1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirments. Editorial changes throughout. - gap 10-04-20 Charles F. Saffle REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguy
2、en DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Thanh V. Nguyen APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ECL, 6-BIT
3、D-TYPE REGISTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-07-21 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-93104 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E060-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW
4、ING SIZE A 5962-93104 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V).
5、A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93104 01 M Y X Federal sto
6、ck class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with
7、the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Devi
8、ce type Generic number Circuit function 01 10E551 6-bit D type register 02 100E551 6-bit D-type register, temperature compensated 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documen
9、tation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and
10、as follows: Outline letter Descriptive designator Terminals Package style Y See figure 1 28 Quad flat package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction o
11、r networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93104 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VEE) 2/ -8.0 V dc to 0.0 V dc Input volta
12、ge range (VIN) 2/ . -6.0 V dc to 0.0 V dc Minimum input swing (VPP) 0.150 V dc Output current (IOUT): Continuous . 50 mA Surge 100 mA Storage temperature range . -65C to +165C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +165C Maximum power dissipation (PD): Device type 0
13、1 426 mW Device type 02 495 mW Thermal resistance, junction-to-case (JC) 1.23C/W 1.4 Recommended operating conditions. Supply voltage range (VEE): 2/ Device type 01 -5.46 V dc to -4.94 V dc Device type 02 -5.46 V dc to -4.20 V dc Input voltage range (VIN): 2/ Device type 01 -1.950 V dc to -0.660 V d
14、c Device type 02 -1.810 V dc to -0.880 V dc Output voltage range (VOUT): 2/ Device type 01 -1.972 V dc to -0.672 V dc Device type 02 -1.810 V dc to -0.880 V dc Input rise and fall times, 20% to 80% (tr, tf) . 500 ps maximum Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS
15、2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE S
16、PECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of S
17、tandard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above
18、 the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Ratings apply when referenced to VCC= 0.0 V dc. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
19、 IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93104 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this draw
20、ing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as speci
21、fied herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
22、class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outl
23、ine. The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.3 Logic diagram. The logic diagram shall be as specified on f
24、igure 4. 3.2.5 Test circuit and switching waveforms. Test circuit and switching waveforms shall be as specified on figure 5. 3.2.6 Inner-layer dielectric. Polyimide and silicon coatings are allowed as part of the wafer fabrication process provided that each microcircuit inspection lot (see MIL-PRF-3
25、8535, “Inspection lot class B”) shall be subjected to and pass the internal water vapor content test in accordance with group D6 of test method 5005 of MIL-STD-883. The frequency of the internal water vapor testing may not be decreased unless approved by the preparing activity. 3.3 Electrical perfor
26、mance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements.
27、 The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of
28、 the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Ma
29、rking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38
30、535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required
31、from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q a
32、nd V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A
33、shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing
34、. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93104 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics.
