) for device type 02 . -0.5 V dc to +7.0 V dc Input voltage range (VIN) -0.5 V dc to VCC + 0
15、.5 V dc Output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input diode current (IIK) (-0.5 V VIN VCC+ 0.5 V) . 20 mA DC output diode current (IOK) (-0.5 V VOUT VCC+ 0.5 V) . 20 mA DC output current (IOUT) (per output pin) 50 mA DC VCCor GND current (ICC, IGND) (per pin) . 400 mA Maximum pow
16、er dissipation (PD) . 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 4/ 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC): For
17、device type 01 +3.0 V dc to +5.5 V dc For device type 02 +2.0 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMaximum low level input voltage (VIL): at VCC= 2.0 V dc (for device type 02 only) . 0.61 V dc at VCC= 3.0 V dc . 0.90 V dc at VCC= 3
18、.6 V dc . 1.08 V dc at VCC= 4.5 V dc . 1.35 V dc at VCC= 5.5 V dc . 1.65 V dc Minimum high level input voltage (VIH): at VCC= 2.0 V dc (for device type 02 only) . 1.4 V dc at VCC= 3.0 V dc . 2.10 V dc at VCC= 3.6 V dc . 2.52 V dc at VCC= 4.5 V dc . 3.15 V dc at VCC= 5.5 V dc . 3.85 V dc Case operati
19、ng temperature range (TC) . -55C to +125C Minimum Input edge rate (v/t) (VINfrom 30% to 70% of VCC) . 125 mV/ns Maximum high level output current (IOH): at VCC= 3.0 V dc and 3.6 V dc . -12 mA at VCC= 4.5 V dc and 5.5 V dc -24 mA Maximum low level output current (IOL): at VCC= 3.0 V dc and 3.6 V dc .
20、 +12 mA at VCC= 4.5 V dc and 5.5 V dc +24 mA 1.5 Radiation features. Device type 01: Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300 Krads (Si) No Single Event Latch-up (SEL) at effective LET 100 MeV-cm2/mg Device type 02: Maximum total dose available (dose rate = 50 300 rads (Si)/
21、s) 300 Krads (Si) No Single Event Latch-up (SEL) at effective LET 110 MeV-cm2/mg 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages ar
22、e referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with m
23、ethod 5004 of MIL-STD-883. 5/ Operation from 2.0 V dc to 3.0 V dc are provided for compatibility with data retention and battery back up systems. Data retention implies no input transitions and no stored data loss with the following conditions: VIH 70% of VCC, VIL 30% of VCC, VOH 70% of VCCat 20 A,
24、VOL 30% of VCCat 20 A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92174 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Governme
25、nt specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION
26、 MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micro
27、circuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications.
28、 The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event P
29、henomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of these documents are available online at http:/www.astm.org or from: ASTM International, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA 19428-2959.) ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No
30、. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. EIA/JEDEC Standard No. 78 - IC Latch-Up Test. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-
31、3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQU
32、IREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or fu
33、nction as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall
34、be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92174 DLA LAND AND MARITIME C
35、OLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on
36、 figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the man
37、ufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirr
38、adiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Ma
39、rking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RH
40、A product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for devic
41、e classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed man
42、ufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted
43、 to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
44、 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For devi
45、ce class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime
46、s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covere
47、d by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92174 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL
48、 D SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ 3/ -55C TC +125C 3.0 V VCC 5.5 V unless otherwise specified Device type and device class 4/ VCCGroup A subgroups Limits 5/ Unit Min Max High level output voltage 3006 VOH1For all inputs affecting output under test VIN= VIHor VILVIH= 2.10 V VIL= 0.90 V For all other inputs VIN= VCCor GND IOH= -50 A All All 3.0 V 1, 2, 3 2.9 V VOH2For all inputs affecting output under test VIN= VIHor VILVIH= 3.15 V VIL= 1.35 V For all other inputs VIN= VCCor GND I
