1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2015 03 26 N Status No replacement or usage M. Katz, NA 2003 07 30 Revised Para 3.0 inserted; Para 3.9 & 4 deleted 1988 04 20 SM/ER 3843 TC Released J. Burke, JAF, MP. NAAO. J. Lines. EAO Controlled document at www.MATS Copyright 2015, Ford G
2、lobal Technologies, Inc. Page 1 of 5 PLATING, BRIGHT OR LOW GLOSS DECORATIVE WSB-M1P80-B1 OVER COPPER OR COPPER ALLOY - INTERIOR PLATING, BRIGHT OR LOW GLOSS DECORATIVE WSB-M1P80-B2 OVER COPPER OR COPPER ALLOY - EXTERIOR NOT TO BE USED FOR NEW DESIGN 1. SCOPE These specifications define performance
3、requirements for finished coatings of electrodeposited copper, nickel, and chromium for the decoration and protection of copper and copper alloy (e.g., brass) surfaces. 2. APPLICATION These specifications were released originally where a bright or low gloss decorative and protective metallic finish
4、is required on copper and copper alloy surfaces. Two levels of performance are defined as follows: WSB-M1P80-B1 Interior part applications. WSB-M1P80-B2 Exterior part applications. CAUTION Based upon field survey and accelerated laboratory testing experience, plated parts with designs that are not i
5、n conformance with the Corporate Plated Part Design Restrictions Booklet (see para 5.1) will not be capable of consistently meeting the requirements of these specifications on a production basis without the use of extraordinary processing techniques, e.g., use of auxiliary anodes, reduction in the p
6、arts per rack ratio, etc. FEASIBILITY If the requirements of this specification cannot be met due to part design restrictions, the supplier will inform the responsible product engineering office. 3. REQUIREMENTS All requirements identified for each specification must be met to achieve acceptable fie
7、ld durability. No one requirement, exclusive of others, is capable of insuring satisfactory performance. Any deviations to the requirements of these specifications may be subject to additional performance requirements. All part testing requirements apply to those areas of the part identified as a si
8、gnificant surface per para 5.2 unless otherwise specified on the engineering drawing. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). ENGINEERING MATERIAL SPECIFICAT
9、ION WSB-M1P80-B1/B2 Copyright 2015, Ford Global Technologies, Inc. Page 2 of 5 3.1 STATISTICAL PROCESS The following characteristics shall form part of the Control Plan but shall in no way preclude the control of additional characteristics deemed significant by the supplier and/or Ford SQA. Signific
10、ant Characteristics (See requirement values within the body of these specifications) . Plating Thickness . Plating Ductility . Microporosity . S.T.E.P. Potential . Sulphur Content 3.2 APPEARANCE All parts shall have the finish (bright, low gloss or paint overlay) specified on the engineering drawing
11、. The plated parts shall be free from surface imperfections. Low gloss or black parts shall match the approved Styling master sample for appearance. 3.2.1 Buffing of Plating Because of the potential adverse effect on corrosion resistance, buffing of final chromium plating on exterior parts is not pe
12、rmitted. Buffing or other approved mechanical treatment on the copper and nickel coatings are permitted provided that minimum plating thickness requirements are met after treatment. 3.3 PLATING ADHESION (ASTM B 571) Adhesion of the electroplate to the base metal and between layers of plating must co
13、nform to the requirements of the following test methods per ASTM B 571 unless otherwise indicated: 3.3.1 Bend Tests (Bend the part or sections of the part) No peeling, flaking, or lift-off of the electroplate from the substrate or from underlying layers of the electroplate is permitted following the
14、 bend tests. 3.3.2 Grind-Saw Test No lifting or peeling of the electroplate from the substrate or from underlying layers of the electroplate is permitted following the grind-saw test. ENGINEERING MATERIAL SPECIFICATION WSB-M1P80-B1/B2 Copyright 2015, Ford Global Technologies, Inc. Page 3 of 5 3.4 DU
15、CTILITY (ASTM B 490) Although this is considered a portion of the process control and not a requirement of part performance, the ductility of the electrodeposit on a finished part is considered acceptable when foils plated in the individual nickel baths meet or exceed the following values: Semi-brig
16、ht Nickel 80% Bright Nickel 20% 3.5 PLATING THICKNESS (ASTM B 487, ASTM B 556) It is the suppliers responsibility to identify the plating thickness distribution for each unique part design and rack design by mapping the plating racks and plated parts and to employ any special processing techniques,
17、e.g., the use of auxiliary anodes and/or shields, reducing the number of parts per rack etc., which may be required to consistently meet the specified minimum plating thicknesses on all significant surfaces. The optical measurement of copper and nickel deposits on significant surfaces shall be consi
