1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06Printed board assembliesPart 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017)BS EN 61191-2:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61191-2 October 2017
2、ICS 31.190; 31.240 Supersedes EN 61191-2:2013 English Version Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017) Ensembles de cartes imprimes - Partie 2: Spcification intermdiaire - Exigences relatives lassemblage par br
3、asage pour montage en surface (IEC 61191-2:2017) Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an geltete Baugruppen in Oberflchenmontage (IEC 61191-2:2017) This European Standard was approved by CENELEC on 2017-06-27. CENELEC members are bound to comply with th
4、e CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Managemen
5、t Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same
6、 status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lith
7、uania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrot
8、echnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61191-2:2017 E National forewordThis British Standard is the UK implementation of EN 611912:2017
9、. It is identical to IEC 611912:2017. It supersedes BS EN 611912:2013, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained on request to its secre
10、tary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 91194 1ICS 31.190; 31.240Compliance with a British Standard ca
11、nnot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 611912:2017EUROPEAN STANDARD NORME EUROPENNE EUR
12、OPISCHE NORM EN 61191-2 October 2017 ICS 31.190; 31.240 Supersedes EN 61191-2:2013 English Version Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017) Ensembles de cartes imprimes - Partie 2: Spcification intermdiaire - E
13、xigences relatives lassemblage par brasage pour montage en surface (IEC 61191-2:2017) Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an geltete Baugruppen in Oberflchenmontage (IEC 61191-2:2017) This European Standard was approved by CENELEC on 2017-06-27. CENELE
14、C members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on app
15、lication to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-C
16、ENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary,
17、Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotech
18、nique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61191-2:2017 E BS EN 611912:2017EN 61191-2:2017 2 European
19、foreword The text of document 91/1386/CDV, future edition 3 of IEC 61191-2, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61191-2:2017. The following dates are fixed: latest date by which the document has to be im
20、plemented at national level by publication of an identical national standard or by endorsement (dop) 2018-04-13 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-10-13 This document supersedes EN 61191-2:2013. Attention is drawn to the possibil
21、ity that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61191-2:2017 was approved by CENELEC as a European Standard without a
22、ny modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58. IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1. IEC 61188-5-2 NOTE Harmonized
23、 as EN 61188-5-2. IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3. IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4. IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5. IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6. IEC 61188-7 NOTE Harmonized as EN 61188-7. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 6119
24、0-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61193-1 NOTE Harmonized as EN 61193-1. IEC 61193-3 NOTE Harmonized as EN 61193-3. IEC 62326-1 NOTE Harmonized as EN 62326-1. IEC 62326-4 NOTE Harmonized as EN 62326-4. IEC 62326-4-1 NOTE Harmonized as EN 62326-4-1. ISO 9001 NOTE Harmonized as EN ISO 9001. B
25、S EN 611912:2017EN 61191-2:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For
26、dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-t
27、o-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 61191-1 - Printed board assemblies - Part 1:
28、 Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies EN 61191-1 - IPC-A-610 - Acceptability of Electronics Assemblies - - BS EN 611912:2017This page deliberately left blank 2 IEC 61191-2:2017 IEC 2017 CONTENTS F
29、OREWORD . 5 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 General requirements 7 5 Surface mounting of components . 7 5.1 General . 7 5.2 Alignment requirements 8 5.3 Process control . 8 5.4 Surface mounted component requirements . 8 5.5 Flatpack lead forming 8 5.5.1 General . 8 5.5
30、.2 Surface mounted device lead bends 8 5.5.3 Surface mounted device lead deformation . 9 5.5.4 Flattened leads 9 5.5.5 Dual-in-line packages (DIPs) . 9 5.5.6 Parts not configured for surface mounting 9 5.6 Small devices with two terminations 9 5.6.1 General . 9 5.6.2 Stack mounting 9 5.6.3 Devices w
31、ith external deposited elements 9 5.7 Lead component body positioning . 10 5.7.1 General . 10 5.7.2 Axial-leaded components . 10 5.7.3 Other components . 10 5.8 Parts configured for butt lead mounting . 10 5.9 Non-conductive adhesive coverage limits 10 6 Acceptance requirements 10 6.1 General . 10 6
32、.2 Control and corrective actions . 10 6.3 Surface soldering of leads and terminations 11 6.3.1 General . 11 6.3.2 Solder fillet height and heel fillets 11 6.3.3 Flat ribbon L and gull-wing leads . 12 6.3.4 Round or flattened (coined) leads 13 6.3.5 J leads . 14 6.3.6 Rectangular or square end compo
33、nent 15 6.3.7 Cylindrical end-cap terminations 16 6.3.8 Bottom only terminations . 17 6.3.9 Castellated terminations 18 6.3.10 Butt joints 19 6.3.11 Inward L-shaped ribbon leads 20 6.3.12 Flat lug leads . 21 6.3.13 Ball grid array 22 6.3.14 Column grid array 23 6.3.15 Bottom termination components .
