1、 For the Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers Electrostatic Discharge Association 7900 Turin Road, Bldg. 3 Rome, NY 13440 An American National Standard Approved April 25,2018 ANSI/ESD SP27.1-2018 ESD Association Standar
2、d Practice for the Recommended Information Flow for Potential EOS Issues Between Automotive OEM, Tier 1, and Semiconductor Manufacturers Approved November 30, 2017 EOS/ESD Association, Inc.ANSI/ESD SP27.1-2018 Electrostatic Discharge Association (ESDA) standards and publications are designed to serv
3、e the public interest by eliminating misunderstandings between manufacturers and purchasers, facilitating the interchangeability and improvement of products and assisting the purchaser in selecting and obtaining the proper product for his particular needs. The existence of such standards and publica
4、tions shall not in any respect preclude any member or non-member of the Association from manufacturing or selling products not conforming to such standards and publications. Nor shall the fact that a standard or publication that is published by the Association preclude its voluntary use by non-membe
5、rs of the Association whether the document is to be used either domestically or internationally. Recommended standards and publications are adopted by the ESDA in accordance with the ANSI Patent policy. Interpretation of ESDA Standards: The interpretation of standards in-so-far as it may relate to a
6、 specific product or manufacturer is a proper matter for the individual company concerned and cannot be undertaken by any person acting for the ESDA. The ESDA Standards Chairman may make comments limited to an explanation or clarification of the technical language or provisions in a standard, but no
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8、NY KIND WITH RESPECT TO SUCH CONTENTS. ESDA DISCLAIMS ALL REPRESENTATIONS AND WARRANTIES, INCLUDING WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR USE, TITLE, AND NON-INFRINGEMENT. ESDA STANDARDS AND PUBLICATIONS ARE CONSIDERED TECHNICALLY SOUND AT THE TIME TH
9、EY ARE APPROVED FOR PUBLICATION. THEY ARE NOT A SUBSTITUTE FOR A PRODUCT SELLERS OR USERS OWN JUDGEMENT WITH RESPECT TO ANY PARTICULAR PRODUCT DISCUSSED, AND ESDA DOES NOT UNDERTAKE TO GUARANTEE THE PERFORMANCE OF ANY INDIVIDUAL MANUFACTURERS PRODUCTS BY VIRTUE OF SUCH STANDARDS OR PUBLICATIONS. THU
10、S, ESDA EXPRESSLY DISLAIMS ANY RESPONSIBILITY FOR DAMAGES ARISING FROM THE USE, APPLICATION, OR RELIANCE BY OTHERS ON THE INFORMATION CONTAINED IN THESE STANDARDS OR PUBLICATIONS. NEITHER ESDA, NOR ITS PRESENT OR FORMER MEMBERS, OFFICERS, EMPLOYEES, OR OTHER REPRESENTATIVES, WILL BE LIABLE FOR DAMAG
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12、 DAMAGE TO PROPERTY, AND CLAIMS OF THIRD PARTIES. Published by: Electrostatic Discharge Association 7900 Turin Road, Bldg. 3 Rome, NY 13440 Copyright 2018 by ESD Association All rights reserved No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise,
13、 without the prior written permission of the publisher. Printed in the United States of America ISBN: 1-58537-300-1DISCLAIMER OF WARRANTIES DISCLAIMER OF GUARANTY LIMITATION ON ESDAs LIABILITY CAUTION NOTICE ANSI/ESD SP27.1-2018 i (This foreword is not part of ESD Association Standard Practice ANSI/
14、ESD SP27.1-2018) FOREWORD Electrical Overstress (EOS) is one of the most commonly assigned categories of returns sent back to suppliers (original equipment manufacturer (OEM), Tier 1, etc.) for failure analysis. EOS results from an electrical stress of an electronic component or system outside the a
15、llowed specification resulting in pre-damage or even immediate damage of a device. In the past, a deep analysis indicating the clear root cause of failure for every returned part was expected. Such an analysis is challenging, very time consuming, and often root cause finding is not possible. Since t
16、he same failure signature can be created by several different stress situations, the success rate of finding a possible root cause event depends on information-sharing and close cooperation between the different tier levels and the OEM. During discussions between the automotive OEMs, Tier 1s, and se
17、miconductor manufacturers it became obvious that all parties involved see EOS-related cases as a huge opportunity for improvement throughout the automotive industry value chain. This standard practice1 document was created to establish a standard information flow process to help solve and reduce EOS
18、 problems in the automotive industry in a fast and harmonized way. The work was initiated within USCAR (The United States Council for Automotive Research). USCAR is an umbrella organization of FCA US, Ford, and General Motors, which was formed to conduct cooperative, pre-competitive research. The do
