1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R092-96. 96-04-04 M. A. FRYE B Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. Redrawn. -rrp 10-01-26 C. SAFFLE REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3
2、4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL FRYE MICROCIRCUIT, LINEAR, VIDEO DIFFEREN
3、CE AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-02-02 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96700 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E290-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license
4、from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96700 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) a
5、nd space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following exa
6、mple: 5962 - 96700 01 M P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535
7、 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) iden
8、tify the circuit function as follows: Device type Generic number Circuit function 01 LT1193 Video difference amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Ve
9、ndor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
10、 Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or network
11、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96700 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Total supply voltage (+VS) 18 V Differential input voltage . 6 V Input v
12、oltage (VIN) . VSOutput short circuit duration Continuous Power dissipation (PD) 250 mW Operating junction temperature range (TJ) . -55C to +150C Storage temperature range . -65C to +150C Junction temperature (TJ) . +150C Lead temperature (soldering 10 seconds) +300C Thermal resistance, junction-to-
13、case (JC): . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) . 100C/W 1.4 Recommended operating conditions. Total supply voltage (+VS) 5 V Operating ambient temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The follow
14、ing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, G
15、eneral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircui
16、t Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing
17、and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended op
18、eration at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96700 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SH
19、EET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan sh
20、all not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construct
21、ion, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections sh
22、all be as specified on figure 1. 3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full ambient ope
23、rating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufact
24、urers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device cl
25、asses Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark
26、for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For dev
27、ice class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm t
28、hat the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PR
29、F-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this d
30、rawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be
31、 made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted
32、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96700 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group
33、A subgroups Device type Limits Unit Min Max Input offset voltage VOS1/ 2, 3 01 16 mV Both inputs 2/ 3/ 1 12 Both inputs 3/ 4/ 1 15 Input offset current IOS1/ 2, 3 01 5.0 A Either inputs 2/ 1 3.0 Either inputs 4/ 1 3.0 Input bias current -IIB1/ 2, 3 01 -5.5 5.5 A Either inputs 2/ 1 -3.5 3.5 Either in
34、puts 4/ 1 -3.5 +IIB1/ 2, 3 -5.5 +5.5 Either inputs 2/ 1 -3.5 +3.5 Either inputs 4/ 2, 3 +3.5 Input voltage range VIN1/ 2, 3 01 -2.5 +3.5 V 2/ 1 -2.5 +3.5 4/ 1 +2.0 +3.5 Common mode rejection ratio CMRR VCM= -2.5 V to +3.5 V 1/ 2, 3 01 53 dB VCM= -2.5 V to +3.5 V 2/ 1 60 VCM= +2.0 V to +3.5 V 4/ 1 53
35、 Power supply rejection ratio PSRR VS= 2.375 V to 5.0 V 1/ 2, 3 01 53 dB VS= 2.375 V to 5.0 V 2/ 1 60 Output voltage swing VOUTRL= 1 k 1/ 2, 3 01 3.6 V RL= 1 k 2/ 1 3.8 VS= 8 V, RL= 100 1/ 2, 3 6.0 VS= 8 V, RL= 1 k 2/ 1 6.8 VS= 8 V, RL= 100 1/ 1 6.4 VOUThigh, RL= 100 to GND 1 3.6 VOUTlow, RL= 100 to
36、 GND 1 0.4 Supply current IS1/ 2, 3 01 43 mA 2/ 1 43 4/ 1 43 Shutdown supply current ISSDSHUTDOWN pin at VS1/ 2, 3 01 2.2 mA SHUTDOWN pin at VS2/ 1 2.0 SHUTDOWN pin at VS4/ 5/ 1 2.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
37、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96700 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgro
38、ups Device type Limits Unit Min Max Gain error GE VOUT= 3 V, RL= 1 K 1/ 5, 6 01 1.2 % VOUT= 3 V, RL= 1 K 2/ 4 1.0 RL= 100 2/ 4 1.2 Slew rate SR VOUT= 2 V, RL= 300 , 1 V input step, AV= +3 4 01 350 V/s Full power bandwidth FPBW VOUT = 6 VP-P6/ 4 01 18.5 MHz Rise and fall time tR, tFVOUT= 1.5 V, AV= +
39、50, 2/ Measured at 20% and 80% points 9 01 110 210 ns 1/ Unless otherwise specified, VS= 5 V, VREF= 0 V, feedback one resistance (RFB1) = 900 from negative FEEDBACK to OUTPUT and +VSpins, feedback resistance two (RFB2) = 100 from negative FEEDBACK pin to ground, RL= RFB2= 1 k, CL 10 pF, and S/D pin
40、is open. When RL= 1 k is specified, the load resistor is RFB1+ RFB2, but when RL= 100 is specified, then an additional 100 is added to the output. 2/ Unless otherwise specified, VS= 5 V, VREF= 0 V, feedback one resistance (RFB1) = 900 from negative FEEDBACK to OUTPUT and +VSpins, feedback resistance
41、 two (RFB2) = 100 from negative FEEDBACK pin to ground, RL= RFB1+ RFB2= 1 k, CL 10 pF, and S/D pin is open. When RL= 1 k is specified, the load resistor is RFB1+ RFB2, but when RL = 100 is specified, then an additional 100 is added to the output. 3/ Input offset voltage measured at the OUTPUT pin is
42、 the contribution from both input pair, and is input referred. 4/ Unless otherwise specified, +VS= +5 V, -VS= 0 V, VREF= +2.5 V, feedback one resistance (RFB1) = 900 from negative FEEDBACK to OUTPUT and +VSpins, feedback resistance two (RFB2) = 100 from negative FEEDBACK pin to ground, RL= RFB1+ RFB
43、2= 1 k, CL 10 pF, and S/D pin is open. When RL= 1 k is specified, the load resistor is RFB1+ RFB2, but when RL= 100 is specified, then an additional 100 is added to the output. 5/ Do not operate the shutdown above TJ +125C. 6/ Full power bandwidth is calculated from the slew rate measurement of slew
44、 rate/(2 x x VPP). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96700 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline P T
45、erminal number Terminal symbol 1 REFERENCE 2 -INPUT 3 +INPUT 4 -VS5 SHUTDOWN (S/D) 6 OUTPUT 7 +VS8 -FEEDBACK FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96700 DEFENSE SUPPL
46、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Manageme
47、nt (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance wit
48、h MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, o
