1、Electronic components Long-term storage of electronic semiconductor devicesPart 5: Die and wafer devicesBS EN 62435-5:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of EN 62435-5:2017. It isidentica
2、l to IEC 62435-5:2017.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa cont
3、ract. Users are responsible for its correct application. The British Standards Institution 2017.Published by BSI Standards Limited 2017ISBN 978 0 580 83550 6ICS 31.020Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was published under the autho
4、rity of theStandards Policy and Strategy Committee on 30 April 2017.Amendments/corrigenda issued since publicationDate Text affectedPUBLISHED DOCUMENTBS EN 62435-5:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62435-5 March 2017 ICS 31.020 English Version Electronic components - Long-term
5、 storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017) Composants lectroniques - Stockage de longue dure des dispositifs lectroniques semiconducteurs - Partie 5: Dispositifs de puces et plaquettes (IEC 62435-5:2017) Elektronische Bauteile - Langzeitlagerung e
6、lektronischer Halbleiterbauelemente - Teil 5: Chip- und Wafererzeugnisse (IEC 62435-5:2017) This European Standard was approved by CENELEC on 2017-02-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the
7、 status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, F
8、rench, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austr
9、ia, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Sloveni
10、a, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rig
11、hts of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62435-5:2017 E EN 62435-5:2017 2 European foreword The text of document 47/2328/FDIS, future edition 1 of IEC 62435-5, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC p
12、arallel vote and approved by CENELEC as EN 62435-5:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-11-24 latest date by which the national standards conflictin
13、g with the document have to be withdrawn (dow) 2020-02-24 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text
14、of the International Standard IEC 62435-5:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-17 NOTE Harmonized as EN 60068-2-17. IEC 60068-2-20 NOTE Ha
15、rmonized as EN 60068-2-20. IEC 60749-3 NOTE Harmonized as EN 60749-3. IEC 60749-20-1 NOTE Harmonized as EN 60749-20-1. IEC 60749-21 NOTE Harmonized as EN 60749-21. IEC 60749-22 NOTE Harmonized as EN 60749-22. IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1. IEC 61340-2-1 NOTE Harmonized as EN 61340-2-
16、1. IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3. IEC 62435-1 NOTE Harmonized as EN 62435-1. BS EN 62435-5:2017EN 62435-5:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are
17、 normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modifi
18、ed by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 62435-2 - Electronic components - Long-term storage
19、of electronic semiconductor devices - Part 2: Deterioration mechanisms EN 62435-2 - BS EN 62435-5:2017 2 IEC 62435-5:2017 IEC 2017 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 8 2 Normative references 8 3 Terms, definitions and abbreviated terms 8 3.1 Terms and definitions 8 3.2 Abbreviations 9 4
20、Storage requirements 9 4.1 General . 9 4.2 Assembly data 9 4.3 Prerequisite for storage. 9 4.4 Damage to die products during long-term storage . 9 4.5 Mechanical storage conditions 10 4.6 Long-term storage environment 10 4.7 Recommended inert atmosphere purity . 11 4.8 Chemical contamination 11 4.9
21、Vacuum packing . 11 4.9.1 General . 11 4.9.2 Vacuum dry pack . 11 4.10 Positive pressure systems for packing 11 4.11 Use of packing material having sacrificial properties . 11 4.12 Use of bio-degradable material . 12 4.13 Plasma cleaning . 12 4.14 Electrical effects . 12 4.15 Protection from radiati
22、on . 12 4.16 Periodic qualification of stored die products 12 5 Long-term storage failure mechanisms 13 6 LTS concerns, method, verification and limitations 13 6.1 General . 13 6.2 Wafers 13 6.3 Bare dice 14 7 Deterioration mechanisms specific to bare die and wafers . 15 7.1 Wire bondability 15 7.2
23、Staining 15 7.3 Topside delamination 16 8 Specific handling concerns 16 8.1 Die on wafer film frames . 16 8.2 Devices and dice embossed or punched tape storage . 16 8.3 Handling damage 16 Annex A (informative) Audit checklist . 17 Bibliography 20 BS EN 62435-5:2017IEC 62435-5:2017 IEC 2017 3 Table 1
24、 LTS exposure concerns for wafers 14 Table 2 LTS exposure concerns for bare dice 15 Table A.1 Planning checklist 17 BS EN 62435-5:2017 4 IEC 62435-5:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONIC COMPONENTS LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES Part 5: Die and w
25、afer devices FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardi
26、zation in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation i
27、s entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the
28、International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects s
29、ince each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical conte
30、nt of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possibl
31、e in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
32、 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors,
33、 employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out
34、of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to
35、 the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62435-5 has been prepared by IEC technical committee 47: Semiconductor devices. The text
36、 of this standard is based on the following documents: FDIS Report on voting 47/2328/FDIS 47/2351/RVD Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with th
37、e ISO/IEC Directives, Part 2. BS EN 62435-5:2017IEC 62435-5:2017 IEC 2017 5 A list of all parts in the IEC 62435 series, published under the general title Electronic components Long-term storage of electronic semiconductor devices, can be found on the IEC website. The committee has decided that the
38、contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 62435-5:2017 6
39、 IEC 62435-5:2017 IEC 2017 INTRODUCTION This document applies to the long-duration storage of electronic components. This is a document for long-term storage (LTS) of electronic devices drawing on the best long-term storage practices currently known. For the purposes of this document, LTS is defined
40、 as any device storage whose duration may be more than 12 months for product scheduled for long duration storage. While intended to address the storage of unpackaged semiconductors and packaged electronic devices, nothing in this document precludes the storage of other items under the storage levels
41、 defined herein. Although it has always existed to some extent, obsolescence of electronic components and particularly of integrated circuits, has become increasingly intense over the last few years. Indeed, with the existing technological boom, the commercial life of a component has become very sho
42、rt compared with the life of industrial equipment such as that encountered in the aeronautical field, the railway industry or the energy sector. The many solutions enabling obsolescence to be resolved are now identified. However, selecting one of these solutions should be preceded by a case-by-case
43、technical and economic feasibility study, depending on whether storage is envisaged for field service or production, for example: remedial storage as soon as components are no longer marketed; preventive storage anticipating declaration of obsolescence. Taking into account the expected life of some
44、installations, sometimes covering several decades, the qualification times, and the unavailability costs, which can also be very high, the solution to be adopted to resolve obsolescence should often be rapidly implemented. This is why the solution retained in most cases consists in systematically st
45、oring components which are in the process of becoming obsolescent. The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery of the implemented process and especially of the storage environment, although this mastery becomes critical when it comes to long-t
46、erm storage. All handling, protection, storage and test operations are recommended to be performed according to the state of the art. The application of the approach proposed in this standard in no way guarantees that the stored components are in perfect operating condition at the end of this storag
47、e. It only comprises a means of minimizing potential and probable degradation factors. Some electronic device users have the need to store electronic devices for long periods of time. Lifetime buys are commonly made to support production runs of assemblies that well exceed the production timeframe o
48、f its individual parts. This puts the user in a situation requiring careful and adequate storage of such parts to maintain the as-received solderability and minimize any degradation effects to the part over time. Major degradation concerns are moisture, electrostatic fields, ultra-violet light, larg
49、e variations in temperature, air-borne contaminants, and outgassing. Warranties and sparing also present a challenge for the user or repair agency as some systems have been designated to be used for long periods of time, in some cases for up to 40 years or more. Some of the devices needed for repair of these systems will not be available from the original supplier for the lifetime of the system or the spare assembly may be built with the original production run but then require long-term storag