34、 24 2 IEC 61191-2:2017 IEC 2017 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 General requirements 7 5 Surface mounting of components . 7 5.1 General . 7 5.2 Alignment requirements 8 5.3 Process control . 8 5.4 Surface mounted component requirements . 8 5.5 Fla
35、tpack lead forming 8 5.5.1 General . 8 5.5.2 Surface mounted device lead bends 8 5.5.3 Surface mounted device lead deformation . 9 5.5.4 Flattened leads 9 5.5.5 Dual-in-line packages (DIPs) . 9 5.5.6 Parts not configured for surface mounting 9 5.6 Small devices with two terminations 9 5.6.1 General
36、. 9 5.6.2 Stack mounting 9 5.6.3 Devices with external deposited elements 9 5.7 Lead component body positioning . 10 5.7.1 General . 10 5.7.2 Axial-leaded components . 10 5.7.3 Other components . 10 5.8 Parts configured for butt lead mounting . 10 5.9 Non-conductive adhesive coverage limits 10 6 Acc
37、eptance requirements 10 6.1 General . 10 6.2 Control and corrective actions . 10 6.3 Surface soldering of leads and terminations 11 6.3.1 General . 11 6.3.2 Solder fillet height and heel fillets 11 6.3.3 Flat ribbon L and gull-wing leads . 12 6.3.4 Round or flattened (coined) leads 13 6.3.5 J leads
38、. 14 6.3.6 Rectangular or square end component 15 6.3.7 Cylindrical end-cap terminations 16 6.3.8 Bottom only terminations . 17 6.3.9 Castellated terminations 18 6.3.10 Butt joints 19 6.3.11 Inward L-shaped ribbon leads 20 6.3.12 Flat lug leads . 21 6.3.13 Ball grid array 22 6.3.14 Column grid array
39、 23 6.3.15 Bottom termination components . 24 BS EN 611912:2017IEC 61191-2:2017 IEC 2017 3 6.3.16 Components with bottom thermal plane terminations (D-Pak) 24 6.3.17 P-style terminations . 26 6.4 General post-soldering requirements applicable to all surface-mounted assemblies 26 6.4.1 Dewetting 26 6
40、.4.2 Leaching 26 6.4.3 Pits, voids, blowholes, and cavities 26 6.4.4 Solder wicking . 27 6.4.5 Solder webs and skins . 27 6.4.6 Bridging . 27 6.4.7 Degradation of marking . 27 6.4.8 Solder spikes . 27 6.4.9 Disturbed joint . 27 6.4.10 Component damage. 27 6.4.11 Open circuit, non-wetting . 27 6.4.12
41、 Component tilting. 27 6.4.13 Non-conducting adhesive encroachment 28 6.4.14 Open circuit, no solder available 28 6.4.15 Component on edge 28 7 Rework and repair . 28 Annex A (normative) Placement requirements for surface mounted devices . 30 A.1 General . 30 A.2 Component positioning . 30 A.3 Small
42、 devices incorporating two terminations 30 A.3.1 Metallization coverage over the land (side-to-side) 30 A.3.2 Metallization coverage over the land (end) . 30 A.4 Mounting of cylindrical end-cap devices (MELFs) 30 A.5 Registration of castellated chip carriers 30 A.6 Surface mounted device lead and la
43、nd contact . 30 A.7 Surface mounted device lead side overhang . 30 A.8 Surface mounted device lead toe overhang . 31 A.9 Surface mounted device lead height off land (prior to soldering) . 31 A.10 Positioning of J lead devices . 31 A.11 Positioning gull-wing lead devices . 31 A.12 External connection
44、s to packaging and interconnect structures . 31 Bibliography 32 Figure 1 Lead formation for surface mounted device 8 Figure 2 Fillet height 12 Figure 3 Flat ribbon and gull-wing leads . 13 Figure 4 Round or flattened (coined) lead joint . 14 Figure 5 J lead joint . 15 Figure 6 Rectangular or square
45、end components . 16 Figure 7 Cylindrical end-cap terminations 17 Figure 8 Bottom only terminations 18 Figure 9 Leadless chip carriers with castellated terminations . 19 Figure 10 Butt joints . 20 BS EN 611912:2017 4 IEC 61191-2:2017 IEC 2017 Figure 11 Inward L-shaped ribbon leads 21 Figure 12 Flat l
46、ug leads . 22 Figure 13 BGA with collapsing balls . 23 Figure 14 Bottom termination components . 24 Figure 15 Bottom thermal plane terminations . 25 Figure 16 P-style terminations . 26 Table 1 BGA with non-collapsing balls . 23 Table 2 Column grid array 23 Table 3 Reworkable defects . 29 BS EN 61191
47、2:2017IEC 61191-2:2017 IEC 2017 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARD ASSEMBLIES Part 2: Sectional specification Requirements for surface mount soldered assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization co
48、mprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International St
49、andards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates
