DLA SMD-5962-93265 REV E-2009 MICROCIRCUIT LINEAR LOW DROPOUT CONTROLLER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Add case outline P. Make changes to 1.2.2, 1.3, table I, figure 1, and figure 2. 94-01-13 M. A. FRYE B Changes in accordance with N.O.R. 5962-R154-94. 94-04-19 M. A. FRYE C Changes in accordance with N.O.R. 5962-R207-95. 95-10

2、-11 M. A. FRYE D Drawing updated to reflect current requirements. - ro 02-02-04 R. MONNIN E Update SMD paragraphs to current MIL-PRF-38535 requirements. -rrp 09-09-09 C. SAFFLE REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PR

3、EPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, LOW DROPOUT, CONTROLLER, MONOLIT

4、HIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-11-02 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-93265 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E225-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

5、 MICROCIRCUIT DRAWING SIZE A 5962-93265 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application

6、(device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93265 0

7、1 M C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA level

8、s and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit fun

9、ction as follows: Device type Generic number Circuit function 01 UC1832 Low dropout linear controller 02 UC1833 Low dropout linear controller 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirem

10、ents documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-S

11、TD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q an

12、d V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93265 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR

13、97 1.3 Absolute maximum ratings. 1/ Supply voltage (+VIN) 40 V Driver output current (sink or source) 450 mA Driver sink to source voltage . 40 V TRC pin voltage . -0.3 V to +3.2 V Other input voltages -0.3 V to +VINJunction temperature (TJ) -55C to +150C Storage temperature -65C to +150C Lead tempe

14、rature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) Case C 110C/W Case P . 160C/W Case 2 . 70C/W 1.4 Recommended operating conditions. Supply voltage (+VIN) +15 V Ambient operating temperature range (TA) . -55

15、C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation o

16、r contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE

17、 HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, P

18、A 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

19、 _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

20、DRAWING SIZE A 5962-93265 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as

21、 modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B dev

22、ices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case ou

23、tlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagrams. The logic diagrams shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless

24、 otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specif

25、ied in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitat

26、ions, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38

27、535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device clas

28、ses Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source

29、 of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for devic

30、e class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to t

31、his drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device cl

32、ass M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class

33、 M devices covered by this drawing shall be in microcircuit group number 110 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93265 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHI

34、O 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Input supply section Supply current IIN+VIN= 6 V 1,2,3 All 10 mA +VIN=

35、36 V 15 Reference section Output voltage VOUTIDRIVER= 10 mA 3/ 1 All 1.98 2.02 V 2,3 1.96 2.04 Load regulation VLDIOUT= 0 mA to 10 mA 1,2,3 01 -10 mV Line regulation VLN+VIN= 4.5 V to 36 V, IDRIVER= 10 mA 1,2,3 All 0.5 mV/V Under-voltage lockout threshold UVLO 1,2,3 All 4.5 V Logic disable input sec

36、tion Threshold voltage VTH1,2,3 01 1.3 1.5 V Input bias current IIBLogic disable pin = 0 V 1,2,3 01 -5.0 A Current sense section VADJpin input current IADJVADJ= 0 V 1,2,3 01 -10 A Input bias current IIBVCM= +VIN1,2,3 All 65 135 A Input offset current IIOVCM= +VIN1,2,3 01 -10 10 A See footnotes at en

37、d of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93265 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charac

38、teristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Current sense section continued. Comparator offset voltage VOS1 All 95 105 mV 2,3 93 107 Amplifier offset voltage VOSVADJ= open 1,2,3 01 110 170 mV VADJ= 1 V 1

39、80 290 VADJ= 0 V 250 360 02 110 170 Timer section Inactive leakage current IILC/S(+) = C/S(-) = +VIN, TRC pin = 2 V 1,2,3 All 1.0 A Active pullup current IAPC/S(+) = +VIN, C/S(-) = +VIN 0.4 V, TRC pin = 0 V 1,2,3 All -345 -175 A Error amplifier section Input offset voltage VIOVCM= VCOMP= 2 V 1,2,3 0

40、1 -8.0 8.0 mV Input bias current IIBVCM= VCOMP= 2 V 1,2,3 All -4.5 A Input offset current IIOVCM= VCOMP= 2 V 1,2,3 01 -1.5 1.5 A Output voltage, high VOHICOMP= 0 mA, volts below +VIN1,2,3 All 1.3 V Output voltage, low VOLICOMP= 0 mA 1,2,3 All 0.7 V See footnotes at end of table. Provided by IHSNot f

41、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93265 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol

42、 Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Error amplifier section continued. Output current, high IOHVCOMP= 2 V 1,2,3 All -700 -100 A Output current, low IOLVCOMP= 2 V, C/S(-) = +VIN1,2,3 All 100 700 A VCOMP= 2 V, C/S(-) = +VIN 0.4 V

43、 2 mA Open loop voltage gain AVOLVCOMP= 1 V to 13 V 4,5,6 All 50 dB Common mode rejection ratio CMRR VCM= 0 V to +VIN 3 V 4,5,6 01 60 dB Driver section Maximum current IMAXDriver limit and source pins common 1 All 200 400 mA 2,3 100 450 Pull-up current at driver sink IPUCOMP/SHUTDOWN = 0.4 V, driver

44、 sink = +VIN 1 V 1,2,3 All -800 -100 A COMP/SHUTDOWN = 0.4 V, +VIN= 36 V, driver sink = 35 V -1000 -75 Pull-down current at driver source IPDCOMP/SHUTDOWN = 0.4 V, driver source = 1 V 1,2,3 All 150 700 A 1/ Unless otherwise specified, +VIN= 15 V, driver sink = +VIN, C/S(+) voltage = +VIN. 2/ The alg

45、ebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 3/ For device type 02, the voltage is defined as the regulating level at the error ampli

46、fier inverting input, with the error amplifier driving VSOURCEto 2 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93265 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DS

47、CC FORM 2234 APR 97 Device type 01 02 Case outlines C 2 P 2 Terminal number Terminal symbol 1 +VINNC +VINand CURRENT SENSE (+) +VINand CURRENT SENSE (+) 2 COMP / SHUTDOWN +VINCOMP / SHUTDOWN NC 3 E/A(+) COMP / SHUTDOWN GND NC 4 +2 V REF E/A(+) SOURCE NC 5 GND +2 V REF E/A (-) COMP / SHUTDOWN 6 LOGIC

48、 DISABLE NC SINK GND 7 LIMIT GND TIMER RC NC 8 SOURCE LOGIC DISABLE CURRENT SENSE (-) NC 9 E/A(-) LIMIT - NC 10 SINK SOURCE - SOURCE 11 VADJNC - NC 12 TIMER RC E/A(-) - E/A (-) 13 CURRENT SENSE (-) SINK - NC 14 CURRENT SENSE (+) VADJ- NC 15 - NC - SINK 16 - NC - TIMER RC 17 - NC - CURRENT SENSE (-) 18 - TIMER RC - NC 19 - CURRENT SENSE (-) - NC 20 - CURRENT SENSE (+) - NC NC = No connection FIGURE 1. Terminal connections

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