19、cument was then provided to the ESDA for publication. Historically, EOS is the result of an unexpected event. The information gathered through this standard practice helps to define what is known about the event. Having this information increases the ability to identify what is unknown and which are
20、as should be further investigated to identify root cause. The common objective of all parties involved in writing this document turned out to be focusing on the right things to be more efficient in the EOS root cause finding process. This document was designated ANSI/ESD SP27.1-2018 and approved on
21、November 30, 2017. 1 ESD Association Standard Practice: A procedure for performing one or more operations or functions that may or may not yield a test result. Note that if a test result is obtained, it may not be reproducible. ANSI/ESD SP27.1-2018 ii At the time ANSI/ESD SP27.1-2018 was prepared, t
22、he 27.0 EOS Automotive Subcommittee had the following members: Reinhold Gaertner, Co-Chair Infineon Technologies James Roberts, Co-Chair Continental Corporation Andrea Boroni ST Microelectronics Johnny Che FCA US Marc Ellis Nexteer Kai Esmark Infineon Technologies Mark Harris Ford Bob Knoell NXP Ton
23、y Lusardi Ford Kim Mao FCA US John Mason General Motors Leon Masseus Infineon Technologies Hadi Mehrooz Continental Corporation Thomas J. Murphy General Motors Joseph Ney General Motors Todd Peterson Robert Bosch (ecu plant) Don Price USCAR Representative Danette Rodriguez Nexteer Theo Smedes NXP Mi
24、chael Stevens NXP Semiconductors Thomas Stich Renesas Electronics America Inc. John Taylor Continental Corporation Christoph Thienel Robert Bosch (semiconductor plant) Scott Ward Texas Instruments Matt Yager Ford ANSI/ESD SP27.1-2018 iii TABLE OF CONTENTS 1.0 PURPOSE AND SCOPE . 1 1.1 PURPOSE . 1 1.
25、2 SCOPE . 1 2.0 REFERENCED PUBLICATIONS 1 3.0 DEFINITION OF TERMS . 1 4.0 TWO LEVEL FAILURE ANALYSIS REPORT SUPPORT . 2 4.1 LEVEL 1A SUPPORT 3 4.1.1 Level 1A - Information Provided by the OEM 3 4.1.2 Level 1A - Information Provided by the Tier 1 . 4 4.1.3 Level 1A - Information Provided by the Semic
26、onductor Manufacturer 5 4.2 LEVEL 1B SUPPORT 5 4.2.1 Level 1B - Information Provided by the OEM 5 4.2.2 Level 1B - Information Provided by the Tier 1 . 5 4.2.3 Level 1B - Information Provided by the Semiconductor Manufacturer 6 4.3 LEVEL 2 SUPPORT 6 4.3.1 Level 2 - Information Provided by the OEM .
27、6 4.3.2 Level 2 - Information Provided by the Tier 1 8 4.3.3 Level 2 - Information Provided by the Semiconductor Manufacturer . 8 ANNEXES Annex A (Informative) Bibliography 10 Annex B (Informative) Revision History for ANSI/ESD SP27.1-2018 11 TABLES Table 1: Definition of Support Levels 3 ESD Associ
28、ation Standard Practice ANSI/ESD SP27.1-2018 1 ESD Association Standard Practice for the Recommended Information Flow Regarding Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers 1.0 PURPOSE AND SCOPE 1.1 Purpose This document provides guidance based on a two-level
29、approach that describes what necessary and important information should be shared between automotive original equipment manufacturer (OEM), Tier 1, and semiconductor manufacturers to solve electrical overstress (EOS) issues. NOTE: Subcontractors are considered to be under the responsibility of the T
30、ier 1 as defined in the OEM statement of work (SoW). 1.2 Scope This document applies to any electronic component, module, or assembly exhibiting electrically induced physical damage (EIPD) that is suspected to be a result of EOS. 2.0 REFERENCED PUBLICATIONS Unless otherwise specified, the following
31、documents of the latest issue, revision, or amendment form a part of this standard to the extent specified herein: ESD ADV 1.0, ESD Associations Glossary of Terms.2 3.0 DEFINITION OF TERMS The terms used in the body of this document are in accordance with the definitions found in ESD ADV1.0, ESD Ass
32、ociations Glossary of Terms, available for complimentary download at www.esda.org. design validation or design verification (DV). Verifying the design of the electronic component or the module without including the effects of automotive manufacturing induced variations in the module and vehicle prod
33、uction. diagnostic trouble code (DTC). DTC codes that are described by Society of Automotive Engineers (SAE) standards to help track problems in a vehicle detected by its on-board computer. electronic control unit (ECU). An embedded electronic system that controls one or more electrical systems or s
34、ubsystems in a vehicle. NOTE: An ECU typically includes one or more printed circuit board assemblies (PCBAs). electrically induced physical damage (EIPD). Damage to an electronic component due to electrical/thermal stress beyond the level which the materials could sustain. NOTE: This would include m
