1、 ETSI TR 102 489 V1.4.1 (2015-10) Environmental Engineering (EE); European telecommunications standard for equipment practice; Thermal management guidance for equipment and its deployment TECHNICAL REPORT ETSI ETSI TR 102 489 V1.4.1 (2015-10) 2 Reference RTR/EE-0164 Keywords Energy Efficiency, envir
2、onment, equipment practice, rack ETSI 650 Route des Lucioles F-06921 Sophia Antipolis Cedex - FRANCE Tel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16 Siret N 348 623 562 00017 - NAF 742 C Association but non lucratif enregistre la Sous-Prfecture de Grasse (06) N 7803/88 Important notice The present do
3、cument can be downloaded from: http:/www.etsi.org/standards-search The present document may be made available in electronic versions and/or in print. The content of any electronic and/or print versions of the present document shall not be modified without the prior written authorization of ETSI. In
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6、i.org/People/CommiteeSupportStaff.aspx Copyright Notification No part may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm except as authorized by written permission of ETSI. The content of the PDF version shall not be modified wit
7、hout the written authorization of ETSI. The copyright and the foregoing restriction extend to reproduction in all media. European Telecommunications Standards Institute 2015. All rights reserved. DECTTM, PLUGTESTSTM, UMTSTMand the ETSI logo are Trade Marks of ETSI registered for the benefit of its M
8、embers. 3GPPTM and LTE are Trade Marks of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners. GSM and the GSM logo are Trade Marks registered and owned by the GSM Association. ETSI ETSI TR 102 489 V1.4.1 (2015-10) 3 Contents Intellectual Property Rights 5g3Forewor
9、d . 5g3Modal verbs terminology 5g3Abstract . 5g31 Scope 6g32 References 6g32.1 Normative references . 6g32.2 Informative references 6g33 Definitions and abbreviations . 7g33.1 Definitions 7g33.2 Abbreviations . 7g34 ARCM integration overview 8g35 Subrack integration in the same ARCM . 8g35.1 Configu
10、ring equipment in an ARCM . 8g35.1.0 Introduction. 8g35.1.1 Subrack location . 8g35.1.2 Cabling 9g35.2 Mechanical structure of ARCM . 9g35.2.0 Introduction. 9g35.2.1 Opening geometry for the airflow . 9g35.2.2 Equipment fastening in the ARCM . 10g35.2.3 Doors 10g35.3 ARCM cooling issues . 10g35.3.0
11、Introduction. 10g35.3.1 Cooling equipment including fans 10g35.3.2 Air Cooling techniques . 10g35.3.3 Air filtering . 11g35.4 Impact of the implementation of subracks in an ARCM 11g35.5 Impact of the temperature on equipment reliability . 12g36 ARCM integration in the same telecommunications equipme
12、nt or Data centre room . 12g36.1 Positioning the ARCM in a room . 12g36.1.0 Introduction. 12g36.1.1 Room layout 13g36.1.2 Cabling 13g36.1.3 Cooling systems 14g36.2 Mechanical structure of ARCMs in the rows . 15g36.2.1 Opening geometry for the airflow . 15g36.3 Cooling systems for a room 15g36.3.1 Ge
13、neral design considerations 15g36.3.2 Cooling techniques . 15g36.3.2.0 Introduction . 15g36.3.2.1 Passive cooling 15g36.3.2.2 Warm air extraction (without cool air) 16g36.3.2.3 Fresh air supply with natural release via pressure relief ventilators 17g36.3.2.4 Cool air blowing (with or without relativ
14、e humidity control) . 18g36.3.3 Room air paths 20g36.3.3.1 Room air supply 20g36.3.3.1.0 Introduction . 20g36.3.3.1.1 Free blow . 20g36.3.3.1.2 Overhead distribution 20g36.3.3.1.3 Raised floor distribution 20g36.3.3.2 Return air path . 21g36.3.3.2.1 Direct return to side walls at side/end of room 21
15、g3ETSI ETSI TR 102 489 V1.4.1 (2015-10) 4 6.3.3.2.2 Overhead return . 21g37 Thermal evaluation of the equipment/room architecture . 21g38 Temperature reference point 22g38.0 Introduction 22g38.1 Temperature measurement point for rack . 23g38.2 Temperature measurement point for aisle 23g3Annex A: Exa
16、mples of cooling systems in an ARCM in use prior to ETSI EN 300 119-5 24g3A.0 General . 24g3A.1 Single subrack cooling . 24g3A.1.0 Introduction 24g3A.1.1 Air outlet located at the top of the ARCM . 24g3A.1.2 Air outlet located at the front of the ARCM . 25g3A.2 Multiple subrack cooling 26g3A.2.0 Int
17、roduction 26g3A.2.1 Serial cooling 26g3A.2.2 Parallel airflow with air inlet located at the front or the bottom of the ARCM 27g3A.2.3 Parallel airflow with air inlet located at the sides of the rack . 29g3A.3 300 mm cabinet ARCM thermal solution 30g3A.3.0 Introduction 30g3A.3.1 Current 300 mm ARCM t
