1、STD-BSI BS EN bL75L-ENGL 1998 lb24bb9 0720450 32T = BRITISH STANDARD I BSEN 61751:1998 IEC 61751:1998 Laser modules used for telecommunication - Reliability assessment The European Standard EN 61751:1!398 has the status of a British Standard ICs 31.260 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PER
2、MITTED BY COPYRIGHT LAW BS EN 61761:1998 Amd.No. National foreword Date Text affected This British Standard is the English language version of EN 61751:1998. It is identical with IEC 61751:1998. The UK participation in its preparation was entrusted to Technical Committee EPLE86, Fibre optics, which
3、has the responsibility to: - aid enquirers to undentand the text; - present to the responsible intemational/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; - monitor related intenational and European developments and promulgate the
4、m in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, ail IEC publications have the number 60000 added to the old number. For insance, iEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change ov
5、er from one numbering system to the other, publications may contain identifiem from both systems. Cross-references Attention is dram to the fact that CEN and CENELEC standards normally include an annex which lists nomative references to intemationai publications with their corresponding European pub
6、lications. The British Stan- which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index“, or by using the “Find“ facility of the BSI standards Electronic Cata
7、logue. A British standard does not purport to include ali the necessary provisions of a contract Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comp
8、rises a front cover, an inside front cover, the EN title page, pages 2 to 36, an inside back cover and a back cover. This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authoris of the Standards Board and comes into effect on
9、15 September 1998 O BSI 1998 Amendments issued since publication ISBN O 680 30143 5 EUROPEAN STANDARD NORME EUROPEENNE EUROPISCHE NORM EN 61751 April 1998 ICs 31.260 Descriptors: Laser modules, telecommunication, reliability English version Laser modules used for telecommunication Reliability assess
10、ment (IEC 61751:1998) Modules laser utiliss pour les tlcommunications Evaluation de la fiabilit (CE1 61 751 : 1998) Lasermodule fr Telekommunikationsanwendungen Zuveilsig keitsbewertung (IEC 61 75 1 : 1998) This European Standard was approved by CENELEC on 1998-04-01. CENELEC members are bound to co
11、mply with the CENICENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central S
12、ecretariat or to any CENELEC member. This European Standard exists in three official versions IEnglish, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status
13、as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European C
14、ommittee for Electrotechnicai Standardization Comit Europen de Normalisation Eiectrotechnique Europisches Komitee fr Elektrotechnische Normung Centrai Secretariat: nie de Stasrart 35, B - 1050 Brussels 1998 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENE
15、LEC members. Ref. No. EN 61751:1998 E Page 2 EN 61761:1998 Foreword The text of document 86/11 S/FDIS, future edition 1 of IEC 61 751, prepared by SC 47C, Optoelectronic, display and imaging devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved
16、 by CENELEC as EN 61 751 on 1998-04-01. The following dates were fixed: - latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 199941 -01 - latest date by which the national standards conflicting with the EN have
17、 to be withdrawn (dow) 200 1 -O 1 -0 1 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standard, annexes A and ZA are normative and annex 6 is informative. Annex 2A has been added by CENELEC. Endorsement no
18、tice The text of the International Standard IEC 61 75 1 :1998 was approved by CENELEC as a European Standard without any modification. * * LB Page 3 EN 61751:1998 CONTENTS Page INTRODUCTION . Clause Scope . Normative references Terms and definitions Laser reliability and quality assurance procedure
19、. 4.1 Demonstration of product quality 4.2 Testing responsibilities . 4.3 Quality Improvement Programmes (QIPs) . Tests 5.1 Structural similarity 5.2 Burn-in and screening (when applicable in the . DS) . Activities . 6.1 Analysis of reliability results . 6.2 Technical visits to LMMs 6.3 Design/proce
20、ss changes 6.4 Deliveries . 6.5 Supplier documentation Annex A (normative) Laser diode and laser module failure mechanisms . Annex B (informative) Guide Annex 2% Normative references to international publications with their corresponding European publications Figures A . 1 A.2 A.3 A.4 AS A.6 Non-lin
21、earities in laser-current characteristics . “Bathtub” failure rate curve . Example of cumulative failure plot showing log-normal distribution of laser failure rate Calculated failure rates for components having a log-normal lifetime distribution. with a median life of lo6 h and dispersion in the ran
22、ge O. 5 to 2. O . Cross-section through a typical laser module showing key components . Cross-section through a typical buried heterostructure laser (bonded junction side up) . 4 5 5 6 6 6 7 7 8 8 8 12 12 13 13 13 13 14 21 36 17 18 18 19 19 20 Q BSI 1998 Page 4 EN 61761:1998 INTRODUCTION The laser m
23、odules covered by this International Standard are purchased by a system supplier (SS) to be inserted in equipments which in turn are supplied/sold to a system operator (SO), for example a national PTT or a network operator (see definitions in clause 3). For the system operator to act as an informed
24、buyer, a knowledge of the potential risks posed by the use of critical components is required. Optoelectronic component technology is continuing to develop. Consequently, during product development phases, many failure mechanisms in laser modules have been identified. These failure mechanisms, if un
25、detected, could result in very short laser lifetime in system use. Page 5 EN 61751:1998 LASER MODULES USED FOR TELECOMMUNICATION - Re1 ia bi lity assessment 1 Scope This International Standard deals with reliability assessment of laser modules used for telecommunication. The aim of this standard is:
26、 - to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development and reliability; - to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment fai
27、lure rates for specified end of life criteria. In addition, guidance is given on: - the testing that a system supplier should ensure is in a place prior to procurement of a laser module from a laser module manufacturer; - a range of activities expected of a system supplier to verify a laser module m
