1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Y, which is a 16 lead flat pack. Make changes to 1.2.4, 1.3, and figure 1. - ro 99-02-10 R. MONNIN B Make change to dropout voltage test as specified in table I. - ro 99-08-13 R. MONNIN C Make change to short circuit current test
2、 as specified in table I. - ro 01-02-05 R. MONNIN D Add device class V devices and table IIB. - ro 01-05-01 R. MONNIN E Drawing updated to reflect current requirements. -rrp 06-12-04 R. MONNIN F Add device type 02 tested at low dose rate. Add paragraphs 1.5, 3.2.3, and 4.4.4.1. Add one footnote to T
3、able IIB. Make changes to 1.2, 1.2.2, Table I, and figure 2. Add paragraph 3.1.1 and microcircuit die appendix A. - ro 09-04-21 J. RODENBECK G Add device type 03 and 04. Add footnote to paragraph 1.2.4. Make changes to paragraphs 1.3, 1.5, A.1.2, A.1.2.2, Table I, and Figure 2. Make change to table
4、IIB footnote and title. 11-12-13 C. SAFFLE REV SHET REV G G G G G G G SHEET 15 16 17 18 19 20 21 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla
5、.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEAR, ADJUSTABLE, 1 A, POSITIVE VOLTAGE REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 97-04-25
6、 AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 67268 5962-91667 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E097-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91667 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3
7、990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected
8、 in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 R 91667 04 V Y A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Devic
9、e class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the
10、MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM2941 Adjustable, 1 amp, positi
11、ve voltage regulator 02 LM2941 Radiation hardened adjustable, 1 amp, positive voltage regulator 03 LM2941 Adjustable, 1 amp, positive voltage regulator 04 LM2941 Radiation hardened adjustable, 1 amp, positive voltage regulator 1.2.3 Device class designator. The device class designator is a single le
12、tter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification t
13、o MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-lineX See figure 1 4 Flange mount Y 1/ GDFP1-G16 16 Flat pack with gull wing leads _ 1/ For c
14、ase outline letter Y, device types 01 and 02 package material is aluminum nitride and the device types 03 and 04 package material is aluminum oxide. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91667 DLA L
15、AND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Input voltage (VIN) (survival vol
16、tage 100 ms) . 60 V Internal power dissipation Internally limited 3/ Maximum junction temperature (TJ) 150C Storage temperature range . -65C TJ +150C Lead temperature (soldering, 10 seconds) 300C Thermal resistance, junction-to-case (JC): Device types 01 and 02: Case E . 3C/W Cases X and Y . 5C/W De
17、vice types 03 and 04: Case Y 1/ 13C/W Thermal resistance, junction-to-ambient (JA): Device types 01 and 02: Case E . 73C/W Case X . 40C/W Case Y . 122C/W Device types 03 and 04: Case Y 1/ . 136C/W (still air) 87C/W (linear feet per minute air flow) 1.4 Recommended operating conditions. Maximum input
18、 voltage (VIN) . 26 V Ambient operating temperature range (TA) . -55C TA +125C 1.5 Radiation features. Device types 02 and 04: Maximum total dose available (dose rate = 10 mrads (Si)/s) . 100 krads (Si) 4/ The manufacturer supplying RHA parts on this drawing has completed Lot Acceptance testing at L
19、ow Dose Rate (LDR) (10 mrad/s) on these RHA marked parts. The Low Does Rate testing that was performed demonstrates that these parts from the lot tested do not have an Enhanced Low Dose rate Sensitivity as defined by Method 1019, condition D. Lot Acceptance Testing at LDR will continue to be perform
20、ed on each wafer or wafer lot until characterization testing has been performed in accordance with Method 1019 of MIL-STD-883. Since the redesigned part did not demonstrate ELDRS per Method 1019 and the previously tested device was ELDRS, the part number will be changed to 02 and 04 devices to disti
21、nguish the 4 parts. _ 1/ For case outline letter Y, device types 01 and 02 package material is aluminum nitride and the device types 03 and 04 package material is aluminum oxide. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum
22、 levels may degrade performance and affect reliability. 3/ The maximum power dissipation must be derated at elevated temperatures and is dictated by maximum junction temperature, package junction to ambient thermal resistance, and ambient temperature. The maximum allowable power dissipation at any t
23、emperature is PDmaximum = (TJmaximum - TA) / JAor the number given in the absolute maximum ratings, whichever is lower. 4/ For device types 02 and 04, these parts have been tested and do not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guaranteed for
24、 the conditions specified in MIL-STD-883, test method 1019, conditions A and D. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91667 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 D
25、SCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the soli
26、citation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT
27、OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phil
28、adelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has bee
29、n obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the
30、form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this do
31、cument. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in acc
32、ordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available t
33、o the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over th
34、e full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In add
35、ition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Ma
36、rking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91
37、667 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as req
38、uired in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance
39、 shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers p
40、roduct meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device c
41、lass M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawin
42、g is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Of
43、fshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduc
44、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91667 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unle
45、ss otherwise specified Group A subgroups Device type Limits Unit Min Max Reference voltage VREFIOUT= 5 mA to 1 A 1 01, 02, 1.237 1.313 V 2,3 03, 04 1.211 1.339 Line regulation VLNVIN= VOUT+ 2 V to 26 V, IOUT= 5 mA 1,2,3 01, 02, 03, 04 10 mV/V Load regulation VLDIOUT= 50 mA to 1 A 1,2,3 01, 02, 03, 0
46、4 10 mV/V Quiescent current IQVIN= VOUT+ 2 V to 26 V, 1 01, 02, 15 mA IOUT= 5 mA 2,3 03, 04 20 VIN= VOUT+ 5 V, 1 45 IOUT= 1 A 2,3 60 Dropout voltage VDOIOUT= 1 A 1 01, 02, 0.8 V 2,3 03, 04 1.0 IOUT= 100 mA 1 200 mV 2,3 300 Short circuit current ISCVINmax = 26 V 1 01, 02, 1.6 3.5 A 2,3 03, 04 1.3 3.7
47、 Maximum operational input voltage VIN1,2,301, 02, 03, 04 26 V dc Reverse polarity dc input voltage VINVOUT -0.6 V, 4/ 1,2,3 01, 02, -15 V ROUT= 100 03, 04 ON / OFF threshold voltage on V(TO)IOUT 1 A 4/ 1,2,3 01, 02, 03, 04 0.8 V ON / OFF threshold voltage off V(TO)IOUT 1 A 4/ 1,2,3 01, 02, 03, 04 2
48、.0 V ON / OFF threshold current ITVON / OFF= 2.0 V, 1 01, 02, 100 A IOUT 1 A 2,3 03, 04 300 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91667 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Maximum line transient VLTVOUT