18、hermal solutions 30g3A.3.2 Alternative 300 mm cabinet solution 31g3A.3.3 Simulation test result about proposed thermal solution 32g3A.3.3.1 Mock-up configuration . 32g3A.3.3.2 Component test result . 33g3A.3.4 Air deflector design 33g3A.3.4.1 Key factors in air deflector design 33g3A.3.4.2 Different
19、 air deflector mock-up test 33g3Annex B: Example of ARCM cooling systems in a room . 36g3B.1 Room - serial cooling . 36g3B.2 Room - parallel cooling 36g3B.3 ETSI 300 mm ARCM in Central Office 37g3B.3.0 Introduction 37g3B.3.1 ETSI 300 mm ARCM solution . 37g3B.3.2 ETSI 300 mm ARCM in CO 38g3B.3.3 Alte
20、rnative ETSI 300 mm ARCM instalment in CO 39g3B.3.3.0 Introduction. 39g3B.3.3.1 Simulation equipment configuration . 40g3B.3.3.2 Simulation results . 40g3B.3.3.3 Proposed CO arrangement 41g3B.3.3.4 300 mm ARCM in CO simulation 42g3Annex C: Bibliography 44g3History 45g3ETSI ETSI TR 102 489 V1.4.1 (20
21、15-10) 5 Intellectual Property Rights IPRs essential or potentially essential to the present document may have been declared to ETSI. The information pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found in ETSI SR 000 314: “Intellectual
22、 Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in respect of ETSI standards“, which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web server (http:/ipr.etsi.org). Pursuant to the ETSI IPR Policy, no investigation, including IPR
23、searches, has been carried out by ETSI. No guarantee can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web server) which are, or may be, or may become, essential to the present document. Foreword This Technical Report (TR) has been produced
24、by ETSI Technical Committee Environmental Engineering (EE). The present document applies to all telecommunications racks/cabinets, miscellaneous racks/cabinets and subracks forming part of the public telecommunications network and defined in ETSI EN 300 119-1 i.3, ETSI EN 300 119-2 i.4, ETSI EN 300
25、119-3 i.5, ETSI EN 300 119-4 i.6 and ETSI EN 300 119-5 i.7 The present document applies also to telecom and data centre room installations. Modal verbs terminology In the present document “shall“, “shall not“, “should“, “should not“, “may“, “need not“, “will“, “will not“, “can“ and “cannot“ are to b
26、e interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of provisions). “must“ and “must not“ are NOT allowed in ETSI deliverables except when used in direct citation. Abstract It is often necessary to integrate different subracks into the same rack/cabin
27、et and different racks/cabinets into a common equipment room sharing the common room environment. The integration between equipment and the room is increasingly more important. The present document is intended to provide assistance in integration of equipment and room environment to ensure that the
28、equipment has the required environment and that each equipment rack/cabinet is not detrimental to the other equipment in the locality. It should be an aid for all integrators and designers with their different elementary knowledge to integrate. ETSI ETSI TR 102 489 V1.4.1 (2015-10) 6 1 Scope The pre
29、sent document is an aid for all integrators of Information and Communication Technologies (ICT) equipment to minimize thermal problems. It establishes recommendations for the thermal management of racks/cabinets, miscellaneous racks/cabinets and locations. The present document considers telecommunic
30、ation Central Office (CO) and Data Centers (DC) locations. The present document considers only the thermal factors. The integrator should consider the thermal factors in conjunction with the ETSI EN 300 019-1-3 i.1 and other non-thermal factors. 2 References 2.1 Normative references References are e
31、ither specific (identified by date of publication and/or edition number or version number) or non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the reference document (including any amendments) applies. Referenced documents whic
32、h are not found to be publicly available in the expected location might be found at http:/docbox.etsi.org/Reference. NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee their long term validity. The following referenced documents are necess
33、ary for the application of the present document. Not applicable. 2.2 Informative references References are either specific (identified by date of publication and/or edition number or version number) or non-specific. For specific references, only the cited version applies. For non-specific references
34、, the latest version of the reference document (including any amendments) applies. NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee their long term validity. The following referenced documents are not necessary for the application of the
