1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 02 and 03. Add vendor CAGE 61772 for device types 02 and 03. Delete vendor CAGE 61772 for device type 01. Add vendor CAGE 75569 for device types 02 and 03. Technical and editorial changes throughout. 92-03-06 Michael A. Frye B Up
2、dated to reflect current MIL-PRF-38535 requirements.- jak 12-12-04 Thomas M. Hess REV SHEET REV B SHEET 15 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jeffery Tunstall DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landa
3、ndmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Ray Monnin APPROVED BY Donald R. Cool MICROCIRCUIT, DIGITAL, FAST CMOS SYNCHRONOUS PRESETTABLE BINARY, COUNTER, TTL COMPATIBLE, MONOLITHIC SILICO
4、N DRAWING APPROVAL DATE 88-09-30 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88640 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E035-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88640 DLA LAND AND
5、 MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The com
6、plete PIN is as shown in the following example: 5962-88640 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1/ 54FCT161 Pres
7、ettable binary counter, synchronous, TTL compatible 02 54FCT161 Presettable binary counter, synchronous, TTL compatible 03 54FCT161A Presettable binary counter, synchronous, TTL compatible 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Des
8、criptive designator Terminals Package style E GDIP1-T16 or CDIP2-F16 16 dual-in-line F GDIP1-F16 or CDFP2-F16 16 flat package 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1/ Due to internal noise problems, device type 01 does not
9、 meet the minimum VIHthreshold limits characteristic of the FCT family or the limits specified on this drawing. The device type is no longer available for acquisition. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE
10、 A 5962-88640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc 2/ DC output voltage range (VOUT) . -0.5 V dc to
11、VCC+ 0.5 V dc 2/ DC input diode current (IIK) . -20 mA DC output diode current (IOK) -50 mA DC output current (IOUT) 100 mA Maximum power dissipation (PD) 500 mW 3/ Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Storage temperature range (TSTG) -65C to +150C Junction temperature (TJ) . +
12、175C Lead temperature (soldering, 10 seconds) . +300C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Maximum low level input voltage (VIL). 0.8 V dc Minimum high level input voltage (VIH) 2.0 V dc 4/ Case operating temperature range (TC) -55C to +125C Minim
13、um setup time, high or low (Pn to CP) (ts1): Device types 01 and 02 5.5 ns Device type 03 4.5 ns Minimum setup time, high or low (PE to CP) (ts2): Device types 01 and 02 13.5 ns Device type 03 11.5 ns Minimum setup time, high or low (CEP, CET to CP) (ts3): Device types 01 and 02 13.0 ns Device type
14、03 11.0 ns Minimum hold time, high or low (Pn to CP) (th1) 2.0 ns Minimum hold time, high or low (PE to CP) (th2) . 1.5 ns Minimum hold time, high or low (CEP, CET to CP) (th3) 0.0 ns Minimum CP pulse width, high, low (load) (tw1): Device types 01 and 02 5.0 ns Device type 03 4.0 ns Minimum CP pulse
15、 width, high, low (count) (tw2): Device types 01 and 02 8.0 ns Device type 03 7.0 ns Minimum MR pulse width, low (tw3): Device types 01 and 02 5.0 ns Device type 03 4.0 ns Maximum recovery time MR to CP (tREC): Device type 01 6.0 ns Device type 02 5.0 ns _ 1/ All voltages are referenced to ground. 2
16、/ For VCC 6.5 V dc, the upper bound is limited to VCC. 3/ Must withstand the added PDdue to short circuit test, e.g., IOS. 4/ For dynamic operation of device type 01, a VIHlevel between 2.0 V and 3.0 V may be recognized by this device as a high logic level input. For static operation of device type
17、01, a VIH 2.0 V will be recognized by these devices as a high logic level input. Users are cautioned to verify that this change will not affect their system. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88
18、640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless
19、otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL
20、-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the S
21、tandardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, super
22、sedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing
23、that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approv
24、al in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ o
25、r “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(
26、s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Logic diagram(s). The logic diagram(s) shall be as specified on
