1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2012 07 25 N-Status No replacement A. Wedepohl, NA 2005 02 04 Revised Inserted 3.0; Deleted 3.5, 4 1987 12 01 Released CF42RD107002-87 Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page 1 of 2 SOLDER PASTE (63%
2、 TIN) NOT FOR NEW DESIGN ESF-M11A19-A2 1. SCOPE The material defined by this specification is a self-fluxing solder paste. 2. APPLICATION This specification was released originally for material used for soldering electrical connections and other applications where the use of a corrosive flux must be
3、 avoided. 3. REQUIREMENTS The solder is a homogeneous suspension of a prealloyed solder powder in a formulated screening and fluxing vehicle. The powder shall be free of lumps and pulverized so that 0.2% max shall be retained on a 200 mesh screen and 2.0% max on a 325 mesh screen. 3.0 STANDARD REQUI
4、REMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 COMPOSITION Solder 90 +/- 1.0% Flux Remainder 3.1.1 Solder Composition (ASTM B 32, Grade 63 B) Tin 62.5 - 63.5 Zinc 0.005 max Antim
5、ony 0.50 max Bismuth 0.25 max Copper 0.08 max Iron 0.02 max Aluminum 0.005 max Silver 0.015 max Arsenic 0.05 max Cadmium 0.005 max Lead Remainder 3.1.2 Flux Analysis Flux 54% min Vehicle Remainder ENGINEERING MATERIAL SPECIFICATION ESF-M11A19-A2 Copyright 2012, Ford Global Technologies, LLC Page 2 o
6、f 2 3.2 PHYSICAL PROPERTIES 3.2.1 Liquidus 183 +/- 3 C Solidus (Eutectic) 183 +/- 3 C 3.2.2 Specific Gravity 3.5 min (ASTM D 70) 3.2.3 Viscosity, at 25 +/- 1 C 550,000 +/- 10% mPas Test Method: Measure viscosity with a Brookfield Viscometer Model RVT TF Spindle, 5 RPM, after 10 resolutions at 25 C.
7、3.3 CORROSION ACTIVITY None Test Method: Use a copper coupon (5 samples) 35 mm sq, 0.33 mm thick. Clean the coupon with stainless steel wool and carefully vapor degrease it with CC1-4. Place the coupons in tightly sealed glass jars until needed. Weigh the solder paste samples on an analytical balanc
8、e to a weight of 0.5 +/- 0.01 g. Place each weighed sample on a coupon and put the entire sample (paste plus coupon) in an oven at 250 C until all of the flux is burned off. Be sure that all of the samples are at the same level in the oven. At this point, the soldered coupons are removed from the ov
9、en, allowed to cool to room temperature and placed into a humidity cabinet (98 +/- 2% R.H. at 38 +/- 1 C for 72 h). There shall be no evidence of corrosion when the samples are viewed under a low power microscope (20X). 3.4 SOLDERABILITY Area 10 to 50% larger than original pattern Test Method: Use a
10、 copper coupon 35 mm sq, 0.33 mm thick. Clean the coupon with stainless steel wool, carefully vapor degrease with CC1-4; and oxidize it in an electric oven for 1-1/2 h at 233 C. Be sure to have the coupons at the same level in the oven. After the oxidation is completed, remove the coupons from the o
11、ven and place them in clean tightly sealed glass jars until needed. At this point, solder paste samples 6.5 mm x 0.25 mm are placed on the oxidized copper coupon, and the entire sample (paste plus coupon) is immediately placed on a hot plate at 230 C. The solder is left to spread until all of the fl
12、ux is burned off. The coupon is then placed in the flux remover, cleaned and marked. 4. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. Contact for questions concerning Engineering Material Specifications. This material has a tendency to separate and should be stirred before loading into the applicator.