35、 present document but they assist the user with regard to a particular subject area. i.1 ETSI EN 300 019-1-3: “Environmental Engineering (EE); Environmental conditions and environmental tests for telecommunications equipment; Part 1-3: Classification of environmental conditions; Stationary use at we
36、atherprotected locations“. i.2 CENELEC EN 60950-1 (2006): “Information technology equipment - Safety - Part 1: General requirements“. i.3 ETSI EN 300 119-1: “Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 1: Introduction and terminology“. i.4 ETSI EN
37、 300 119-2: “Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 2: Engineering requirements for racks and cabinets“. i.5 ETSI EN 300 119-3: “Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 3: Engineering r
38、equirements for miscellaneous racks and cabinets“. i.6 ETSI EN 300 119-4: “Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 4: Engineering requirements for subracks in miscellaneous racks and cabinets“. ETSI ETSI TR 102 489 V1.4.1 (2015-10) 7 i.7 ETSI
39、EN 300 119-5: “Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 5: Thermal management“. i.8 ETSI EN 300 386: “Electromagnetic compatibility and Radio spectrum Matters (ERM); Telecommunication network equipment; ElectroMagnetic Compatibility (EMC) requi
40、rements“. i.9 IEC TR 62380: “Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment“. i.10 Recommendation ITU-T L.1300: “Best practices for green data centers“. i.11 ASHRAE TC9.9. NOTE: Available at http:/tc99.ashraetcs.org/. i.12 ETSI ES
41、 202 336-12: “Environmental Engineering (EE); Monitoring and control interface for infrastructure equipment (power, cooling and building environment systems used in telecommunication networks); Part 12: ICT equipment power, energy and environmental parameters monitoring information model“. 3 Definit
42、ions and abbreviations 3.1 Definitions For the purposes of the present document, the following terms and definitions apply: ambient: spatial maximal temperature of the air entering the rack/cabinet NOTE: As defined in ETSI EN 300 019-1-3 i.1. cabinet: free-standing and self-supporting enclosure for
43、housing electrical and/or electronic equipment NOTE: It is usually fitted with doors and/or panels which may or may not be removable. equipment: equipped subracks, racks/cabinets and miscellaneous racks/cabinets integrator: end user/operator of telecommunication or IT equipment or their agent NOTE:
44、For example, an equipment manufacturer could be an operators agent. micro-climate: conditions found within the rack/cabinet/miscellaneous rack/cabinet creating a local ambient for the subrack NOTE: In practice this will typically result in elevated temperatures and reduced relative humidities to tho
45、se quoted in ETSI EN 300 019-1-3 i.1. Miscellaneous Rack/Cabinet (MRC): cabinet that accommodates subracks of several different types of equipment and suppliers NOTE: It is freely configurable by the Integrator. rack: free-standing or fixed structure for housing electrical and/or electronic equipmen
46、t 3.2 Abbreviations For the purposes of the present document, the following abbreviations apply: AC Air Cooling AHU Air Handling Unit ARCM Any Rack, Cabinet and Miscellaneous rack/cabinet ASHRAE American Society of Heating, Refrigeration and Air-conditioning Engineers CFM Cubic Feet to Minute CO Cen
47、tral Office CRAC Computer Room Air Conditioner ETSI ETSI TR 102 489 V1.4.1 (2015-10) 8 DC Data Centre DT Data Temperature EMC Electro Magnetic Compatibility HVAC Heating, Ventilation see clause 5.5. Case 3: An ARCM with 2 subracks designed to operate in temperature conditions according class 3.1 of
48、ETSI EN 300 019-1-3 i.1 intended to be used in telecom centres where the maximum temperature can be up to 30 C. The serial cooling technique, as shown in figure 5.4d, cannot be used. ETSI ETSI TR 102 489 V1.4.1 (2015-10) 12 Figure 5.4a Figure 5.4b Figure 5.4c Figure 5.4d In practice, the room will n
49、ot deliver the cool air from the fresh air or mechanically cooled supply without some degree of mixing. Furthermore the room temperature is not the same in any point of the room and can increase during failure of the cooling system. It is good practice therefore, to design the cooling system for a normal high air temperature lower than the highest temperature specified by the reference environmental class (see ETSI EN 300 019-1-3 i.1) so that the temperature of the air entering all subracks in the ARCMs remains within the m
