1、BRITISH STANDARDBS EN 60512-12-4: 2006Incorporating corrigendum no. 1Connectors for electronic equipment Tests and measurements Part 12-4: Soldering tests Test 12d: Resistance to soldering heat, solder bath methodThe European Standard EN 60512-12-4:2006 has the status of a British StandardICS 31.220
2、.10g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 60512-12-4:2006This British Standard was published under the authority of the Standards Pol
3、icy and Strategy Committee on 28 April 2006 BSI 2007ISBN 0 580 48117 4National forewordThis British Standard was published by BSI. It is the UK implementation of EN 60512-12-4:2006, incorporating corrigendum December 2006. It is identical with IEC 60512-12-4:2006. The UK participation in its prepara
4、tion was entrusted to Technical Committee EPL/48, Electromechanical components and mechanical structures for electronic equipment. A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisio
5、ns of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations.Amendments issued since publicationAmd. No. Date Comments16984 Corrigendum No. 130 March 2007 Addition of Annex ZAEUROPEAN STANDARD EN 60512-12-4NORME
6、 EUROPENNE EUROPISCHE NORM March 2006 CENELECEuropean Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation i
7、n any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60512-12-4:2006 E ICS 31.220.10 English version Connectors for electronic equipment - Tests and measurements Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006)Co
8、nnecteurs pour quipements lectroniques - Essais et mesures Partie 12-4: Essais de soudure - Essai 12d: Rsistance la chaleur de soudage, mthode de bain de brasage(CEI 60512-12-4:2006) Steckverbinder fr elektronische Einrichtungen - Mess- und Prfverfahren Teil 12-4: Prfungen der Ltbarkeit - Prfung 12d
9、: Ltwrmebestndigkeit, Ltbadverfahren (IEC 60512-12-4:2006) This European Standard was approved by CENELEC on 2006-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard wi
10、thout any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other lang
11、uage made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Est
12、onia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Incorporating corrigendum December 2006Foreword The text of docum
13、ent 48B/1579/FDIS, future edition 1 of IEC 60512-12-4, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60512-12-4 on 2006-03-01. This standa
14、rd is to be read in conjunction with EN 60512-1 and EN 60512-1-100 which explains the structure of the EN 60512 series. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2006-12
15、-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-03-01 _ Endorsement notice The text of the International Standard IEC 60512-12-4:2006 was approved by CENELEC as a European Standard without any modification. _ EN 60512-12-4:2006 2 Annex ZA has b
16、een added by CENELEC. 3 EN 60512-12-4:2006CONNECTORS FOR ELECTRONIC EQUIPMENT TESTS AND MEASUREMENTS Part 12-4: Soldering tests Test 12d: Resistance to soldering heat,solder bath method 1 Scope and object This part of IEC 60512, when required by the detail specification, is used for testing connecto
17、rs within the scope of IEC technical committee 48. It may also be used for similar devices when specified in a detail specification. The object of this part of IEC 60512 is to detail a standard test method to assess the ability of a connector to withstand the heating stresses produced by a mass sold
18、ering operation. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068
19、-2-20:1979, Basic environmental testing procedures Part 2 Tests. Test T: SolderingIEC 60512-1-1, Connectors for electronic equipment Tests and measurements Part 1-1: General examination Test 1a: Visual examination3 Preparations 3.1 General A solder bath at 260 C, as described in 5.4 of IEC 60068-2-2
20、0, shall be prepared. NOTE The development of lead-free solder may necessitate the use of higher temperatures. Reference to IEC 60068-2-58 is recommended. If required by the detail specification, a thermal screen, as described in 5.4.3 of IEC 60068-2-20, shall be provided. Alternatively, if required
21、 by the detail specification, a heat sink shall be used. This will consist of a single or double-sided printed circuit board of 1,6 mm thickness, with 35 m conductive copper tracks. The conductive pattern shall consist of evenly distributed conductors, which cover 50 % 10 % of each side of the print
22、ed board. The hole pattern shall correspond to the connector specification requirements. The length and width of the printed board shall be such that the contour (plan view) of the specimen is exceeded by 15 mm minimum in all directions. 3.2 Preparation of specimen The specimen shall consist of a co
23、nnector with its terminations. As given in the connector detail specification, a screen of thermally insulating material, or a heat sink shall be used. EN 60512-12-4:2006 4 Unless otherwise specified in the detail specification, the terminations shall not be cleaned or degreased prior to the applica
24、tion of the solderability test.NOTE Care should be taken not to touch or otherwise contaminate the terminations to be tested. 3.3 Conditioning If accelerated ageing before testing is to be applied, one of the ageing procedures detailed in 4.5 of IEC 60068-2-20 shall be prescribed in the detail speci
25、fication. Ageing time 16 h at 155 C (Method 3 according to 4.5.3 of IEC 60068-2-20) shall be used, unless otherwise stated in the detail specification. 4 Method 4.1 Procedure The test shall be carried out in accordance with IEC 60068-2-20: Test Tb: Resistance of components to soldering heat: 5.4 Met
26、hod 1A: Solder bath at 260 C. Where a thermal screen is to be used, the terminations shall be immersed so that the thermal screen nearly touches the surface of the solder bath. Where a heat sink is used it shall just touch the surface of the solder bath. Immersion time shall be (5 1) s or (10 1) s,
27、as specified in the detail specification. 4.2 Measurements 4.2.1 Initial measurements Visual examination according to IEC 60512-1-1 shall be done. There shall be no defects which would impair the validity of the test. 4.2.2 Final measurements Visual examination according to IEC 60512-1-1 shall be do
28、ne with 10u magnification. There shall be no defects, which would impair the normal functioning of the connector. 4.2.3 Special attention Special attention shall be given to shroud dimensions for printed board connectors that could impair the mating, blind mating, and contact retention functions. 5
29、Details to be specified When this test is required by a detail specification, the following shall be given therein: a) pre-ageing requirements, if other than those specified in 3.3; b) if a thermal screen or heat sink is to be used; c) immersion time; d) any deviation from the above test method. 5 E
30、N 60512-12-4:2006Bibliography IEC 60068-2-58, Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) _EN 60512-12-4:2006 6 Annex ZA (normative) Normative references to internat
31、ional publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amen
32、dments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-2-20 + A2 1979 1987 Environmental testing Part 2: Tests - Test T: Soldering HD 323.2.20 S31988 IEC 60512-1-1
33、-1)Connectors for electronic equipment - Tests and measurements Part 1-1: General examination - Test 1a: Visual examination EN 60512-1-1 20022)_ 1)Undated reference. 2)Valid edition at date of issue. blankBS EN 60512-12-4:2006BSI389 Chiswick High RoadLondonW4 4ALBSI British Standards InstitutionBSI
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