35、elting of silicon, fusing of metal interconnects, thermal damage to package material, fusing of bond wires and other damage caused by excess current or voltage. NOTE: The term EIPD has to be used during initial failure analysis/failure investigation until a more comprehensive joint analysis between
36、supplier and customer has confirmed a potential EOS event. NOTE: Thermal stress is assumed to be a consequence of electrical stimulation. electronic component. In the context of this document an electronic component describes an integrated circuit (IC), a semiconductor device, a passive device, or a
37、 discrete device. electrical overstress (EOS). An electrical device suffers electrical overstress when a maximum limit for either the voltage across, the current through, or the power dissipated in the device is exceeded and causes immediate damage or malfunction, or latent damage resulting in an un
38、predictable reduction of its lifetime. 2 EOS/ESD Association, Inc., 7900 Turin Road, Bldg. 3, Rome, NY 13440, 315-339-6937, www.esda.org. ANSI/ESD SP27.1-2018 2 NOTE: EOS does not define the root cause of a failure. end of line test (EOL). EOL is a test method for finished products at the end of pro
39、duction before shipment. errata sheet. In the context of this document, an errata sheet describes known functional problems as well as deviations from the electrical specifications listed in the product description or data sheet. in circuit test (ICT). ICT is a test method for PCBAs, where the PCBA
40、is tested for failures in circuits (for example, open or short) and for damage of the electronic component. NOTE: ICT is done after placement of the components before the PCBA is placed into a housing. look across. Look across is a process to review or evaluate a failure mode and determine if additi
41、onal users are impacted. NOTE: The users could be different OEM assembly plants or vehicle programs or vehicle repair facilities. Users could be different Tier 1 suppliers involving different programs or manufacturing facilities. It could also be different semi-conductor manufacturing locations, pro
42、cesses or equipment. module. In the context of this document a module describes the same as an ECU. printed circuit board (PCB). A non-conductive substrate with conductive tracks, pads, and other features. printed circuit board assembly (PCBA). A PCB with electronic components attached. product or p
43、roduction validation (PV). The validation of the electronic component or the module including the effects of automotive manufacturing variation during module and vehicle production resulting from the expected process capability or the actual process performance. root cause. The fundamental reason fo
44、r the occurrence of a problem. Root Cause identifies the part or condition that needs to be changed to prevent reoccurrence. safe launch period. Initial manufacturing period, where the product is assembled and tested the first time. NOTE: The safe launch period for each tier is typically defined by
45、a period of time (for example, 3 months) or a volume of parts produced, and may include requirements for additional or extended testing. NOTE: The safe launch period for the different tiers may not be concurrent. 4.0 TWO LEVEL FAILURE ANALYSIS REPORT SUPPORT Typically, modules that are claimed to be
46、 damaged during manufacturing or use are sent back by the OEM to the Tier 1. The suspect electronic component is then sent to the semiconductor manufacturer. The semiconductor manufacturer typically has to do a failure analysis and the Tier 1 and/or the semiconductor manufacturer tries to reproduce
47、the damage by a simulation experiment in the lab. Reproducing the damaging process can be difficult without knowledge of or access to the complex system environment and might not identify the correct damaging stress. All these actions are very costly, time consuming, and involve considerable resourc
48、es of all parties. Without good cooperation between all tier levels, a possible stress condition that could lead to this signature may be found but not the root cause of the problem. This is especially true if the problem only randomly appears. In this case, it is almost impossible to find the root
49、cause. To avoid an excessive amount of effort that will not result in a solution of the problem, various levels of support are defined in this Standard Practice depending on the actual situation where the damage happens (see Table 1). These levels require different information from all parties involved (OEM, Tier 1 (and sub-tiers), and semiconductor manufacturer). ANSI/ESD SP27.1-2018 3 Table 1. Definitions of Support Levels The information to be shared can be divided into three categories: General information that describes the situation where the damage happened (for example