18、dered the standard thickness test method (ASTM B 487). The chromium plate thickness on significant surfaces shall be checked by the spot test as described in ASTM B 556 or by the Coulometric method, ASTM B-504. In case of difference, ASTM B 504 shall be the umpire method. The plating thickness requi
19、rements identified below represent minimum values in micrometers and apply to all areas of significant surfaces. WSB-M1P80 B1 B2 Application Interior Exterior Acid Copper 10 10 Semi-bright Nickel (a) - 20 Bright Nickel (b) plus Special 10 10 Nickel (c) or Low Gloss Nickel (d) Total Nickel (e) 10 30
20、Microporous Chromium (f) - 0.25 Regular Chromium 0.25 - (a) The sulphur content in the semi-bright nickel bath shall be less than 0.005% (weight %). The sulphur content is specified to indicate the type of nickel plating solution that is to be used and may be measured per the test procedures identif
21、ied in ASTM B 456. In-process testing to determine conformance to the sulphur content requirement is essential to establish and maintain process capability and control. (b) The sulphur content in the bright nickel bath shall be greater than 0.04% (weight %). The sulphur content is specified to indic
22、ate the type of nickel plating solution that is to be used and may be measured per the test procedures identified in ASTM B 456. In-process testing to determine conformance to the sulphur content requirement is essential to establish and maintain process capability and control. ENGINEERING MATERIAL
23、SPECIFICATION WSB-M1P80-B1/B2 Copyright 2015, Ford Global Technologies, Inc. Page 4 of 5 (c) If a special nickel is employed to produce discontinuities in the chromium deposit, the thickness of the special nickel shall be added to the measurement of the bright nickel deposit to meet the combined bri
24、ght nickel plus special nickel minimum thickness requirement. If a special nickel layer is not used, the minimum thickness requirement applies only to the bright nickel deposit. (d) Low gloss nickel may be produced by one of the following methods: Co-deposit containing inorganic particles insoluble
25、in the plating bath. Soluble addition agents co-deposited with the nickel. Mechanical treatment of a bright nickel deposit, e.g., brushing or bead blasting. When low gloss nickel is specified, special nickel need not be applied. (e) The semi-bright nickel thickness shall be greater than or equal to
26、60% of the total nickel thickness. The bright nickel thickness shall be less than or equal to 40% of the total nickel thickness. (f) Microporous chromium plating systems acceptable under this specification are defined as those being capable of producing microporosity in conformance with para 3.6. 3.
27、6 MICROPOROSITY, min 10,000 pores/cm2 (FLTM BQ 103-06) Note: Applies only to WSB-M1P80-B2. 3.7 ACCELERATED CORROSION RESISTANCE (ASTM B 368) WSB-M1P80-B1 4 h (1 cycle of 4 h) WSB-M1P80-B2 44 h (two 22 h cycles) Note: Parts shall be rinsed with demineralized water only, after each CASS test cycle. Sc
28、rubbing, abrasive cleaning, or polishing is not permitted. Parts are then examined for corrosion defects. Following CASS exposure for the appropriate duration as specified, failure is to be noted as follows: . Any evidence of base metal corrosion deposits or blisters on significant surfaces shall co
29、nstitute failure of the part. . Any pit larger than 1.5 mm in diameter visible on any significant surface shall be considered failure of the part. ENGINEERING MATERIAL SPECIFICATION WSB-M1P80-B1/B2 Copyright 2015, Ford Global Technologies, Inc. Page 5 of 5 3.8 SIMULTANEOUS THICKNESS & ELECTROCHEMICA
30、L POTENTIAL TEST (S.T.E.P.) (ASTM B 764) Note: Applies only to WSB-M1P80-B2. 3.8.1 The semi-bright nickel layer must be more noble (cathodic) than the bright nickel layer by a minimum of 100 millivolts. 3.8.2 If a microporous top nickel layer is used, it shall be equal to or more noble than the brig
31、ht nickel layer potential. However, the potential of the microporous nickel shall not be more than 20 mv noble (cathodic) to the bright nickel layer. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of these specifications. 5
32、.1 PLATED PART DESIGN RESTRICTIONS BOOKLET Booklet # 80-14-154 (Ford Stationery Order Number) entitled, “Influence of Design on the Electroplating of Exterior Injection Molded Plastic Components and Zinc Die Castings“. Note: Purchased parts suppliers should request a copy of this booklet from their
33、Ford buyer. 5.2 SIGNIFICANT SURFACES Unless otherwise specified on the engineering drawing, significant surfaces are defined as those surfaces of the finished part that: . Are directly visible and/or visible by reflection when the finished part is assembled in car position. . Can be the source of corrosion products directly visible or visible by reflection. 5.3 SAMPLING AND INSPECTION As specified in Quality Control Specification Q-101 and consistent with the appropriate Engineering Specification (ES) as released by the responsible design engineering activity.
