搜索
麦多课文库
收藏
下载资源
加入VIP,免费下载
NF P37-410-1987 Roofing accessories Metallic ventilation holes with grating Requirements 《屋顶附件 金属框架天窗 要求》.pdf
上传人:
eveningprove235
文档编号:1003979
上传时间:2019-03-18
格式:PDF
页数:5
大小:194.80KB
下载
相关
举报
第1页 / 共5页
第2页 / 共5页
第3页 / 共5页
第4页 / 共5页
第5页 / 共5页
亲,该文档总共5页,全部预览完了,如果喜欢就下载吧!
资源描述
展开
阅读全文
相关资源
IRS 70778-2-2018 Recommendations for determining the carrying capacity and fatigue risks of existing metallic railway bridges.pdf
IRS 70712-2018 Rail defects.pdf
IRS 50596-6-2018 Conditions for coding intermodal loading units in combined transport combined transport lines and wagons.pdf
IRS 50596-5-2018 Transport of road vehicles on wagons-Technical Organisation-Conveyance of semi-trailers with P coding or N coding on recess wagons.pdf
IESNA TM-23-2017 Lighting Control Protocols.pdf
IESNA RP-2-2017 Recommended Practice for Retail Lighting.pdf
ITU-R RAPPORT M 766-2 FRENCH-1990 Feasibility of frequency sharing between the GPS and other services《全球定位系统和其他服务之间的频率共享的可行性》.pdf
ITU-R RAPPORT M 763-3 FRENCH-1990 Signal level variation due to multipath effects and blockage by ship-s superstructure in maritime mobile-satellite service lin.pdf
ITU-R RAPPORT M 739-1 FRENCH-1986 Interference due to intermodulation products in the land mobile service between 25 and 100 MHz《由于互调产物在陆地移动服务25和100 MHz之间产生的干扰》.pdf
ITU-R RAPPORT M 319-7 FRENCH-1990 Characteristics of equipment and principles governing the assignment of frequency channels between 25 and 100 MHz for land mob.pdf
猜你喜欢
DIN EN 62047-10-2012 Semiconductor devices - Micro-electromechanical devices - Part 10 Micro-pillar compression test for MEMS materials (IEC 62047-10 2011) German version EN 62047-.pdf
DIN EN 62047-11-2014 Semiconductor devices - Micro-electromechanical devices - Part 11 Test method for coefficients of linear thermal expansion of free-standing materials for micro.pdf
DIN EN 62047-12-2012 Semiconductor devices - Micro-electromechanical devices - Part 12 Bending fatigue testing method of thin film materials using resonant vibration of MEMS struct.pdf
DIN EN 62047-13-2012 Semiconductor devices - Micro-electromechanical devices - Part 13 Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62.pdf
DIN EN 62047-14-2012 Semiconductor devices - Micro-electromechanical devices - Part 14 Forming limit measuring method of metallic film materials (IEC 62047-14 2012) German version .pdf
DIN EN 62047-15-2016 Semiconductor devices - Micro-electromechanical devices - Part 15 Test method of bonding strength between PDMS and glass (IEC 62047-15 2015) German version EN .pdf
DIN EN 62047-16-2015 Semiconductor devices - Micro-electromechanical devices - Part 16 Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever.pdf
DIN EN 62047-17-2015 Semiconductor devices - Micro-electromechanical devices - Part 17 Bulge test method for measuring mechanical properties of thin films (IEC 62047-17 2015) Germa.pdf
DIN EN 62047-18-2014 Semiconductor devices - Micro-electromechanical devices - Part 18 Bend testing methods of thin film materials (IEC 62047-18 2013) German version EN 62047-18 20.pdf
相关搜索
NFP374101987ROOFINGACCESSORIESMETAL
屋顶
附件
金属
框架
天窗
要求
PDF
当前位置:
首页
>
标准规范
>
国际标准
>
其他
copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:
苏ICP备17064731号-1
登录
首页
资源分类
专题
通知公告