1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add devices 03 and 04. Editorial changes throughout. 96-05-09 Monica L. Poelking B Changes in accordance with NOR 5962-R220-97. 97-03-07 Monica L. Poelking C Changes in accordance with NOR 5962-R297-97. 97-05-21 Monica L. Poelking D Add radiation
2、 features to paragraph 1.4 for device types 03 and 04. LTG 97-12-08 Monica L. Poelking E Changes in accordance with NOR 5962-R062-99. TVN 99-05-06 Monica L. Poelking F Correct dimensions for case outline Z in figure 1. Add radiation exposure connections for case outline Z in figure 5. Update boilerp
3、late to the requirements of MIL-PRF-38535. Editorial changes throughout. TVN 01-07-23 Thomas M. Hess G Add table IIB, Burn-in delta parameters. CFS 03-10-21 Thomas M. Hess H Correct generic part number for device type 03. Update boilerplate to MIL-PRF-38535 requirements. CFS 06-05-02 Thomas M. Hess
4、REV SHET REV H H H H H H H H H H H H H H H SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 REV H H H H H H H H H H H H H H REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Christopher A. Rauch CHECKED BY Thomas M. Hess DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO
5、43218-3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 94-05-02 MICROCIRCUIT, DIGITAL, BIPOLAR, DUAL CHANNEL, BUS TRANSCEIVER, MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-93226 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND A
6、GENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL H SHEET 1 OF 29 DSCC FORM 2233 APR 97 5962-E429-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-93226 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O
7、HIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and ar
8、e reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 H 93226 01 Q X X Federal RHA Device Device Case Lead stock class designator type class outl
9、ine finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked de
10、vices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 UT63M147 +5.0 V,
11、dual channel bus transceiver (low idle) 1/ 02 UT63M149 +5.0 V, dual channel bus transceiver (high idle) 2/ 03 UT63M147 +5.0 V, dual channel bus transceiver (low idle) 1/ 04 UT63M145 +5.0 V, dual channel bus transceiver (low idle) 1/ 1.2.3 Device class designator. The device class designator is a sin
12、gle letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualifica
13、tion to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 36 Dual-in-line package Z See figure 1 24 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MI
14、L-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. _ 1/ Idle low: TXIN, TXIN , RXOUT, RXOUT are at logic 0. 2/ Idle high: TXIN, TXIN , RXOUT, RXOUT are at logic 1.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SI
15、ZE A 5962-93226 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range . -0.3 V dc to +7.0 V dc Input voltage range (receiver) 10 VPPLogic input voltage range. -0.3 V
16、dc to +5.5 V dc Receiver common mode input voltage range. -5.0 V to +5.0 V Outpur current (transmitter) . 1.0 A Power dissipation, 100% duty cycle per channel: 2/ Device types 01, 02 2.21 W Device types 03, 04 3.6 W Storage temperature range -65C to +150C Thermal impedance, junction-to-case (JC): De
17、vice types 01, 02 4.5C/W Device types 03, 04 6.0C/W Maximum junction temperature (TJ): Device types 01, 02 125C Device types 03, 04 175C 1.4 Recommended operating conditions. Supply voltage range (VCC): Device types 01, 02 +4.75 V dc to +5.25 V dc Device types 03, 04 +4.5 V dc to +5.5 V dc Logic inp
18、ut voltage range. 0.0 V dc to +5.0 V dc Receiver differential voltage. 8.0 VPPReceiver common mode voltage range . 4.0 V dc Driver peak output current: Device types 01, 02 700 mA Device types 03, 04 600 mA Serial data rate: Device types 01, 02 0 to 1 MHz Device types 03, 04 300 KHz to 1 MHz Case ope
19、rating temperature range (TC). -55C to +125C Radiation features: Total dose 1 x 106rads(Si) Single event phenomenon (SEP) effective LET, no upsets or latchup (see 4.4.4.5) 35 MeV/(mg/cm2) Dose rate upset (20 ns pulse) 3/ Dose rate latchup. 3/ Dose rate survivability 3/ Neutron irradiated 1 x 10141.5
20、 Digital logic testing for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) 100 percent 4/ _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade per
21、formance and affect reliability. 2/ VCC= 5.0 V, TC= +25C. 3/ When characterized as a result of the procuring activities request, the condition will be specified. 4/ Fault coverage is for digital circuits only. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
22、IHS-,-,-SIZE A 5962-93226 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
23、 part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE ST
24、ANDARDS MIL-STD-883 - Test Method Standard Microelectronics. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. MIL-STD-1553 - Aircraft Internal Time Division Command/Response Multiplex Databus. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings.
