1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsWB9423_BSI_StandardColCov_noK_AW:BSI FRONT COVERS 5/9/08 12:55 Page 1Printed boards and printed boardassemblies Design and use Part 7: Electronic component zero orientation for CADli
2、brary constructionBS EN 61188-7:2009National forewordThis British Standard is the UK implementation of EN 61188-7:2009. It isidentical to IEC 61188-7:2009.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organizations repre
3、sented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2009ISBN 978 0 580 59866 1ICS 31.180Compliance with a British Standard cannot confer immu
4、nity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 30 September 2009Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 61188-7:2009EUROPEAN STANDARD EN 61188-7 NORME EUROPENNE EUROPISCHE
5、 NORM July 2009 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by any m
6、eans reserved worldwide for CENELEC members. Ref. No. EN 61188-7:2009 E ICS 31.180 English version Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009) Cartes imprimes et cartes imprimes quipes -
7、Conception et utilisation - Partie 7: Orientation nulle des composants lectroniques pour llaboration de la bibliothque CAO (CEI 61188-7:2009) Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 7: Nullorientierung elektronischer Bauelemente fr CAD-Bibliotheksaufbau (IEC 61188-7:200
8、9) This European Standard was approved by CENELEC on 2009-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographic
9、al references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a C
10、ENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungar
11、y, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 61188-7:2009EN 61188-7:2009 - 2 - Foreword The text of document 91/854/FDIS, future edition 1 of IEC 6118
12、8-7, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61188-7 on 2009-06-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical nati
13、onal standard or by endorsement (dop) 2010-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-06-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61188-7:2009 was approved by CENELEC as a Eur
14、opean Standard without any modification. _ BS EN 61188-7:2009- 3 - EN 61188-7:2009 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dat
15、ed references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year
16、Title EN/HD Year IEC 61182-2 -1)Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements - - IEC 61188-5-1 -1)Printed boards and printed board assemblies -Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requi
17、rements EN 61188-5-1 20022)IEC 61188-5-2 -1)Printed boards and printed board assemblies -Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components EN 61188-5-2 20032)IEC 61188-5-3 -1)Printed boards and printed board assemblies -Design and use - Part 5-3: Attachment (lan
18、d/joint) considerations - Components with gull-wing leads on two sides EN 61188-5-3 20072)IEC 61188-5-4 -1)Printed boards and printed board assemblies -Design and use - Part 5-4: Attachment (land/joint) consideration - Components with J-leads on two sides EN 61188-5-4 20072)IEC 61188-5-5 -1)Printed
19、boards and printed board assemblies -Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides EN 61188-5-5 20072)IEC 61188-5-6 -1)Printed boards and printed board assemblies -Design and use - Part 5-6: Attachment (land/joint) considerations -
20、Chip carriers with J-leads on four sides EN 61188-5-6 20032)IEC 61188-5-8 -1)Printed boards and printed board assemblies -Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) EN 61188-5-8 20082)1)Undated reference. 2)Valid edition at date of
21、 issue. BS EN 61188-7:2009 2 61188-7 IEC:2009(E) CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 Basic rules .6 3.1 Common rules .6 3.2 General basic rules .7 3.3 Level A basic rule7 3.4 Level B basic rules 7 3.5 File description definition.7 3.6 Component orientations 8 4 O
22、rigin point of land-pattern.16 4.1 General .16 4.2 Surface mount components .16 4.3 Through-hole leaded components17 5 Land pattern to foot print comparison .18 6 Components with one terminal18 6.1 Surface mount components .18 6.2 Through-hole leaded components18 Figure 1 Example of Level A orientat
23、ion concepts8 Figure 2 Connector and switch library symbol examples 17 Figure 3 Through-hole components with terminal point of origin orientation .17 Figure 4 Circular or square one terminal component 18 Figure 5 Rectangular or oval one terminal component18 Figure 6 Surface mount components with one
24、 lead offset.18 Table 1 Discrete component land pattern conventions .9 Table 2 Diode and transistor land pattern conventions .10 Table 3 Transistor and IC land pattern conventions .11 Table 4 Integrated circuit packages land pattern conventions 12 Table 5 Integrated circuit packages land pattern con
25、ventions 13 Table 6 BGA land pattern conventions .14 Table 7 Resistor array and connector land pattern conventions .15 Table 8 Level A land pattern convention summary .15 Table 9 Level B land pattern convention summary .16 BS EN 61188-7:200961188-7 IEC:2009(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMIS
26、SION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 7: Electronic component zero orientation for CAD library construction FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical commit
27、tees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical
28、Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental a
29、nd non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreeme
30、nts of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and
31、 are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote i
32、nternational uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated
33、in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IE
34、C or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and ex
35、penses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) At
36、tention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-7 has been prepared by IEC technical committee 91: Electronics
37、assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/854/FDIS 91/866/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in ac
38、cordance with the ISO/IEC Directives, Part 2. BS EN 61188-7:2009 4 61188-7 IEC:2009(E) A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies Design and use, can be found on the IEC website. The committee has decided that the contents of this
39、 publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual versi
40、on of this publication may be issued at a later date. The contents of the corrigendum of July 2009 have been included in this copy. BS EN 61188-7:200961188-7 IEC:2009(E) 5 INTRODUCTION One of the factors of establishing a CAD library component description and land pattern standard is to adopt a fixe
41、d zero component orientation so that all CAD images are built with the same rotation for the purpose of assembly machine automation. The land pattern standards clearly define all the properties necessary for standardization and acceptability of a one world CAD library. The main objective in defining
42、 a one world CAD library is to achieve the highest level of electronic product development automation. This encompasses all the processes involved from engineering to PCB layout to fabrication, assembly and test. The data format standards need this type of consistency in order to meet the efficiency
43、 that electronic data transfer can bring to the industry. Many large firms have spent millions of dollars creating and implementing their own unique standards for their own electronic product development automation. These standards are proprietary to each firm and are not openly shared with the rest
44、 of the industry. This has resulted in massive duplication of effort costing the industry millions of man hours in waste and creating industry chaos and global non-standardization. The industry associations responsible for component descriptions and tape and reel orientation have tried valiantly to
45、influence the industry by making good standards that describe the component outlines and how they should be positioned in the delivery system to the equipment on the manufacturing floor. Suppliers of parts have either not adhered to the recommendations or have misunderstood the intent and provided t
46、heir products in different orientations. The Land pattern standards (IEC 61188-5-1, IEC 61188-5-2, IEC 61188-5-3, IEC 61188-5-4, IEC 61188-5-5, IEC 61188-5-6 and IEC 61188-5-8) put an end to the proprietary intellectual property and introduce a world standard so every electronics firm can benefit fr
47、om electronic product development automation. The data format standards (IPC-2581 and IEC 61182-2) are an open database XML software code that is neutral to all the various CAD ASCII formats. For true machine automation to exist, the world desperately needs a neutral CAD database format that all PCB
48、 manufacturing machines can read. The main purpose of creating the land pattern standards is to achieve reliable solder joint formation platforms; the reason for developing the data transfer structure is to improve the efficiency with which engineering intelligence is converted to manufacturing real
49、ity. Even if the neutral CAD format can drive all the manufacturing machines, it would be meaningless unless the component description standard for CAD land patterns was implemented with some consistency. Zero component orientation has a key role in machine automation. The obvious choice for global standardization for EE hardware engineering, PCB design layout, manufacturing, assembly and testing processes is to incorporate the standard land pattern conve
