1、c REVISIONS LT R - Prepared in accordance with VIL-STO-100 OF MOES 1 PAOES I DE SCRI PTION DATE APPROVED 1 :elected item drawina Original Date of Drawing 27 July 1977 DCSC POW 144 MAR 76 )EIEISE ELECTROWICS SUPPLY CENTER IAYTIN, OHIO / TITLE 7 -27 -77 Oscillator ticrocircuits, Low Power Schottky, TT
2、L, Ponolithic Silicon REV PAOE I OF 9 1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I SIZE CODE IDENT. NO. DffENSE ELECTRONICS SUPPLY CENTER 14933 1. SCOPE 1.1 II SCO e. This drawing describes the requirements for monolithic silicon, low-power Sc
3、hottky TTL, oschor microcircuits. This drawing provides for a level of microcircuit quality and re1 iabil ity assurance for procurement of microcircuits in accordance with CIL-C-38510. DWB NO. 77041 1.2 Part number. The complete part number shall be as shown in the following example: REV T PAGE 2 i
4、LIId Lead finish Drawing number Device type Case outline (1.2.1) (1.2.2) (3.3) 1.2.1 Device type. The device type shall identify the circuit function as follows: Devi ce type Generic number Circuit o1 54LS124 Dual voltage-controlled oscillators 1.2.2 Case outline. The case outline shall be as design
5、ated in F(IL-F(-38510. appendix C and as fol 1 ows : Outline letter Case outline E F D-2 (16-pin, 1/4“ X 7/8“ dual-in-line) F-5 (16-pin, 1/4“ X 3/8“ flat pack) 1.3 Absolute maximum ratings. Supply voltage range- - - - - - - - - - - - - - - - - -0.5 to 7.0 Vdc Input voltage range - - - - - - - - - -
6、- - - - - - - Maximum power dissipation, PD y- - - - - - - - - - - 190 mWdc -1.5 Vdc at -18 mA to 5.5 Vdc Storage temperature range - - - - - - - - - - - - - - -65C to 150C J Lead temperature (soldering 10 seconds) - - - - - - - 300C 0.09“C/mW for flat pack 0.08“C/mW for dual-in-line Thermal resista
7、nce, junction to case - - - - - - - - Junction temperature- - - - - - - - - - - - - - - - - JC TJ = 175C 1.4 Reconmiended operating conditions. supply voltage- - - - - - - - - - - - - - - - - - - - 4.5 Vdc minimum to 5.5 Vdc maximum Minimum high level input voltage- - - - - - - - - - - 2.0 Vdc Maxim
8、um low level input voltage - - - - - - - - - - - 0.7 Vdc Ambient operating temperature range - - - - - - - - - -55C to 125C I I +I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-2. APPLICABLE DOCUMENTS 2.1 The following documents for proposal. form
9、a part of th SPECIFICATION MILITARY MIL-M-38510 - Microc STANDARD MILITARY SIZE CODE IDENT. NO. DlfEIISE ELECTRONICS SUPPLY CEIITER A 14933 of the issue in effect on date of invitation for bids or request s drawing to the extent specified herein. OW0 NO. 77041 rcuits, General Specification for. MIL-
10、STD-883 - Test Methods and Procedures for Microelectronics. (Copies of specifications, standards, drawings, and publications required by suppliers in connec- tion with specific procurement functions should be obtained frm the procuring activity or as j i rected by the contracting officer . ) 3. REQU
11、IREMENTS 3.1 Detail specifications. The individual item requirements shall be in accordance with 1IL-M-38510, and as specified herein, 3.2 Design, construction, and physical dimensions. The design, construction, and physical fimensions shall be as specified in MIL-M-38510 and herein. 3.2.1 Design do
12、cumentation. The design documentation shall be in accordance with VIL-V-38510 ina. unless otherwise specified in the contract or purchase order, shail be retained by the riranu- facturer but be available for review by the procuring activity or contractor upon request. 3.2.2 Terminal connections. lhe
13、 terminal connectlons shall be as specified on fiaure 1. 3.2.3 Case outline. The case outline shall be in accordance with 1.2.2. 3.3 Lead material and finish. Lead material and finish shall be in accordance with MIL-M-38510. 3.4 Electrical performance characteristics. The electrical performance char
14、acteristics are as ;pecified in table I and apply over the full recommended ambient operating temperature range, un- less otherwise specified. 3.5 Marking. Marking shall be in accordance with MIL-M-38510 except the part number shall be in accordance with 1.2 herein. ised. The M38510/XXX part number,
15、 and the “JAN“ or “J“ mark shall not be 3.6 Product assurance requirements. Microcircuits furnished under this drawing shall have been subjected to, and passed all the requirements, tssts, and inspections detailed herein including screening, and qual i ty conformance inspection requirements. OESC FO
16、RM l44A MAR 76 t Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I i l 1 j i i i l I ! I l l j ! I j I 1 I ! i l l ! i 1 ! 1 I REV PAGE 4 TABLE I. Electrical characteristics. - Units Volts Conditions Device type Limits Test Symbo: - OH Max m vcc = 4.