27、figure 3. 3.2.5 Counting sequence. The counting sequence shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the elect
28、rical performance characteristics are as specified in table I and shall apply over the full (case or ambient) operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are descr
29、ibed in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordanc
30、e with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5
31、962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to iden
32、tify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior t
33、o listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot
34、 of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain
35、 the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWIN
36、G SIZE A 5962-88640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VCC= 5.0 V dc 10% unless otherwise specified Device type VCCGroup A subgroups Limits Unit Min Max H
37、igh level output voltage VOH1/ VIL= 0.8 V VIH= 2.0 V IOH= -300 A All 4.5 V 1, 2, 3 4.3 V VIL= 0.8 V VIH= 2.0 V IOH= -12 mA All 4.5 V 2.4 Low level output voltage VOL1/ VIL= 0.8 V VIH= 2.0 V IOL= 300 A 2/ All 4.5 V 1, 2, 3 0.2 V VIL= 0.8 V VIH= 2.0 V IOL= 32 mA All 4.5 V 0.5 Input clamp voltage VIKII
38、N= -18 mA All 4.5 V 1 -1.2 V High level input current IIHVIN= 5.5 V All 5.5 V 1, 2, 3 5.0 A Low level input current IILVIN= GND All 5.5 V 1, 2, 3 -5.0 A Short circuit output current IOS3/ All 5.5 V 1, 2, 3 -60 mA Quiescent power supply current (CMOS inputs) ICCQVIN 0.2 V or VIN 5.3 V fi= 0 MHz All 5
39、.5 V 1, 2, 3 1.5 mA Quiescent power supply current (TTL inputs) ICC4/ VIN= 3.4 V All 5.5 V 1, 2, 3 2.0 mA Dynamic power supply current ICCD5/ VIN 0.2 V or VIN 5.3 V MR = VCCOutputs open, one bit toggling 50% duty cycle All 5.5 V 3/ 0.4 mA/ MHz Total power supply current ICC6/ fCP= 10 MHz Outputs ope
40、n, VIN 5.3 V or VIN 0.2 V One bit toggling at fi= 5 MHz, 50% duty cycle All 5.5 V 1, 2, 3 4.0 mA fCP= 10 MHz Outputs open VIN 3.4 V or VIN= GND One bit toggling at fi= 5 MHz, 50% duty cycle All 5.5 V 1, 2, 3 6.0 mA Input capacitance CINSee 4.3.1c All 4 10 pF Output capacitance COUTSee 4.3.1c All 4 1
41、2 pF Functional tests 7/ See 4.3.1d All 7, 8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC
42、FORM 2234 APR 97 Test Symbol Conditions -55C TC +125C VCC= 5.0 V dc 10% unless otherwise specified Device type VCCGroup A subgroups Limits Unit Min Max Propagation delay time, CP to Q (PE input high) tPLH1, tPHL18/ CL= 50 pF minimum RL= 500 See figure 5 01, 02 4.5 V 9, 10, 11 2.0 11.5 ns 03 4.5 V 2.
43、0 7.5 Propagation delay time, CP to Q (PE input low) tPLH2, tPHL28/ 01, 02 4.5 V 9, 10, 11 2.0 10.0 ns 03 4.5 V 2.0 6.5 Propagation delay time, CP to TC tPLH3, tPHL38/ 01, 02 4.5 V 9, 10, 11 1.5 16.5 ns 03 4.5 V 1.5 10.8 Propagation delay time, CET to TC tPLH4, tPHL48/ 01, 02 4.5 V 9, 10, 11 2.0 9.0
44、 ns 03 4.5 V 2.0 5.9 Propagation delay time, MR to TC tPHL58/ 01, 02 4.5 V 9, 10, 11 2.0 12.5 ns 03 4.5 V 2.0 8.2 Propagation delay time, CET to TC tPHL68/ 01, 02 4.5 V 9, 10, 11 2.0 14.0 ns 03 4.5 V 2.0 9.1 1/ For dynamic operation of device type 01, a VIH level between 2.0 V and 3.0 V may be recog
45、nized by this device as a high logic level input. For static operation of device type 01, a VIH- 2.0 V will be recognized by this device as a high logic level input. Users are cautioned to verify that this change will not affect their system. 2/ Guaranteed by testing at worst case condition of VCC=
46、3 volts. 3/ Not more than one output should be shorted at one time Duration of the short circuit test should not exceed 1 second. 4/ In accordance with TTL driven input (VIN = 3.4 V dc); all other outputs at VCCor GND. 5/ This parameter is not directly testable, but is derived for use in total power
47、 supply calculations. 6/ ICC= ICCQ+(_ICCx DH x NT) + ICCD(fcp/2 + fI x NI). Where DH= Duty cycle for TTL inputs high. NT= Number of TTL inputs at DH. fI = Input frequency in MHz. NI= Number of inputs at fI. 7/ Due to internal noise problems, device type 01 cannot meet the threshold limits required i
48、n accordance with MIL-STD-883, test method 5004, for the VIHminimum limit (2.0 V) of this technology family. For device types 02 and 03, use a VIHlimit of 3.0 V. The VIL limit (0.8 V) remains unchanged. Users are cautioned to verify that this change will not affect their system. 8/ Minimum limits are guaranteed, if not tested on propagation delays Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Devi