25、 MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preceden
26、ce. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requiremen
27、ts. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.
28、The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document. 3.2 Design, construction, and physi
29、cal dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 and figure 1 herein. 3.2
30、.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Timing waveforms. The timing waveforms shall be as specified on figures 4. 3.2.5 Radiation exposure connections. The radiation exposure
31、 connections shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the fu
32、ll case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
33、from IHS-,-,-SIZE A 5962-93226 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For pac
34、kages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance
35、with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as
36、required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of complia
37、nce shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets,
38、for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-
39、PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change tha
40、t affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option
41、 of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 132 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A
42、5962-93226 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Limits Test Symbol Test conditions 1/ 2/ -55C TC +125C unless otherwise specified Device type Group A sub
43、groups Min Max Unit 01, 02 0.65 Input low voltage, RXEN, TXIHB, TXIN, TXIN VIL03, 04 1, 2, 3 0.8 Input high voltage, RXEN, TXIHB, TXIN, TXIN VIHAll 1, 2, 3 2.0 V 01, 02 0.65 Output low voltage, RXOUT, RXOUT VOLIOL= 4 mA 03, 04 1, 2, 3 0.55 01, 02 2.4 Output high voltage, RXOUT, RXOUT VOHIOH= 0.4 mA
44、03, 04 1, 2, 3 2.4 01, 02 -1.1 Input low current, RXEN, TXIHB, TXIN, TXIN IILVIL= 0.4 V 03, 04 1, 2, 3 -0.1 mA Input high current, RXEN, TXIHB, TXIN, TXIN IIHVIH= 2.7 V All 1, 2, 3 -40 40 A Transmitter inhibit input current, TXIHB IIIHVIH= 2.7 V 01, 02 1, 2, 3 100 A 0% duty cycle (non-trans.) 55 25%
45、 duty cycle (f = 1 MHz) 300 50% duty cycle (f = 1 MHz) 500 87.5% duty cycle (f = 1 MHz) 800 100% duty cycle (f = 500 KHz) 01, 02 1, 2, 3 800 3/ mA 0% duty cycle (non-trans.) 22 25% duty cycle (f = 1 MHz) 200 50% duty cycle (f = 1 MHz) 380 87.5% duty cycle (f = 1 MHz) 650 VCCsupply current ICC100% du
46、ty cycle (f = 1 MHz) 03, 04 1, 2, 3 740 3/ mA Functional tests See 4.4.1b All 7, 8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-93226 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,
47、 OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics - Continued. Limits Test Symbol Test conditions 1/ 2/ -55C TC +125C unless otherwise specified Devicetype Group A subgroups Min Max Unit 4/ RECEIVER Input capacitance, RXEN, TXIHB, TXIN,
48、TXIN CINf = 1 MHz sine wave See 4.4.1c All 4, 5, 6 15 pF Common mode input voltage 3/ VICf = 1 MHz, direct-coupled stub; input 1.2 VPP200 ns rise/fall 25 ns All 4, 5, 6 -5.0 5.0 V VTH13/ f = 1 MHz, transformer couples stub; 200 ns rise/fall at (receiver output 0 to 1 transition) 0.20 Input threshold voltage (no response) VTH2f = 1 MHz, direct-coupled stub; 200 ns rise/fall at (receiver output 0 to 1 transition) All 4, 5, 6 0.28 VPP, L-L VTH33/ f = 1 MHz, transformer couples stub; 200 ns rise/fall at (receiver output 0 to 1
