1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsWB9423_BSI_StandardColCov_noK_AW:BSI FRONT COVERS 5/9/08 12:55 Page 1Environmental testingPart 2-20: Tests Test T:Test methods for solderabilityand resistance to solderingheat of dev
2、ices with leadsBS EN 60068-2-20:2008NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LALicensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSINational forewordThis British Standard is the UK implementation of EN 60068-2-20:2008. Itis iden
3、tical to IEC 60068-2-20:2008. It supersedes BS 2011-2.1T:1981,which will be withdrawn on 1 August 2011.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained onrequest t
4、o its secretary.This publication does not purport to include all the necessary provisionsof a contract. Users are responsible for its correct application. BSI 2009ISBN 978 0 580 55763 7ICS 19.040Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was
5、 published under the authority of the StandardsPolicy and Strategy Committee on Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 60068-2-20:200831 January 2009Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSIEUROPEA
6、N STANDARD EN 60068-2-20 NORME EUROPENNE EUROPISCHE NORM September 2008 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2008 CEN
7、ELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60068-2-20:2008 E ICS 19.040 Supersedes HD 323.2.20 S3:1988English version Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering
8、heat of devices with leads (IEC 60068-2-20:2008) Essais denvironnement - Partie 2-20: Essais - Essai T: Mthodes dessai pour la brasabilit et la rsistance la chaleur de brasage des dispositifs plombs (CEI 60068-2-20:2008) Umgebungseinflsse - Teil 2-20: Prfungen - Prfung T: Prfverfahren fr die Ltbarke
9、it und Ltwrmebestndigkeit von Bauelementen mit herausgefhrten Anschlssen (IEC 60068-2-20:2008) This European Standard was approved by CENELEC on 2008-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
10、the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French,
11、German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulg
12、aria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 60068-2-20:20
13、08Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSIEN 60068-2-20:2008 2 Foreword The text of document 91/764/FDIS, future edition 5 of IEC 60068-2-20, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel v
14、ote and was approved by CENELEC as EN 60068-2-20 on 2008-08-01. This European Standard supersedes HD 323.2.20 S3:1988. The major technical changes with regard to HD 323.2.20 S3:1988 are the following: the solder globule test is deleted; test conditions and requirements for lead-free solders are adde
15、d. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2009-05-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2011-08-01 Annex Z
16、A has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60068-2-20:2008 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068
17、-2-54 NOTE Harmonized as EN 60068-2-54:2006 (not modified). IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58:2004 (not modified). IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69:2007 (not modified). IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3:2007 (not modified). _ BS EN 60068-2-20:2008Licensed Cop
18、y: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSI 3 EN 60068-2-20:2008 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application
19、 of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
20、applies. Publication Year Title EN/HD Year IEC 60068-1 - 1)Environmental testing - Part 1: General and guidance EN 60068-1 1994 2)IEC 60068-2-2 - 1)Environmental testing - Part 2-2: Tests - Test B: Dry heat EN 60068-2-2 2007 2)IEC 60068-2-66 - 1)Environmental testing - Part 2-66: Test methods - Test
21、 Cx: Damp heat, steady state (unsaturated pressurized vapour) EN 60068-2-66 1994 2)IEC 60068-2-78 - 1)Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state EN 60068-2-78 2001 2)IEC 60194 - 1)Printed board design, manufacture and assembly - Terms and definitions EN 60194 2006 2
22、)IEC 61191-3 - 1)Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies EN 61191-3 1998 2)IEC 61191-4 - 1)Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies EN 61191-4 1998 2)1) Unda
23、ted reference. 2) Valid edition at date of issue. BS EN 60068-2-20:2008Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSI 2 60068-2-20 IEC:2008(E) CONTENTS 1 Scope and object6 2 Normative references .6 3 Terms and definitions .7 4 Test Ta: Solderabili
24、ty of wire and tag terminations8 4.1 Object and general description of the test8 4.1.1 Test methods.8 4.1.2 Specimen preparation8 4.1.3 Initial measurements .9 4.1.4 Accelerated ageing9 4.2 Method 1: Solder bath .9 4.2.1 Description of the solder bath 9 4.2.2 Flux .10 4.2.3 Procedure10 4.2.4 Test co
25、nditions 10 4.2.5 Final measurements and requirements 11 4.3 Method 2: Soldering iron at 350 C11 4.3.1 Description of soldering irons 11 4.3.2 Solder and flux 12 4.3.3 Procedure12 4.3.4 Final measurements and requirements 13 4.4 Information to be given in the relevant specification 13 5 Test Tb: Res
26、istance to soldering heat.13 5.1 Object and general description of the test13 5.1.1 Test methods.13 5.1.2 Initial measurements .14 5.2 Method 1: Solder bath .14 5.2.1 Description of the solder bath 14 5.2.2 Flux .14 5.2.3 Procedure14 5.2.4 Test conditions 14 5.2.5 De-wetting.15 5.3 Method 2: Solderi
27、ng iron .15 5.3.1 Description of soldering iron 15 5.3.2 Solder and flux 15 5.3.3 Procedure15 5.4 Recovery.16 5.5 Final measurements and requirements 16 5.6 De-wetting (if applicable).16 5.7 Information to be given in the relevant specification 17 Annex A (informative) Example of apparatus for accel
