1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes in table I. Editorial changes throughout. 90-11-07 W. K. Heckman B Corrections on figure 2. Corrections on table I prop delays. Editorial changes throughout. 92-02-05 Monica L. Poelking C Changes in accordance with NOR 5962-R316
2、-92. 92-09-11 Monica L. Poelking D Update to current requirements. Editorial changes throughout. - gap 06-06-05 Raymond Monnin The original first page of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A
3、PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim H. Noh COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, 8-BIT
4、 UNIVERSAL REGISTER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-04-14 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-89573 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E336-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without l
5、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89573 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
6、 accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89573 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circui
7、t function as follows: Device type Generic number Circuit function 01 54F299 8-bit universal shift/storage registers with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R G
8、DIP1-T20 or CDIP2-T20 20 dual-in-line S GDFP2-F20 or CDFP3-F20 20 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VCC) . -0.5 V dc minimum to +7.0 V dc maximum Input voltage r
9、ange . -1.2 V dc at -18 mA to +7.0 V dc Input current range -30 mA to +5.0 mA Voltage applied to any output in the disabled or power-off state . -0.5 V dc to +5.5 V dc Voltage applied to any output in the high state -0.5 V dc to VCCCurrent into any output in the low state . +40 mA Storage temperatur
10、e range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Power dissipation (PD) 1/ . +523 mW 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maxi
11、mum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit output test; e.g., IOS. Provided by IHSNot for R
12、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89573 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handb
13、ooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits,
14、Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Stan
15、dard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conf
16、lict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item re
17、quirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitiona
18、l certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements he
19、rein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, an
20、d physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on f
21、igure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be specified on figure 4. Provided by IHSNot for ResaleN
22、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89573 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, t
23、he electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described
24、in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations,
25、 the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certi
26、fication mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of com
27、pliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, append
28、ix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to r
29、eview the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Scr
30、eening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shal
31、l be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in meth
32、od 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or net
33、working permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89573 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwis
34、e specified Group A subgroups Limits Unit Min Max High level output VOHVCC= 4.5 V, IOH= -1.0 mA QAor QH1, 2, 3 2.5 V voltage VIL= 0.8 V, IH= 2.0 V IOH= -1.0 mA A/QAto H/QH2.5 OH= -3.0 mA 2.4 Low level output VOLVCC= 4.5 V, QAor QH1, 2, 3 0.5 V voltage VIL= 0.8 V, IH= 2.0 V, A/QAto H/QH0.5 IOL= 20 mA
35、 Input clamp VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 -1.2 V voltage High level input IIH1VCC= 5.5 V VIN= 5.5 V A/QAto H/QH1, 2, 3 1.0 mA current IN= 7.0 V 1/ All other 1.0 IIH2VCC= 5.5 V, A/QAto H/QH1, 2, 3 70 A VIN= 2.7 V 2/ All other 20 Low level input IILVCC= 5.5 V, A/QAto H/QH1, 2, 3 -0.65 mA current
36、 VIN= 0.5 V 2/ S0 or S1 -1.2 All other -0.6 Off-state output IOZHVCC= 5.5 V, 1G = 2G = 5.5 V, 1, 2, 3 70 A current VOUT= 2.7 V, high level voltage applied IOZLVCC= 5.5 V, 1G = 2G = 5.5 V, -0.65 mA OUT= 0.5 V, low level voltage applied Short-circuit IOSVOUT= 0.0 V, 1, 2, 3 -60 -150 mA output current
37、VCC= 5.5 V 3/ Supply current ICCVCC= 5.5 V 4/ 1, 2, 3 95 mA Functional tests See 4.3.1c, VCC= 4.5 V, 5.5 V 5/ 7, 8 Maximum clock frequency fMAX 6/ 7/ 9, 10, 11 70 MHz See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAN
38、DARD MICROCIRCUIT DRAWING SIZE A 5962-89573 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Limits Un
39、it Min MaxSetup time, before ts1VCC= 4.5 V and 5.5 V, S0 or S1 high 9, 10, 11 9.5 ns CLK going high CL= 50 pF, RL= 500, S0 or S1 low 7.5 See figure 4 5/ ts2A/QAto H/QH, 4.5 ns SR or SL high or low ts3CLR high, 12.5 ns inactive-state Hold time, after th1S0 or S1 high or low 9, 10, 11 0 ns CLK going h
40、igh th2A/QAto H/QH, 2.0 ns SR or SL high or low Pulse duration tw1CLK high 9, 10, 11 7.0 ns or low tw2CLR low 7.0 ns Propagation delay tPLH1CL= 50 pF, VCC= 5.0 V 9 3.5 7.0 ns time, from CLK to RL= 500, VCC= 4.5 V and 5.5 V 10, 11 3.5 9.0 QA, QHtPHL1See figure 4 5/ VCC= 5.0 V 9 4.5 9.0 VCC= 4.5 V and
41、 5.5 V 10, 11 4.5 9.5 Propagation delay tPLH2VCC= 5.0 V 9 4.0 9.0 ns time, from CLK to VCC= 4.5 V and 5.5 V 10, 11 4.0 11.0 A/QAto H/QHtPHL2VCC= 5.0 V 9 5.0 9.0 VCC= 4.5 V and 5.5 V 10, 11 5.0 11.5 Propagation delay tPHL3VCC= 5.0 V 9 5.5 9.5 ns time, from CLR to QAor QHVCC= 4.5 V and 5.5 V 10, 11 5.
42、5 11.5 Propagation delay tPHL4VCC= 5.0 V 9 5.5 10.0 time, from CLR to A/QAto H/QHVCC= 4.5 V and 5.5 V 10, 11 5.5 11.5 Output enable time, tPZHVCC= 5.0 V 9 3.5 8.0 ns from 1G, 2G to VCC= 4.5 V and 5.5 V 10, 11 2.7 10.5 A/QAto H/QHtPZLVCC= 5.0 V 9 4.0 10.0 VCC= 4.5 V and 5.5 V 10, 11 4.0 12.0 Output d
43、isable tPHZVCC= 5.0 V 9 2.5 7.0 ns time, from 1G, VCC= 4.5 V and 5.5 V 10, 11 1.7 9.0 2G to A/QAto tPLZVCC= 5.0 V 9 1.5 5.5 H/QHVCC= 4.5 V and 5.5 V 10, 11 1.5 7.5 See footnotes on next page.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI
44、CROCIRCUIT DRAWING SIZE A 5962-89573 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ For device types with npn output transistor configuration, VCC= 0.0 V. 2/ For I/O ports (A/QAto
45、 H/QH), the parameters IIH2and IILinclude the off-state output current. 3/ Not more than one output will be shorted at one time and the duration of the short-circuit condition shall not exceed one second. 4/ ICCis measured with 1G, 2G , and CLK at 4.5 V. 5/ Functional tests shall be conducted at inp
46、ut test conditions of GND VIL VOLand VIH VCC. 6/ Subgroup 9 testing is performed at VCC= 5.0 V. Subgroups 10 and 11 testing is performed at VCC= 4.5 V and repeated at VCC= 5.5 V. 7/ For subgroups 10 and 11, fMAX, if not tested, shall be guaranteed to the specified limit. 4.3 Quality conformance insp
47、ection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I,
48、method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revisio
