1、BRITISH STANDARD BS EN 60512-23-4: 2001 IEC 60512-23-4: 2001 Connectors for electronic equipment Tests and measurements Part 23-4: Screening and filtering tests Test 23d: Transmission line reflections in the time domain The European Standard EN 60512-23-4:2001 has the status of a British Standard IC
2、S 31.220.10 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS EN 60512-23-4:2001 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy
3、 Committee on 24 September 2001 BSI 24 September 2001 ISBN 0 580 38487 x National foreword This British Standard is the official English language version of EN 60512-23-4:2001. It is identical with IEC 60512-23-4:2001. The UK participation in its preparation was entrusted by Technical Committee EPL/
4、48, Electromechanical components for electronic equipment, to Subcommittee EPL/48/2, Connectors for electronic equipment, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have
5、 the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement int
6、ernational or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to in
7、clude all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/Eur
8、opean committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, p
9、ages 2 to 14, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60512-23-4 NORME EUROPENNE EUROPISCHE NORM August 2001 CENELEC European C
10、ommittee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENE
11、LEC members. Ref. No. EN 60512-23-4:2001 E ICS 31.220.10 English version Connectors for electronic equipment Tests and measurements Part 23-4: Screening and filtering tests Test 23d: Transmission line reflections in the time domain (IEC 60512-23-4:2001) Connecteurs pour quipements lectroniques Essai
12、s et mesures Partie 23-4: Essais de blindage et de filtrage Essai 23d: Rflexions de ligne de transmission en domaine temporel (CEI 60512-23-4:2001) Steckverbinder fr elektronische Einrichtungen Mess- und Prfverfahren Teil 23-4: Prfingen der Schirmung und Dmpfung Prfung 23d: Reflexion in bertragungs-
13、 strecken im Zeitbereich (IEC 60512-23-4:2001) This European Standard was approved by CENELEC on 2001-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any al
14、teration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by
15、 translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, G
16、reece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.EN 60512-23-4:2001 - 2 - Foreword The text of document 48B/1008/FDIS, future edition 1 of IEC 60512-23-4, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical component
17、s and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60512-23-4 on 2001-07-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national
18、 standard or by endorsement (dop) 2002-04-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2004-07-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standar
19、d, annex A is normative and annex B is informative. _ Endorsement notice The text of the International Standard IEC 60512-23-4:2001 was approved by CENELEC as a European Standard without any modification. _ Page2 EN60512234:2001 BSI09200160512-23-4 IEC:2001 3 CONTENTS 1 Scope and object . 4 2 Test e
20、quipment 4 3 Test specimen . 4 4 Test fixtures. 4 4.1 Test fixtures for test method A 4 4.2 Test boards for test method B . 4 5 Test procedure (methods A and B). 5 6 Documentation on testing. 7 6.1 Test methods A and B. 7 6.2 Additional items for test method B. 8 Annex A (normative) Test board descr
21、iption for test method B . 9 Annex B (informative) TDR practical guidance 13 Figure 1 Typical TDR waveform showing connector reflection 6 Figure A.1 Typical connector reflection test set-up 10 Figure A.2 Types of trace constructions 11 Figure A.3 Portion of time domain transmitted waveform for measu
22、rement of step signal amplitude and rise time when using a transmission type calibration trace .12 Figure A.4 Portion of TDR waveform for measurement of step signal amplitude fall time when using a shorted calibration trace12 Figure B.1 Typical waveform showing zero-reflection baseline and maximum a
23、nd minimum connector reflection amplitudes 14 Page3 EN60512234:2001 BSI09200160512-23-4 IEC:2001 4 CONNECTORS FOR ELECTRONIC EQUIPMENT TESTS AND MEASUREMENTS Part 23-4: Screening and filtering tests Test 23d: Transmission line reflections in the time domain 1 Scope and object This part of IEC 60512
24、defines two test methods for evaluating the performance of a connector in a transmission line by measuring the reflections produced by it in the time domain. In these methods, the connector under test is treated as a discontinuity in a transmission line with a controlled characteristic impedance. Te
25、st method A uses precision coaxial and semi-rigid coaxial cables to connect the connector under test and the test equipment. This method is suitable for many connector or cable assembly geometries. Test method B uses precision test boards, precision coaxial cables and semi-rigid coaxial cables to co
26、nnect the connector under test and the test equipment. This method is suitable for printed board connectors. 2 Test equipment Time domain reflectometer (TDR) or pulse generator and oscilloscope, precision cables of the characteristic impedance for which the connectors are intended, and a step genera
27、tor, if applicable. 3 Test specimen The test specimen shall consist of a mated pair of connector and/or cable assemblies including multiple contacts which may be variously connected to signal or ground conductors on the appropriate test cables. 4 Test fixtures 4.1 Test fixtures for test method A The
28、 required fixturing is semi-rigid coaxial cable (or equivalent). Special fixturing, if required, is described in 6.1. 4.2 Test boards for test method B For board-to-board connectors two printed circuit test boards incorporating a controlled characteristic impedance trace construction are used. Annex
29、 A contains a detailed description of the requirements and construction of these test boards. Page4 EN60512234:2001 BSI09200160512-23-4 IEC:2001 5 5 Test procedure (methods A and B) 5.1 Calibration of the test signal: measure the effective rise time and amplitude of the test signal using a calibrati
