DLA SMD-5962-90813 REV C-2007 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVERS MONOLITHIC SILICON《硅单块 场致发光的行设备 直线式微型电路》.pdf

上传人:fuellot230 文档编号:699878 上传时间:2019-01-01 格式:PDF 页数:12 大小:121.65KB
下载 相关 举报
DLA SMD-5962-90813 REV C-2007 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVERS MONOLITHIC SILICON《硅单块 场致发光的行设备 直线式微型电路》.pdf_第1页
第1页 / 共12页
DLA SMD-5962-90813 REV C-2007 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVERS MONOLITHIC SILICON《硅单块 场致发光的行设备 直线式微型电路》.pdf_第2页
第2页 / 共12页
DLA SMD-5962-90813 REV C-2007 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVERS MONOLITHIC SILICON《硅单块 场致发光的行设备 直线式微型电路》.pdf_第3页
第3页 / 共12页
DLA SMD-5962-90813 REV C-2007 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVERS MONOLITHIC SILICON《硅单块 场致发光的行设备 直线式微型电路》.pdf_第4页
第4页 / 共12页
DLA SMD-5962-90813 REV C-2007 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVERS MONOLITHIC SILICON《硅单块 场致发光的行设备 直线式微型电路》.pdf_第5页
第5页 / 共12页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R230-92. 92-06-25 M. A. Frye B Changes in accordance with NOR 5962-R067-94. 93-12-16 M. A. Frye C Incorporate revisions A and B NOR. Update drawing to current requirements. Editorial changes throughout. - drw 0

2、7-07-17 Robert Heber THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E Besor

3、e COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, ELECTROLUMINESCENT ROW DRIVERS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-03-23 MONOLITHIC SILICON AMSC N/A REVISION LEVE

4、L C SIZE A CAGE CODE 67268 5962-90813 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E536-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION L

5、EVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part o

6、r Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90813 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class desig

7、natorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-3853

8、5, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 55563A Electroluminescent row drivers 01 55564A

9、Electroluminescent row drivers 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class lev

10、el B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style X CQCC2-J44 44 J-leaded chip carrier

11、 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE S

12、UPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC1). -0.5 V dc to +15.0 V dc Supply voltage range (VCC2). -0.5 V dc to +230 V dc Supply voltage range (VCC3). -0.5 V dc to +230 V dc Supply voltage

13、(VSS). -230 V dc DC input voltage -0.3 V dc to VCC1+ 0/3 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 2/ . 1825 mW Lead temperature (soldering, 10 seconds). +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C 1.4 Recommen

14、ded operating conditions. Supply voltage range (VCC1). +10.8 V dc minimum to +13.2 V dc maximum Supply voltage range (VCC2). VCC3 15 V dc minimum to VCC3maximum Supply voltage range (VCC3). 0.0 V dc minimum to +225 V dc maximum Supply voltage range (VSS) 0.0 V dc minimum to -225 V dc maximum Minimum

15、 high-level input voltage (VIH). 0.75 VCC1minimum to VCC1+0.3 V dc Maximum low-level input voltage (VIL) -0.3 V dc minimum to 0.25 VCC1Maximum high-level output current (IOH) -70 mA Maximum low-level output current (IOL) 120 mA Maximum output clamp current (IOK) 150 Ambient operating temperature ran

16、ge (TA) -55C to +125C Pulse duration (tW): CLK high. 125 ns minimum CLK low 125 ns minimum Setup time (tS1) DATA IN high or low before CLK going low 100 ns minimum Setup time (tS2) CLK low before VCC2going high or VSSgoing low 3/. 300 ns minimum Setup time (tS3) ENABLE high before VCC2going high or

17、VSSgoing low 3/ 300 ns minimum Setup time (tS4) POS WRITE high or low before VCC2going high or VSSgoing low 3/ . 300 ns minimum Hold time (tH1) DATA IN high or low after CLK going low. 100 ns minimum Hold time (tH2) CLK high after VCC2going low or VSSgoing high 3/ 300 ns minimum Hold time (tH3) ENAB

18、LE high after VCC2going low or VSSgoing high 3/ . 0 ns minimum Hold time (tH4) POS WRITE high or low after VCC2going low or VSSgoing high 3/ 0 ns minimum Hold time (tH5) ENABLE low between successive VCC2going high 3/. 12 ns minimum Hold time (tH6) ENABLE low between successive VSSgoing low 3/ 300 n

19、s minimum _ 1/ Voltage values are with respect to VSS. 2/ For operation above +25C free air temperature, derate 14.6 mW/C. 3/ Performance is dependent on application; voltage and temperature must be validated by the user. Provided by IHSNot for ResaleNo reproduction or networking permitted without l

20、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and hand

21、books form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT O

22、F DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents

23、 are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the re

24、ferences cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be i

25、n accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance

26、 with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A an

27、d herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Propagation delay waveforms.

