1、 ENGINEERING MATERIAL SPECIFICATIONDate Action Revisions 2003 06 30 Revised Para 3.0 inserted; Para 3.1, 3.9, 4 deleted 1987 05 08 CF4R107002-14 Released Printed copies are uncontrolled Copyright 2003, Ford Global Technologies, Inc. Page 1 of 1 PRINTED CIRCUIT BOARD SUBSTRATE, ESF-M3L84-A POLYIMIDE
2、(PI) FILM 1. SCOPE The material defined by this specification is a polyimide film with a thermal index of 200 C for mechanical properties and 230 C for electrical properties. 2. APPLICATION This specification was released originally for material used as the substrate for printed circuit boards in th
3、e radio. 3. REQUIREMENTS 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). Thickness, mm 0.025 0.050 0.075 0.125 3.2 TENSILE STRENGTH, MPa, min 165 165 165 165 (ASTM D
4、 882, Method A, 5mm/m) 3.2.1 Elongation %, min 45 50 60 60 3.3 SHRINKAGE %, max 0.10 0.05 0.05 0.05 (200 C for 1 h) 3.4 MOISTURE ABSORPTION %, max 4.0 4.0 4.0 4.0 (ASTM D 570, 24 h) 3.5 DIELECTRIC STRENGTH, kV/mm, min 240 184 180 120 (ASTM D 149, short time, 3.2 mm thick specimen) 3.6 VOLUME RESITIVITY, ohm-cm, min 1E12 1E12 1E12 1E12 (ASTM D 257 at 200 C) 3.7 DIELECTRIC CONSTANT, max 3.8 3.8 3.8 3.8 (ASTM D 150 at 1 kHz) 3.8 DISSIPATION FACTOR, max 0.0035 0.0035 0.0035 0.0035 (ASTM D 150 at 1 kHz)