17、5 v; VIN = 2.0 v IOH -400 PA o1 2.5 High-level output voltage o/ - vcc = 4.5 v; VIN 0 0.7 v IoL = 4 mA o1 Low-level output voltage 4/ “OL vIc 0.4 -1.5 Volts Volts Vcc = 4.5 V; IIN c -18 mA TA = 25C o1 Input clamp voltage ?/ Vcc = 5.5 V; VIH = 2.7 V 2J o1 20 High-level input current 4J Low-level inpu
18、t current 4/ I IH1 IIL Ios -.O3 -.40 mA Vcc 5.5 V; VIL - 0.4 V iJ o1 -40 Short-circuit output current 4/ vcc = 5.5 v 3J o1 -225 50 mA mP O1 Ciirrent supplv 4/ Cunctional tests 7J Maximuni clock Frequency 6f S, Icc vcc = 5.5 v See 4.4.l(c) o1 - 25 - 20 - 20 FMAX Vcc = 5.0 V RL - 280n +54 - o1 TA = 25
19、C CL = 15 pF 510% CL 0 15 pF 510% TA -55“C.:25“C MH z tWz o1 MH z o1 TA = 25C CL 50 pF 510% TA -55“C,125“C CL = 50 pF 510% o1 15 PH z ns - 70 98 75 Propaga ti on delay time, high-io-low-level 6f 8J output from enable ti TA - 25C CL - 15 pF -0% o1 2 - 2 TA -55“C.l25“C CL 15 pF 510% o1 ns ns ns o1 2 T
20、A - 25C CL = 50 pF 210% T = -55“C,125“C CL A = 50 pF 510% o1 2 - 105 - SIZE I CODE IOENT. NO.1 OW0 NO. 1 14933 A 77041 DESC FOS1 144A MAR 76 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- . . . : . :i: . . . . . . . . 7. . . .c . . .R. L LOGIC: SEE
21、 DESCRIPTION Device type O1 DffENSE ELtCTUONitS SUPPLY CINTEU OAYTOII, onIo SN54LSl24, SN54S124 . J OR W PACKAGE SN74LS124, SN74S124 . J OR N PACKAGE (TOP VIEW) SIZE CODE IDENT. NO. OW0 NO. 77041 14933 REV PAE 5 logic: While the enable input is low, the output is enabled. input is high, the output i
22、s high. While the enable Cases E and F FIGURE 1. Terminal connections (top view). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE CODE IDENT. NO. DEFENSE ELECTRONICS SUPPLY CENTER A 14933 3.6.1 Screenin . Screening shall be in accordance with me
23、thod 5004, class R, of MIL-STD-883 and 4.3 herein. The 100 percent final electrical screening for off the shelf devices shall consist of the normal 100 percent OC tests at 25C with 10 percent PDA, high and low temperature DC tests, and 25C AC tests followed by normal sampling and LTPDs at group A lo
24、t acceptance. 3.6.2 Qualification. Qualification inspection shall not be required. DW NO. 77041 3.6.3 Quality conforniance inspection. Quality conformance inspection shall be in accordance with MIL-M-38510 and 4.4 herein. REV 3.7 Manufacturer eliqibility. To be eligible to supply microcircuits to th
25、is drawing, a manu- facturer must have manufacturer certification in accordance with MIL-M-38510 for at least one line and have PART I listing on Qualified Products List QPL-38510 for at least one device type (not necessarily the one for which the procurement to this drawing is to apply). 4. PRODUCT
26、 ASSIiRAFICE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. 4.2 Qualification inspection. Qualification inspection shall not be required. 4.3 Screeninq. Screening shall be i
27、n accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. jhai: dpplj: The following additional criteria a. Burn-in test (method 1015 of MIL-STO-883). (1) (2) TA = 125C minimm. Test condition O or E, each circuit must be driven with
28、an appropriate siqnal to simulate circuit applications and each circuit shall have maximum load applied. b. Interim and final electricul test parameters shall Se as speciied in table II, except interim electrical parameters test prior to born-in is optional at the discretion Of the manufacturer. Per
29、cent defective allowable (PDA) - The PDA is specified as 10 percent based on failures from group A, subgroup 1, test after cooldown as final electrical test in accordance with method 5004 of MIL-STD-883, and with no intervening electrical measurements. If interim electrical parameter tests are perfo
30、rmed prior to burn-in, failures resuitina from pre burn-in screening may be excluded from the PDA. If interim electrical Param- eter tests prior to burn-in are omitted, then all screening failures shall be included in the PDA. the total number of devices submitted for burn-in in that lot shall he us
31、ed to determine the percent defective for the lot. c. The verified failures of group A, subgroup 1, after burn-in divided by 4.4 ualit conformance inspection. Quality conformance insDection shall be in accordance with MIL-M-38kroups A and B inspections shall be performed on each lot. Ouality assuran
32、ce shall keep lot records for 3 years (minimum). monitor for compliance to the prescribed procedures, and observe that satisfactory manufacturing conditions and records on lots are maintained for these devices. The records, including as a minimum an attributes sumary of all screening and quality con