30、on trace to include the effect of fixturing on measurement system rise time. NOTE It is recommended that the product of the upper frequency limit (MHz) and input signal rise time be approximately 0,6. 5.2 Zero-reflection baseline: establish a zero-reflection baseline for the measurement of the conne
31、ctor reflection (see clause B.2 of annex B for more information). 5.3 Launch a signal at one or more of the specified rise times. Figure 1 shows a typical waveform. 5.4 Connector reflection amplitudes (measurements in terms of the reflection coefficient rho ( ) and not voltage). 5.4.1 Measure the ma
32、ximum positive and negative excursions (with respect to the zero- reflection baseline) of the reflection waveform corresponding to the connector under test. 5.4.2 Calculate the percentage of the measured step amplitude of the test system with test fixturing. Connector reflection amplitude = fixture
33、with equipment of amplitude step measured amplitude reflection connector measured 100 (%) 5.5 Repeat steps 5.3 and 5.4 if multiple signal rise times are to be used. See clause B.3 of annex B for guidance regarding method/options to change signal rise times. Page5 EN60512234:2001 BSI09200160512-23-4
34、IEC:2001 6 0,40 0,20 0,00 0,20 0,40 0,60 0,80 1,00 0,00 1,00 2,00 3,00 4,00 5,00 6,00 7,00 8,00 9,00 10,00 B A C D E F G Time ns Reflection IEC 565/01 Portions of typical TDR waveform: A TDR output voltage step E Connector under test B Coaxial cable F Test board 2 trace C Cable to test board 1 conne
35、ction G Resistive termination D Test board 1 trace Figure 1 Typical TDR waveform showing connector reflection Page6 EN60512234:2001 BSI09200160512-23-4 IEC:2001 7 6 Documentation on testing 6.1 Test methods A and B The following items describe the required information when reporting results of this
36、test: a) description of the equipment used, including the manufacturer and model numbers of equipment mainframe and plug-ins; b) method used to vary signal rise time (see clause B.3); c) signal-to-ground pin pattern; d) indication as to whether adjacent signal lines or pins of footprint description
37、are open (floating), terminated resistor (for example terminated in 50 , 75 , or other ohmic values), grounded, or connected to power supply layer; e) description of any special coaxial adaptors, probes, or attenuators that were used for connecting the test equipment to the test boards or cables. De
38、scription also of the connec- tion method of the test connector to the printed board (for example, through hole mount, surface mount, press-in, or other), and the signal path in the test fixture; f) description of the type and value of the resistive termination connected to the far end of the line u
39、nder test (if applicable); g) description of the types and values of the resistive terminations attached to other lines coupled to the line under test (if applicable); h) the following measurements: 1) rise time and amplitude of the test equipment step signal, INCLUDING the effect of test fixturing,
40、 2) for each test point and connector signal line to be tested, the maximum (positive or zero) and minimum (negative or zero) excursions of the reflection waveform due to the connector under test. These values are measured with respect to the zero reflection baseline specified in clause B.2. Report
41、these values as a percentage of the measured step amplitude of the test equipment with test fixturing. It is recommended that the photos of the oscilloscope traces, or plots of the TDR system, fixture test step calibration waveforms, and typical connector reflection waveforms labelled with correspon
42、ding test points and measurement numbers be included. Format for reporting connector reflections The following is a suggested format for reporting connector reflection amplitudes at a given signal rise time: Reflection measurement Test point on test board 1 Maximum reflection (positive or zero) Mini
43、mum reflection (negative or zero) % % % Page7 EN60512234:2001 BSI09200160512-23-4 IEC:2001 8 6.2 Additional items for test method B In addition to the above items, the following shall be reported for test method B only: a) overall drawings of test boards, including typical test trace lengths; b) des
44、cription of the vertical layered construction or “layout“ of test boards used, showing ground, signal trace, and surface pad layers; c) details of the printed circuit board mechanical footprints for both coaxial connectors and the connector-under-test. Include a complete description of the locations
45、 of all test signal positions and all rounded conductor positions involved in the test. The number and location of grounded conductors can have a significant effect on connector reflection amplitudes; d) description of the construction (including pad size, clearance size, barrel size, etc.) of the p
46、rinted circuit board surface pads or vias to which the connector under test is mounted. If possible, measure or estimate the capacitance to ground of these pads or vias, as this capacitance can have a significant effect on observed connector reflection amplitudes. Page8 EN60512234:2001 BSI0920016051
47、2-23-4 IEC:2001 9 Annex A (normative) Test board description for test method B A.1 Typical connector reflection test set-up For board-to-board connectors this transmission line is provided by two printed circuit test boards incorporating a controlled characteristic impedance trace construction, (ref
48、er to figure A.1). The mated connector-under-test is mounted between test board 1 and test board 2 in a fashion similar to its intended application. The TDR instrument is connected to test board 1 by means of a coaxial test cable, whose characteristic impedance matches the nominal impedance of the T
49、DR (typically 50 or 75 ). The far end of the test signal line on test board 2 is terminated with a resistive termination (see clause A.3 below). These boards shall provide for appropriate microwave quality cable or probe connection to the test traces on test board 1. A.2 Types of trace constructions (figure A.2) The preferred construction for the signal layers of the controlled characteristi
