1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Page 2 Deleted 1/ ref to IOS. Page 13 Corrected P/N. 79-07-23 D. R. Cool B Changes in accordance with NOR 5962-R158-96 96-06-26 M. A. Frye C Boilerplate update, part of 5 year review. REDRAWN ksr 06-03-16 Raymond Monnin D Updated body of drawing
2、to meet current requirements. - glg 12-06-22 Charles F. Saffle CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY A. J. Foley DLA LAND AND MARITIME ST
3、ANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128 X 8-BIT RANDOM ACCESS MEMORY (RAM), MONOLITHIC SILICON AND AGENCIES OF
4、 THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-06-12 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 14933 79018 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E403-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 790
5、18 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number
6、 (PIN). The complete PIN is as shown in the following example: 79018 01 J A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1823SD
7、 128 x 8 CMOS RAM 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix
8、A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 Vdc to +18 Vdc Input voltage range . -0.5 Vdc to VDD+0.5 Vdc Storage temperature range . -65C to +150C Maximum power dissipation (PD) . 500 mW 1/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC): Cas
9、e J . See MIL-STD-1835 Junction temperature (TJ. +175C 1.4 Recommended operating conditions. Supply voltage . +3.0 Vdc to +15 Vdc Ambient operating temperature range (TA) . -55C to +125C 1/ For TA= +100 to +125 C, derate linearly at 12mW/C to 200 mW. Provided by IHSNot for ResaleNo reproduction or n
10、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, stan
11、dards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification fo
12、r. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of
13、these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited her
14、ein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A f
15、or non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product i
16、n accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function
17、of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dime
18、nsions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 3
19、. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range.
20、3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed i
21、n 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certificati
22、on mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4
23、 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ Group A Limits Unit subgroups Min Max High-level output VOH VDD= 5 V VIN= 0 or VDD 1, 2, 3 4.5 V voltage 2/ VDD= 10 V 9.5 Low-level output VOL VDD= 5 V VIN= 0 or VDD 1, 2, 3 0.5 V voltage 3/ VDD= 10 V 0
24、.5 Output drive current IDN VDD= 5 V VO= 0.4 V 1, 2, 3 1.65 mA N channel (sink) 4/ VDD= 10 V VO= 0.5 V 3.6 Output drive current IDP VDD= 5 V VO= 4.6 V 1, 2, 3 -0.8 mA P channel (source) 4/ VDD= 10 V VO= 9.5 V -1.8 Input leakage current IIL VDD= 10 V 1, 2, 3 10 IIH A Quiescent current IDD VDD= 10 V 1
25、, 2, 3 1 mA 6/ 3-state output leakage IOUT VDD= 10 V 1, 2, 3 30 A current 7/ Input capacitance CIN 4 7.5 pF VIN= 0 V TA= 25C Functional test See 4.4.1(d) 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79018 DLA
26、 LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions Group A subgroups Limits Units Min Max Access time from address ta(ad)CL= 50 pF 10% tr,tf= 10 ns 5% VDD= 5V TA = 25C , -55C
27、9, 11 600 ns VDD= 5V TA = 125C 10 840 VDD= 10V TA = 25C , -55C 9, 11 315 VDD= 10V TA = 125C 10 440 Access time from chip select ta( cs )VDD= 5V TA = 25C , -55C 9, 11 230 VDD= 5V TA = 125C 10 320 VDD= 10V TA = 25C , -55C 9, 11 140 VDD= 10V TA = 125C 10 195 Output active from MRD tamVDD= 5V TA = 25C ,
28、 -55C 9, 11 230 VDD= 5V TA = 125C 10 320 VDD= 10V TA = 25C , -55C 9, 11 140 VDD= 10V TA = 125C 10 195 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION
29、LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions Group A subgroups Limits Units Min Max Pulse width, write tw(wr)CL= 50 pF 10% tr. tf= 10 ns 5% VDD= 5V TA = 25C , -55C 9, 11 260 ns VDD= 5V TA = 125C 10 360 VDD= 10V TA = 25C , -
30、55C 9, 11 135 VDD= 10V TA = 125C 10 190 Data in setup time tsu(DI)VDD= 5V TA = 25C , -55C 9, 11 260 VDD= 5V TA = 125C 10 360 VDD= 10V TA = 25C , -55C 9, 11 135 VDD= 10V TA = 125C 10 190 Data in hold time th(DI)VDD= 5V TA = 25C , -55C 9, 11 90 VDD= 5V TA = 125C 10 125 VDD= 10V TA = 25C , -55C 9, 11 5
31、0 VDD= 10V TA = 125C 10 70 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance chara
32、cteristics - Continued. Test Symbol Conditions Group A subgroups Limits Units Min Max Chip select setup time tsu( cs )CL= 50 pF 10% tr. tf= 10 ns 5% VDD= 5V TA = 25C , -55C 9, 11 360 ns VDD= 5V TA = 125C 10 505 VDD= 10V TA = 25C , -55C 9, 11 200 VDD= 10V TA = 125C 10 280 Address setup time tsu(ad)VD
33、D= 5V TA = 25C , -55C 9, 11 250 VDD= 5V TA = 125C 10 350 VDD= 10V TA = 25C , -55C 9, 11 130 VDD= 10V TA = 125C 10 180 Address hold time th(ad)VDD= 5V TA = 25C , -55C 9, 11 90 VDD= 5V TA = 125C 10 125 VDD= 10V TA = 25C , -55C 9, 11 50 VDD= 10V TA = 125C 10 125 Provided by IHSNot for ResaleNo reproduc
34、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in orde
35、r to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and th
36、e requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required fo
37、r any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at
38、 the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality
39、conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, D, or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring
40、activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II he
41、rein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following ad
42、ditional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINmeasurement) shall be measured only for initial qualification and after any process or desig
43、n changes which may affect input or output capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and output terminals tested. d. Subgroups 7 shall include verification of the truth table.
44、4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition D or E. The test circuit shall be maintained by the manufacturer under document revision level control a
45、nd shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 ho
46、urs, except as permitted by method 1005 of MIL-STD-883.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79018 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 Device Type 01 Case Outline J Terminal Number Terminal Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BUS 0 BUS 1 BUS 2 BUS 3 BUS 4 BUS 5 BUS 6 BUS 7 CS1 2CS3CS VSSCS4 5CS MRD MWR MA6 MA5 MA4 MA3 MA2 MA1 MA0 VDDFIGURE 1. Terminal connections. Provided by IH
