1、Cu Cu I a) t t I w 0 EIA 448-22 90 W 3234600 0069075 2 W ANSVEIA-448-22-1990 APPROVED: November 19, 1990 EIA STANDARD Resistance to Soldering Heat, Soldering Method EIA-448-22 NOVEMBER 1990 ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT EIA 448-22 90 3234600 O069076 4 # NOTICE EIA Engineer
2、ing Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper produ
3、ct for his particular need, Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude thei
4、r voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by EIA without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, EIA
5、 does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Recommended Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity ha
6、s not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to
7、establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. e (From Standards Proposal No. 2381 formulated under the cognizance of the EIA P-13 Committee on Switches.) COPYRIGHT 1990 Published by ELECTRONIC INDUSTRIES ASSOCIATION Eng
8、ineering Department 2001 Pennsylvania Ave. N.W., Washington, D.C. 20006 PRICE: Please refer to the current Catalog of EIA & JEDEC STANDARDS & ENGINEERING PUBLICATIONS or call the EL4 STANDARDS SALES DEPARTMENT (202/457-4966) All rights reserved Printed in U.S.A. I EIA 448-22 90 W 3234b00 00b9077 b W
9、 EIA-448-22 Page 1 Resistance to Soldering Heat Soldering Iron Method 1.0 Purpose This test is performed for the purpose of determining whether switches can withstand the heating effects of soldering to their terminations using a soldering iron. Heat is conducted through the termination into the swi
10、tch, or radiant heat from the iron in close proximity to the switch body, or both. The heat of soldering may affect the electrical characteristics of the switch and may cause damage to the materials from which it is made, e.g., loosening of terminations, softening or distortion of insulation materia
11、ls, weakening of mechan- ical joints, etc. 2. O Apparatus Unless otherwise stated, a soldering iron rated for 25 watts with a wedge tip shall be used. Other wattage ratings and tip types may be specified if required by termination size, accessibility of the termination, etc. 3.0 Materials 3.1 Solder
12、 & Flux Unless otherwise specified the solder shall be lead-tin alloy with a nominal tin content of 50, to 70 percent. It will be in the form of flux cored solder wire of no more than 0.062 inch nominal outside diameter, with an RA flux core which occupies approximately 33% of the solder cross-secti
13、onal area. 4.0 Test Procedure The test shall be performed on all of the solder terminations of the switch unless otherwise specified in the switch specification. 4.1 Procedure a. The applicable wire size properly prepared for the solder eye size shall be inserted in the appropriate manner. If the sw
14、itch terminals are of the wraparound type, the wire shall be wound around the applicable portion of the terminal a minimum of one complete turn. b. The soldering iron shall be heated to 36OOC f 10C unless otherwise specified in the switch specification. The time of application shall be 4 to 5 second
15、s during which the solder shall also be applied in an amount commensurate with good soldering technique, c. The soldering iron and the solder shall be applied to that portion of the terminal that is intended to receive the connecting wire and is closest to the switch housing. i -= - EIA 448-22 90 m
16、3234600 00b907 m EIA-448-22 Page 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 d. When required by the detail specification, a force shall be applied to the terminal via the soldering iron in a specified amount and direction. e. Remove the soldering iron and perform a visual inspection at 7X. f. There shall be
17、no distortion or damage to any part of the switch housing, fracture, loosening of parts, or any other mechanical failure of the switch. A movement within the confines of the terminal anchoring device will be permittted provided continuity of electrical contact is not impaired. If any movement of the
18、 terminal is noted, the switch shall be tested to verify that it meets the requirement for dielectric with- standing voltage with the terminal positioned in a manner most likely to cause failure. Details to be specified. Number of samples to be tested and allowable quality level. Soldering iron watt
19、age rating if other than 25 watts. Soldering iron tip type if other than wedge shape. Solder and flux if other than as,specified in 3.1. Number of terminals to be tested if less than all of the terminations. Soldering iron temperature if other than 360C ?: 10C. Amount and direction of force to be applied to the terminal, when required by the detail specification. !
