1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06Semiconductor devices - Mechanical and climatic test methodsPart 12: Vibration, variable frequencyBS EN IEC 60749-12:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 60749-12 March 2018 ICS 31.080.01 Superse
2、des EN 60749-12:2002 English Version Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 12: Vibrations, frquences variables (IEC 60749-12:2017) Halbl
3、eiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 12: Schwingen, variable Frequenz (IEC 60749-12:2017) This European Standard was approved by CENELEC on 2018-01-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for givin
4、g this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three o
5、fficial versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrot
6、echnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romani
7、a, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-10
8、40 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 60749-12:2018 E National forewordThis British Standard is the UK implementation of EN IEC 60749-12:2018. It is identical to IEC 60749-12:2017. It supersedes BS EN
9、60749-12:2002, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provi
10、sions of a contract. Users are responsible for its correct application. The British Standards Institution 2018 Published by BSI Standards Limited 2018ISBN 978 0 580 98682 6ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was publishe
11、d under the authority of the Standards Policy and Strategy Committee on 30 April 2018.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN IEC 60749-12:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 60749-12 March 2018 ICS 31.080.01 Supersedes EN 60749-
12、12:2002 English Version Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 12: Vibrations, frquences variables (IEC 60749-12:2017) Halbleiterbaueleme
13、nte - Mechanische und klimatische Prfverfahren - Teil 12: Schwingen, variable Frequenz (IEC 60749-12:2017) This European Standard was approved by CENELEC on 2018-01-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this Europe
14、an Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versi
15、ons (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical comm
16、ittees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Sl
17、ovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2
18、018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 60749-12:2018 E BS EN IEC 60749-12:2018EN IEC 60749-12:2018 (E) 2 European foreword The text of document 47/2386/CDV, future edition 2 of IEC 60749-12, prepared by IEC/TC 47 “S
19、emiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 60749-12:2018. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018
20、-10-17 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2021-01-17 This document supersedes EN 60749-12:2002. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be
21、 held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-12:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the
22、standard indicated: IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6. BS EN IEC 60749-12:2018 2 IEC 60749-12:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 Test apparatus 5 5 Test method 5 6 Examination and test measurements . 6 7 Failure criteria . 6
23、 8 Summary . 6 Bibliography 7 Table 1 Test conditions 6 BS EN IEC 60749-12:2018IEC 60749-12:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 12: Vibration, variable frequency FOREWORD 1) The International Electrotechnical Com
24、mission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
25、 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee
26、 interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accorda
27、nce with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all inter
28、ested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsi
29、ble for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence b
30、etween any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of
31、 conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
32、 members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publicat
33、ion or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publicat
34、ion may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-12 has been prepared by IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published i
35、n 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) alignment with MIL-STD-883J Method 2007, Vibration, variable frequency. The text of this International Standard is based on the following
36、documents: CDV Report on voting 47/2386/CDV 47/2434/RVC BS EN IEC 60749-12:2018 4 IEC 60749-12:2017 IEC 2017 Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance
37、with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60749 series, published under the general title Semiconductor devices Mechanical and climatic test methods, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until th
38、e stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN IEC 60749-12:2018IEC 60749-12:2017 IEC 2017 5 SEMICONDUCTOR DEVICES ME
39、CHANICAL AND CLIMATIC TEST METHODS Part 12: Vibration, variable frequency 1 Scope This part of IEC 60749 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applica
40、ble to cavity-type packages. NOTE This test method describes a swept sine test. A random vibration test is described in JEDEC document JESD 22-B103. 2 Normative references There are no normative references in this document. 3 Terms and definitions No terms and definitions are listed in this document
41、. ISO and IEC maintain terminological databases for use in standardization at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 4 Test apparatus The apparatus for this test shall include equipment capa
42、ble of providing the required variable frequency vibration at the specified level and the necessary optical and electrical equipment for post-test measurements. 5 Test method The device shall be rigidly fastened on the vibration platform and the leads or cables adequately secured to avoid excessive
43、lead resonance. The device shall be vibrated with simple harmonic motion having either a peak to peak amplitude of 1,5 mm (10 %) or a peak acceleration of the specified test condition A, B, or C in Table 1, below. Unless required by the relevant specification, the test conditions detailed in Table 1
44、 below shall be applied. Test conditions shall be amplitude controlled below the crossover frequency and acceleration level controlled above. The vibration frequency shall be varied approximately logarithmically between 20 Hz and 2 000 Hz. The entire frequency range of 20 Hz to 2 000 Hz and return t
45、o 20 Hz shall be traversed in not less than 4 min. This cycle shall be performed 4 times in each of the orientations X, Y, and Z (total of 12 times), so that the motion shall be applied for a total period of not less than 48 min. NOTE Alternative test conditions are listed in IEC 60068-2-6 and JEDEC
46、 document JESD 22-B103. BS EN IEC 60749-12:2018 6 IEC 60749-12:2017 IEC 2017 Table 1 Test conditions Test condition Peak acceleration (m/s2) ( %020+ ) A 200 B 500 C 700 6 Examination and test measurements After completion of the test, an external visual examination of the marking shall be performed
47、without magnification or with a viewer having a magnification no greater than 3X and a visual examination of the case, leads, or seals shall be performed at a magnification between 10X and 20X. This examination and any additional specified measurements and examination shall be made after completion
48、of the final cycle or upon completion of a group, sequence, or subgroup of tests which include this test. When specified, devices with an internal cavity containing parts or elements subject to possible movement or breakage during vibration shall be further examined by radiographic examination or by
49、 delidding or opening and internal visual examination at 30X magnification to reveal damage or dislocation. Where this test is performed as part of a group or subgroup of tests, the post-test measurements or inspections need not be performed specifically at the conclusion of this test, but may be performed once at the conclusion of the group or subgroup. Hermeticity tests for hermetic devices, visual examination, and electrical measurements that consist of parametric and functional