28、anufacturers reliability claims. Further details concerning the rationale are given in annexes A and B. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this International Standard. At the time of publication,
29、 the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this International Standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and IS0 ma
30、intain registers of currently valid International Standards. IEC 60068-2-1 : 1990, Environmental testing - Part 2: Tests. Tests A: Cold IEC 60068-2-14:1984, Environmental testing - Part 2: Tests. Test N: Change of temperature IEC 60747-1 :1996, Semiconductor devices - Discrete devices and integrated
31、 circuits - Part 1: General Amendment 3 (1 996) IEC 60747-12-2:1995, Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub- systems IEC 60749:1996, Semiconductor devices - Mechanical and cl
32、imatic test methods IS0 9000: Quality management and quality assurance standards MIL-STD-883: 1985, Test methods and Procedures for Microelectronics Page 6 EN 61761:1998 3 Terms and definitions For the purpose of this International Standard the following definitions apply: laser module a packaged as
33、sembly containing a laser diode and photodiode NOTE - The module may also include a cooler and temperature sensor to enable laser temperature to be controlled and monitored. The optical output is normally via an optical fibre pigtail. su bmount a substrate upon which a laser diode or photodiode may
34、be mounted for assembly into the laser module NOTE - Components on submounts are also subject to qualification testing. laser module manufacturer (LMM) a manufacturer of laser modules who provides devices meeting the requirements of the relevant detail specification (DS) and the customers reliabilit
35、y requirements system auppller (SS) a manufacturer of telecommunications/data transmission equipment containing optoelectronic semiconductor lasers, .e. laser module customer ryrtem operator (SO) a network operator of telecommunicationddata transmission equipment containing opto- electronic semicond
36、uctor lasers in the transmission path NOTE - The system may also be part of other more extensive systems, for example telecommunications, rail, road vehicles, aerospace or weapons. cipabllity qualifying components (CQC) components selected to represent critical stages of the process and limiting or
37、boundary characteristics of mechanical and electro-optic design Such components should aid the identification of end product failure mechanisms to enable the determination of activation energies. 4 Laser reliability and quality assurance procedure 4.1 Demonstration of product quality This standard (
38、where required by the detail specification (DS) gives the minimum mandatory requirements and is pari of a total laser reliability and quality assurance procedure adopted by the laser module manufacture. It gives guidance on the activities of the system supplier, and the system operator as well as fe
39、edback of field performance, the laser module manufacturer and the system supplier. STD-BSI BS EN bL752-ENGL 1998 Lb24bb 0720fi58 bLO m Page 7 EN 61751:1998 The laser module manufacturer shall be able to demonstrate, by means of qualification approval of devices, technology approval or capability ap
40、proval of the manufacturing process: a) a documented and audited manufacturing process including the qualification of purchased components in accordance with IS0 9000; b) a performance qualification programme, including for example, accelerated life testing, burn-in and screening of components and m
41、odules; c) a qualification maintenance programme to ensure continuity of reliability performance; d) a procedure to feedback reliability issues to development and production. In addition, there are many elements which make up a comprehensive reliability assurance programme (see annex B). 4.2 Testing
42、 responsibilities The testing detailed in tables la and lb is to be performed by the laser module manufacturer and component suppliers (where applicable). Additional testing may be specified in the DS. 4.2.1 Recommendation (applicable to laser customer/system supplier) The system supplier is recomme
43、nded to have a programme to analyse and verify the results including failure analysis. This programme includes an independent life test of fully packaged laser modules, see table 1 b test 2 and/or test 3 and/or test 5 (sample size lo per test). 4.2.2 Recommendation applicable to system operator The
44、system operator is recommended to have a programme to monitor and report field failure rates in sufficient detail to enable system supplier and laser module manufacturer to initiate any necessary corrective actions at an early stage in the lifetime of a product. Suppliers may have different approach
45、es (.e. to reliability concepts) during the development of product maturity and resource limitations may dictate testing strategies. Alternative tests and activities to those specified are permitted provided the LMM/SS/SO can show intent to remove end-product failures and the associated failure mech
46、anisms. However, this will require significant data to substantiate compliance. 4.3 Quality improvement programmes (lPs) Quality improvement programmes (QIPs) shall be initiated with component suppliers and customers (SOS, SSs and LMMs) to address non-compliances (including quality and reliability p
47、roblems identified during subsequent service life of the laser). The correction of non- compliances and subsequent QIPs are a required strategy to minimize reliability risks. The operation of QIPs should be stated in the quality approval (QA) generic and capability approval documents. Page 8 EN 6176
48、1:1998 5 lests The tests described in tables la and lb are designed to accelerate the main failure mechanisms known to be reliability hazards in laser modules (see annex B). Where appro- priate, the CQC shall demonstrate an ability to reduce end product failure mechanisms. Final product validation i
49、s required to demonstrate that CQCs are operating at the boundaries of the process or technology. These tests will reduce the risk of unreliable components entering system use and will enable estimates to be made of the distribution of laser lifetimes and hence the laser failure rates. The sample size and level of testing may vary depending on the business volume between the laser customer/system supplier (SS) and laser module manufacturer (LMM). This information will be given in the capability approval (CA) document and DS where appropriate. NOTE - It is assentia1 that the
