KS C IEC 60455-1-2003 Resin based reactive compounds used for electrical insulation-Part 1:Definitions and general requirements《电气绝缘用树脂基电抗化合物 第1部分 定义和通用要求》.pdf

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KS C IEC 60455-1-2003 Resin based reactive compounds used for electrical insulation-Part 1:Definitions and general requirements《电气绝缘用树脂基电抗化合物 第1部分 定义和通用要求》.pdf_第1页
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1、 KS C IEC 60455-1KSKSKSKSSKSKSKS KSKSKS SKSKS KSKS SKS KS 1: KS C IEC 60455-1 : 2003 (2008 ) 2003 5 26 http:/www.kats.go.kr : ( ) ( ) ( ) : (http:/www.standard.go.kr) : : 2003 5 26 : 2008 10 29 2008-0706 : ( 503-7949) . (http:/www.kats.go.kr) 10 5 , ICS 29.035.01 KS C IEC 1: 60455 1: 2003(2008) Resi

2、n based reactive compounds used for electrical insulation Part 1:Definitions and general requirements 1998 2 IEC 60455 1 Resin based reactive compounds used for electrical insulation Part 1: Definitions and general requirements , . 1. . . . . IEC . 1 . 1 (casting compound) (embedding compound) (pott

3、ing compound) (encapsulating compound) (impregnating compound) (for dipping procedure) (for trickling procedure) (for vacuum pressure impregnation) CC EBC PC ECC IC ICD ICT VPI . . 2. . , . . 2 . ISO 1043 1 . . . ISO 1043 2 . ISO 4597 1 . C IEC 60455 1: 2003 2 2 (acrylic) (epoxy) (polyurethane) (sil

4、icone) (unsaturated polyester) A EP PUR SI UP 3. . . KS C IEC 60455 2 2: KS M ISO 472 IEC 60050(212): 1990 (IEV) 212: , ISO 1043 1: 1987 1: ISO 1043 2: 1988 2: ISO 4597 1: 1983 1: 4. IEC 60050(212) KS M ISO 472 . IEC 60050(212) KS M ISO 472 . 4.1 (reactive compound) , , , . . . , . 4.2 (cured compou

5、nd) . (self supporting). 4.3 (reactive component) , , , , . 4.4 (resin) , , . . 4.5 (acrylic resin:A) , (copolymer). 4.6 (epoxy resin:EP) 4.7 (polyurethane resin:PUR) 4.8 (silicone resin:SI) 4.9 (unsaturated polyester resin:UP) C IEC 60455 1: 2003 3 4.10 (reactive diluent) . 4.11 (hardener) 4.12 (a

6、ccelerator) 4.13 (inhibitor) 4.14 (filler) , , , 4.15 (cure, curing) 4.16 (polymerization) 4.17 (crosslinking) 2 4.18 (pot life) 4.19 (shelf life) 4.20 (casting compound:CC) IEC 60050(212) , . IEC 60050(212) . 4.20.1 (embedding compound:EBC) . . , . 4.20.2 (potting compound:PC) . . 4.21 (encapsulati

7、ng compound:ECC) , , , 4.22 (Impregnating compound:IC) , . (ICD), (ICT) (VPI) . 5. 3 . KS C IEC 60455 2 6.4.4.1 . KS C IEC 610061* . . . * 1 A . C IEC 60455 1: 2003 4 3 ( ) 1 2 3 4 5 160 135 125 110 100 160 135 125 110 6 7 8 9 10 75 50 25 0 20 100 75 50 25 0 11 20 6. , KSC IEC 60455 3 . 6.1 . 6.2 .

8、, , . . , ( ) ( 2 ) 1 L, 2.5 L, 5 L, 25 L 205 L 6.3 , . C IEC 60455 1: 2003 5 A() 1 KS C IEC 61006: 2002 1: 135513 7017 (02)60094567 (02)600948878 http:/ KS C IEC 60455-1: 2003KSKSKS SKSKS KSKS SKS KS SKS KSKS SKSKS KSKSKS Resin based reactive compounds used for electrical insulation Part 1:Definitions and general requirements ICS 29.035.01 Korean Agency for Technology and Standards http:/www.kats.go.kr

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