33、formance inspections conducted on each lot, shall be available for review by the Customer at a 1 1 ti mes. 4.4.1 Group A inspection. Group A inspection shall consist of the test subqroups and LTPD values shown in table I of method 5005 of MIL-STD-883 (class 4) and as follows: a. Tests shall be as sp
34、ecified in table II. b. Subgroups 4, 5. 6, and 8 of table I of method 5005 of MIL-STD-883 shall be omitted. PAGE 6 e-i Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-b OEfENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 4.4.2 Group B inspection. In group
35、 B inspection, each Inspection lot shall be subjected to the test subgroups and LTPD values shown in table IIb of method 5005 of CIL-STD-883, class B. SIZE CODE IDENT. NO. DW NO. A 14933 77041 REV PAE 7 4.4.3 Group C and group D inspection. Group C and group il inspectfons shall be as specffied in m
36、ethod 5005 of MIL-STD-883, class B. dance with MIL-M-38510. Generic test data (6.5) may be used to satisfy the requirements for aroup C and group D inspection. The frequency of testing and the sample size shall be in accor- a. b. End point electrical parameters shall be as specified fn table II. Ope
37、rating life test (method 1005 of MIL-STD-883) conditions: (1) Test condition D or E, each circuit must be driven with an appropriate sianal to simulate circuit applications and each cfrcuit shall have maximun load applied. (2) TA = 125“C, minimum. (3) Test duration: 1.000 hours. Subgroups 3 and 4 sh
38、all be added to the group C inspection requirements and shall consist of the tests, conditions, and limits specified for subgroups 10 and 11 of group A. c. 4.5 Inspection of preparation for delivery. Inspection of preparatfon for delivery shall be in tccordance with MIL-M-38510, except that the roug
39、h handling test shall not apply. TABLE II. Electrical test requirements. MIL-STD-883 test requirements 1 Subgroups l/ 1 I - I Interim electrical parameters (pre burn-in) (method 5004, 3.1.8) Fina 1 electri ca 1 test parameters (method 5004, 3.1.14) Group A test requirements 1, 2, 3, electrical param
40、eters (method 5005) Additional electrical sub- groups for group C periodic inspections ! lo l1 I i/ Subgroups per Table I, method 5005. PDA applies to subgroup 1 (see 4.3). - 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with I L -M- 3851 O. 6. NOTES
41、I - I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- 6.2 jntended use. Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function ar
42、e not available for OEM application. This drawing is intended exclusively to prevent the prolif- eration of unnecessary duplicate specifications, drawings and stock catalog listings. military specification exists and the product covered by this drawing has been qualified for listing on QPL-38510, th
43、is drawing becomes obsolete and will not be used for new design. product shall be the preferred i tem for al 1 applications. When a The QPL-38510 DEFENSE ELECTRONICS SUPPLY CENTER DAYTOM, OHIO 6.3 6.4 6.5 A 14933 77041 1 REV I PAOE 8 Ordering data. The contract or order should specify the following:
44、 a. b. Complete part number (see 1.2). Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. Requirement for certificate of compliance, if applicable. Requir
45、ements for notification of change of product or process to procuring activity, if applicable. Requirements for packaging and packing. requirements shall not affect the part number. reafiirments will not apply to direct shipment to the Government. c. d. e. f. Requirments for carrier, special lead len
46、gths or lead Conning, if applicable. These Unless otherwise specified, these Replaceability. a. b. Replaceability is determined as follows: Microcircuits covered by this drawing will replace the same generic device covered by contractor prepared specification or drawing. When Military Specification
47、MIL-M-38510/317 is issued, the part numbered devices specified in this drawing will be replaced by the microcircuit identified as part number M38510/317018-. Generic test data. Generic test data may be used to satisfy the requirements of 4.4.3. Generic test data is defined as test data from devices
48、manufactured during the same time period, by means of the same production technique. materials, controls and design, and in the same micro- circuit group (see 3.1.3(h) of MIL-M-38510) as the deliverable devices. be interpreted as covering a maximum span of 180 days between the generic test sample fa
49、brication and the fabrication of deliverable devices. period of not less than 36 months frm the date of shipment. The same time period shall The vendor is required to retain generic data for a I SIZE I CODE IDENT. NO. DWG NO. 1 I DESC FORY 144A I MAR 76 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. . . . . . . . _ . 77041 O1 FX