28、 The propagation delay waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shal

29、l apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2

30、herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still

31、 be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MI

32、L-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

33、 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VCC1= 10.8 V dc to 13.2 V dc VCC2= VCC3= 0 to +225 V dc VSS= 0 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max High level ou

34、tput voltage VOHQ outputs IO= -70 mA 1, 2, 3 All VCC2- 40 V Serial out VCC1= 12 V, IO= -100 A 10.5 Low level output voltage VOLQ outputs IO= 120 mA 1, 2, 3 All 30 V Serial out IO= 100 A 1 High level input current IIHVIH= VCC11, 2, 3 All 100 A Low level input current IILVIL= 0 V 1, 2, 3 All -100 A Of

35、f state Q output current IO(OFF)VO= 225 V 1, 2, 3 All 150 A VO= 0 V -150 Supply current from VCC1ICC1One Q output high 1, 2, 3 All 4 mA All Q outputs low or high impedance 2 Supply current from VCC3ICC3One Q output high 1, 2, 3 All 10 mA 1/ All Q outputs low or high impedance 200 A Functional tests

36、2/ See 4.4.1b 7, 8 All Maximum frequency fMAXCL= 50 pF to VSS4 All 1 MHz Propagation delay time, level serial output from tPLHCL= 50 pF to VSS, See figure 3 9 All 400 ns CLK tPHL400 1/ ICC3is measured with VCC2and VCC3shorted together. 2/ Functional tests shall be conducted at input test conditions

37、of GND VIL VOLand VOH VIH VCC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device types 01 02

38、Case outline X Terminal number Terminal symbol 1 Q6 Q29 2 Q7 Q28 3 Q8 Q27 4 Q9 Q26 5 Q10 Q25 6 Q11 Q24 7 Q12 Q23 8 Q13 Q22 9 Q14 Q21 10 Q15 Q20 11 Q16 Q19 12 Q17 Q18 13 Q18 Q17 14 Q19 Q16 15 Q20 Q15 16 Q21 Q14 17 Q22 Q13 18 Q23 Q12 19 Q24 Q11 20 Q25 Q10 21 Q26 Q9 22 Q27 Q8 23 Q28 Q7 24 Q29 Q6 25 Q30

39、 Q5 26 Q31 Q4 27 Q32 Q3 28 Q33 Q2 29 Q34 Q1 30 SERIAL OUT SERIAL OUT 31 ENABLE ENABLE 32 CLK CLK 33 VSSVSS34 N/C N/C 35 VCC1VCC136 POS WRITE POS WRITE 37 DATA IN DATA IN 38 VCC2VCC239 VCC3 CC340 Q1 Q34 41 Q2 Q33 42 Q3 Q32 43 Q4 Q31 44 Q5 Q30 N/C No internal connection FIGURE 1. Terminal connections.

40、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Load function table Control inputs Outputs Functi

41、on CLK ENABLE POS WRITE Shift register R1 through R34 Serial Q1 through Q34 Load X X Load and shift (See note) R34 Determined by ENABLE and POS WRITE Load No X X No change R34 Determined by ENABLE and POS WRITE NOTE: Register R34 takes on the state of R33, R33 takes on the state of R32, . R2 takes o

42、n the state of R1, R1 takes on the state of the data input. Output control function table Control inputs Outputs Function CLK ENABLE POS WRITE Shift register contents Rn for R1 through R34 (determined above) Serial Q1 through Q34 X L X X R34 High-impedance X H H H R34 H X H L L R34 L Output control

43、X X X X R34 High-impedance H = High voltage level L = Low voltage level X = Irrelevant = High-to-low transition FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE SUPPLY CENT

44、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Propagation delay waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90813 DEFENSE SUPPLY CENTER COLUMBUS

45、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For devic

46、e class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm tha

47、t the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-

48、38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to revi

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1