28、erated steam ageing process .18 Annex B (normative) Specification for flux constituents .19 Bibliography20 Figure 1 Diagram of contact angle .7 BS EN 60068-2-20:2008Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSI60068-2-20 IEC:2008(E) 3 Figure 2 Po
29、sition of soldering iron12 Figure A.1 Example of apparatus .18 Table 1 Solderability, Solder bath method: Test severities (duration and temperature).11 Table 2 Resistance to soldering heat, Solder bath method: Test severities (duration and temperature) 15 BS EN 60068-2-20:2008Licensed Copy: Wang Bin
30、, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSI 6 60068-2-20 IEC:2008(E) ENVIRONMENTAL TESTING Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads 1 Scope and object This part of IEC 60068 outlines Test T, applic
31、able to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin
32、 lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In ad
33、dition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance. See IEC 60068-2-54 (solder bath method) and IEC
34、 60068-2-69 (solder bath and solder globule method for SMDs). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document
35、(including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60068-2-2, Environmental testing Part 2-2: Tests Tests B: Dry heat IEC 60068-2-66, Environmental testing Part 2-66: Test methods: Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
36、IEC 60068-2-78, Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady State IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-3, Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount soldered assemblies IEC 6
37、1191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies BS EN 60068-2-20:2008Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrolled Copy, (c) BSI60068-2-20 IEC:2008(E) 7 3 Terms and definitions For the purposes of
38、this document, the following terms and definitions apply. 3.1 colophony natural resin obtained as the residue after removal of turpentine from the oleo-resin of the pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin acid esters NOTE “Rosin“ is a synonym f
39、or colophony, and is deprecated because of the common confusion with the generic term “resin“. 3.2 contact angle in general the angle enclosed between two planes, tangent to a liquid surface and a solid/liquid interface at their intersection (see Figure 1). In particular the contact angle of liquid
40、solder in contact with a solid metal surface Contact angle Liquid Solid IEC 1234/08 Figure 1 Diagram of contact angle 3.3 wetting formation of an adherent coating of solder on a surface. A small contact angle is indicative of wetting 3.4 non-wetting inability to form an adherent coating of solder on
41、 a surface. In this case the contact angle is greater than 90 3.5 de-wetting retraction of molten solder on a solid area that it has initially wetted NOTE In some cases an extremely thin film of solder may remain. As the solder retracts the contact angle increases. 3.6 solderability ability of the t
42、ermination or lead of device to be wetted by solder at the temperature of the termination or lead which is assumed to be the lowest temperature in the soldering process within solderable temperature of solder alloy BS EN 60068-2-20:2008Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/200
43、9 03:51, Uncontrolled Copy, (c) BSI 8 60068-2-20 IEC:2008(E) 3.7 soldering time time required for a defined surface area to be wetted under specific conditions 3.8 resistance to soldering heat ability of device to withstand the highest temperature of the termination or lead in soldering process, wit
44、hin applicable temperature range of solder alloy 3.9 lead-free solder alloy that does not contain more than 0,1 % lead (Pb) by weight as its constituent and is used for joining components to substrates or for coating surfaces 75.1904 of IEC 60194 4 Test Ta: Solderability of wire and tag terminations
45、 4.1 Object and general description of the test 4.1.1 Test methods Test Ta provides two different test methods to determine the solderability of the areas on wire and tag terminations that are required to be wetted by solder. Method 1: Solder bath Method 2: Soldering iron The test method to be used
46、shall be indicated in the relevant specification. The solder bath method is the one which simulates most closely the soldering procedures of flow soldering and similar soldering processes. The soldering iron method may be used in cases where Method 1 is impracticable. If required by the relevant spe
47、cification, the test conditioning may be preceded by accelerated ageing. The following are recommended conditions: Ageing 1a: 1 h steam ageing Ageing 1b: 4 h steam ageing Ageing 2: 10 days damp heat, steady state condition (40 2) C; (93 3) % RH (Test Cab) Ageing 3a: 4 h at 155 C dry heat (Test Bb) A
48、geing 3b: 16 h at 155 C dry heat (Test Bb). Ageing 4: 4 h unsaturated pressurized vapour (Test Cx) NOTE The test specimens may be introduced into the chamber at any temperature from laboratory temperature to the specified temperature. 4.1.2 Specimen preparation The surface to be tested shall be in t
49、he “as received“ condition and shall not be subsequently touched by the fingers or otherwise contaminated. The specimen shall not be cleaned prior to the application of a solderability test. If required by the relevant specification, the specimen may be degreased by immersion in a neutral organic solvent at room temperature. BS EN 60068-2-20:2008Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 26/05/2009 03:51, Uncontrol
