1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Redraw. Update drawing to current requirements. drw 09-10-08 Charles F. Saffle REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Sandra Rooney DEFENSE SUPPLY CENTER COLUMBUS COLUMB
2、US, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Sandra Rooney APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, 12-BIT 2 MHZ A/D CONVERTER, MONOLITHIC SILICON DRAWING AP
3、PROVAL DATE 94-11-04 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-95519 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E460-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95519 DEFENSE SUPPLY CENTER CO
4、LUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes ar
5、e available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95519 01 M L A Federal stock class designator RHA designator (see 1.2.1)
6、 Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class
7、M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 AD671S
8、D-500 12-bit A/D converter, 2 MHz, 500 ns conversion time 02 AD671SD-750 12-bit A/D converter, 2 MHz, 750 ns conversion time 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentatio
9、n M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outl
10、ine letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networkin
11、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ VCCto ACOM . -0.5 V dc to +6.5 V dc VEEto ACOM -6.5 V dc to +0.5 V dc VLOG
12、ICto DCOM . -0.5 V dc to +6.5 V dc ACOM to DCOM -1 V dc to +1 V dc VCCto VLOGIC-6.5 V dc to +6.5 V dc ENCODE to DCOM -0.5 V dc to VLOGIC+ 0.5 V dc REF IN to ACOM . -0.5 V dc to VCC+ 0.5 V dc AIN, BPO/UPO to ACOM . -6.5 V dc to +11 V dc Power dissipation (PD) . 1000 mW Junction temperature . 175C Sto
13、rage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . 25C/W Thermal resistance, junction-to-ambient (JA) 80C/W 1.4 Recommended operating conditions. Ambient operating temperature range -55C to +125C Positive operating voltag
14、e range 4.75 V dc to 5.25 V dc Negative operating voltage range -5.25 V dc to -4.75 V dc Logic operating voltage range +4.5 V dc to +5.5 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this draw
15、ing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-88
16、3 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:
17、/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes prece
18、dence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect re
19、liability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements.
20、The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The
21、individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535
22、 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance charact
23、eristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The elect
24、rical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entir
25、e SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for
26、device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appen
27、dix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a man
28、ufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the
29、requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be p
30、rovided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Veri
31、fication and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcirc
32、uit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 93 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962
33、-95519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max Resolution RES 1, 2, 3 A
34、ll 12 Bits Integral nonlinearity INL All codes histogram test 1, 2, 3 01 4 LSB 02 2.5 Differential nonlinearity DNL All codes histogram test 1, 2, 3 01 10 Bits 02 11 Unipolar offset error OSE 5 V, 10 V span, TA= +25C 1 All 4 LSB Unipolar offset drift TCVOS5 V, 10 V span 2, 3 All 10 ppm/CGain error A
35、E Unipolar and bipolar 1 All 0.25 %FSR Gain drift TCAUnipolar and bipolar 1, 2, 3 All 20 ppm/CBipolar zero BPOE5 V mode 1 All 10 LSB Bipolar zero drift TCBPO5 V mode 1 All 15 ppm/CInput resistance 2/ RIN5 V range 4 All 0.5 1.0 k 10 V range 1.0 2.0 Reference input resistance 2/ RREF4 All 2.4 4.7 k In
36、put capacitance 2/ CIN4 All 10 pF Power dissipation PD4, 5, 6 All 621 mW Positive supply current ICC1, 2, 3 All 56 mA Negative supply current IEE1, 2, 3 All -56 mA Logic supply current ILOGIC1, 2, 3 All 6 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking pe
37、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55C TA+125C Group A sub
38、groups Device type Limits Unit unless otherwise specified Min Max High level input voltage VIHEncode input 1, 2, 3 All 2 V Low level input voltage VILEncode input 1, 2, 3 All 0.8 V High level input current IIHVIN= VLOGIC, Encode input 1, 2, 3 All -10 +10 A Low level input current IILVIN= 0 V, Encode
39、 input 1, 2, 3 All -10 +10 A High level output voltage VOHIOH= 500 A 1, 2, 3 All 2.4 V Low level output voltage VOLIOL= -1.6 mA 1, 2, 3 All 0.4 V Conversion time tCSee figure 2 9, 10, 11 01 500 ns 02 750 Encode width high (short encode) tENCSee figure 2 9, 10, 11 01 30 ns 02 50 Encode width low 2/ (
40、long encode) tENCLSee figure 2 9 All 20 ns DAV pulse width tDAVSee figure 2 9, 10, 11 01 75 200 ns 02 75 300 Encode falling edge delay 2/ tFSee figure 2 9 All 0 ns Start new conversion delay 2/ tRSee figure 2 9 All 0 ns Data update delay from DAV tDDSee figure 2 9, 10, 11 All 20 ns Data update delay
41、 from DAV tSSSee figure 2 9, 10, 11 All 20 ns 1/ VCC= +5 V 5%, VLOGIC= +5 V 10%, VEE= -5 V 5%, VREF= +5 V. 2/ Guaranteed if not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95519 DEFENSE SUPPLY CEN
42、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline L Terminal number Terminal symbol 1 BIT 12 (LSB) 2 BIT 11 3 BIT 10 4 BIT 9 5 BIT 8 6 BIT 7 7 BIT 6 8 BIT 5 9 BIT 4 10 BIT 3 11 BIT 2 12 BIT 1 (MSB) 13 MSB 14 OTR 15 DAV 16 ENCODE 17 VLOG
43、IC18 DCOM 19 REF IN 20 AIN 21 BPO/UPO 22 ACOM 23 VCC24 VEEFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO
44、N LEVEL A SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. Timing waveforms. Encode pulse HIGH Encode pulse LOW Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218
45、-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the
46、QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducte
47、d on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in
48、 test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test para