35、 Test Symbol Conditions -55C TC +125C Group A subgroupsDevice type Limits 1/ Unit Unless otherwise specifiedMin Max High level input voltage VIH -5.46 V VEE -4.94 V for type 01 -5.46 V VEE -4.20 V for type 02 1 2 3 01 -1.130 -1.020 -1.258 -0.810 -0.660 -0.906 V 1, 2, 3 02 -1.165 -0.880 Low level inp
36、ut voltage VIL 1, 2 01 -1.950 -1.950 -1.480 -1.421 V 1, 2, 3 02 -1.810 -1.475 High level output voltage VOH VCC= VCCO = GND VIN= VIHmaximum, VILminimum Outputs terminated through 50 to -2.0 V VEE= -4.94 V 1 2 3 01 -0.980 -0.862 -1.097 -0.810 -0.672 -0.906 V EE= -4.20 V 1, 2 3 02 -1.025 -1.097 -0.880
37、 -0.880 Low level output voltage VOL VEE= -5.46 V 1 2 3 01 -1.950 -1.934 -1.972 -1.630 -1.579 -1.652 V 1, 2 3 02 -1.810 -1.810 -1.620 -1.600 High level threshold output voltage VOHT VCC= VCCO = GND VIN= VIHmaximum, VILminimum Outputs terminated through 50 to -2.0 V VEE= -5.46 V 1 2 3 01 -0.980 -0.86
38、2 -1.097 -0.810 -0.672 -0.906 V 1, 2 3 02-1.025 -1.097 -0.880 -0.880 Low level threshold output voltage VOLT VEE= -4.94 V 1 2 3 01 -1.950 -1.934 -1.972 -1.630 -1.579 -1.652 V EE= -4.20 V 1, 2 3 02-1.810 -1.810 -1.620 -1.600 Power supply drain current IEEVCC= VCCO = GND, VEE= -5.46 V VIN= VIHmaximum
39、Outputs terminated through 50 to 2.0 V 1, 2, 3 01 -78 mA 1, 3 2 02-78 -90 High level input current IIH VCC= VCCO = GND VEE= -4.94 V for type 01 = -4.20 V for type 02 VIN= VIHmaximum, VILminimum Outputs terminated through 50 to 2.0 V 1, 2, 3 01 10 150 A 02 10 200 See footnotes at end of table. Provid
40、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93104 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - contin
41、ued Test Symbol Conditions -55C TC +125C Unless otherwise specified Group A subgroupsDevice type Limits 1/ Unit Min Max Low level input current IIL VCC= VCCO = GND, VEE= -5.46 V VIN= VIHmaximum, VILminimum Outputs terminated through 50 to -2.0 V 1, 2, 3 All .05 AFunctional test See 4.4.1b, VCC= VCCO
42、= GND VEE= -4.94 V, -5.46 V for type 01 = -4.20 V, -5.46 V for type 02 7, 8 All Maximum toggle frequency fMAXSee figure 5 9, 10, 11 All 1100 MHZ Propagation delay time, CLK to Qn or Q%n tPLH1, tPHL1 9 10 11 01 485 755 315 810 1165 625 ps 10 11 02 450 475 375 825 875 800 Propagation delay time, MR to
43、 Qn or Q%n tPLH2, tPHL2 9 10 11 01 550 815 315 795 1145 610 ps 10 11 02 450 550 375 875 900 725 Setup time, CLK or MR to Dn tSU9, 11 10 01 0 250 ps 9, 10, 11 02 0 Hold time, CLK or MR to Dn th9, 1110 01 350 650 ps 1110 02 350 400 Reset recovery time trr9, 10, 11 All 750 ps Minimum pulse width, CLK o
44、r MR tPW 9, 10, 11 All 400 ps Output transition time tTLH, tTHL9, 10, 11 All 275 725 ps 1/ The limits are determined after a device has reached thermal equilibrium. This is defined as the reading taken with the device in a socket with 500 LFPM of +125C or -55C (as applicable) air blowing on the unit
45、 in a transverse direction with power applied for at least four minutes before the reading is taken. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93104 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3
46、990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Case Y Dimension Millimeters Inches Min Max Min Max D1/E1 8.89 10.16 .350 .400 A 1.52 2.03 .060 .080 b 0.36 0.48 .014 .019 e 1.27 BSC .050 BSC Q 0.89 1.09 .035 .043 c 0.10 0.18 .004 .007 L 7.49 8.38 .295 .330 D/E 23.88 25.65 .940 1.010 NOTES: 1. The
47、 preferred unit of measurement is millimeters. However, this item was designed using inch-pound units of measurement. In case problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Dimensions D1 and E1 allow for lid misalignment and glass meniscus.
48、3. Dimension Q shall be measured at the point of exit of the lead from the body. 4. Lead number 1 is identified by a tab located on the lead. 5. Dimension c includes solder lead finish. 6. Lead numbers are shown for reference only and do not appear on package. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93104 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSC
