1、 REVISIONS LT DESCRIPTION DATE APPROVED A Added “J” tolerance (5%) to all BR and BX capacitors. Added paragraphs 1.3 and 6.4. Revised tables VI, VII, and VIII. 21 April 2008 Michael A. Radecki B Revised the available voltages in table VII for vendors A and C. 22 January 2009 Michael A. Radecki C Cha
2、nged address of vendor D. 1 July 2010 Michael A. Radecki D Updated tables VII and VIII for vendor D. 9 November 2010 Michael A. Radecki E Canceled PINs that have duplicates in MIL-PRF-55681. Added K and M tolerance to BP capacitors. Specified the life test sample size. Updated tables VI, VII, and VI
3、II. 13 October 2011 Michael A. Radecki F Updated tables VII, and VIII for vendor C. 23 March 2012 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source Control drawing REV STATUS REV F F F F F F F F F F OF PAGES PAGES 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY MICHAEL A. RADECKI DESIGN A
4、CTIVITY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 11 April 2005 CHECKED BY MICHAEL A. RADECKI TITLE CAPACITORS, FIXED, CERAMIC, CHIP, 0805 APPROVED BY KENDALL A. COTTONGIM SIZE A CODE IDENT. NO. 037Z3 DWG NO. 05006 REV F PAGE 1 OF 10 AMSC N/A 5910-2012-E07CURRENT DESIGN A
5、CTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05006 REV F PAGE 2 1. SCO
6、PE 1.1 Scope. This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip. This drawing offers capacitors with higher capacitance values and lower voltages than those currently offered in MIL-PRF-55681/1 or MIL-PRF-55681/7. 1.2 Part or Identifying Number (PIN) The complete PIN is as f
7、ollows: 05006- BX 102 B J Z - Drawing number Dielectric (see 1.2.1) Capacitance value (see 1.2.2) Voltage (see 1.2.3) Capacitance tolerance (see 1.2.4) Termination finish (see 1.2.5) Group C testing option (see 1.2.6) 1.2.1 Dielectric. The dielectric type is identified by the following 2 letters as
8、defined in 3.3.1: BP, BR, BX. 1.2.2 Capacitance value. The nominal capacitance value, expressed in picofarads (pF) is identified by a three digit number; the first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is less than
9、 10 pF, the letter “R” is used to indicate the decimal point and the succeeding digit(s) of the group represent significant figure(s). 1R0 indicates 1.0 pF; R75 indicates .75 pF; and 0R5 indicates 0.5 pF. See tables VI, VII, and VIII for values. 1.2.3 Voltage. The rated voltage for continuous operat
10、ion at +125C is identified by a single letter as shown in table I. TABLE I. Rated voltage. Symbol Rated voltage (volts, dc) X 10 Y 16 Z 25 A 50 B 100 C 200 1.2.4 Capacitance tolerance. The capacitance tolerance is identified by a single letter in accordance with table II. TABLE II. Capacitance toler
11、ance. Symbol Capacitance tolerance () Tolerance applicability C .25 pF BP 10 pF D .50 pF BP 10 pF F 1 percent BP 10 pF G 2 percent BP 10 pF J 5 percent BP 10 pF, BR, BX K 10 percent BP 10 pF, BR, BX M 20 percent BP 10 pF, BR, BX Provided by IHSNot for ResaleNo reproduction or networking permitted wi
12、thout license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05006 REV F PAGE 3 1.2.5 Termination finish. Termination finish is identified by a single letter as shown in table III. TABLE III. Termination finish. Symbol Termination finish M Palladium-s
13、ilver U Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 percent lead). Solder has a melting point of +200C or less. Solder coat thickness is a minimum of 60 microinches. Z Base metallization-barrier metal-tinned (tin/lead alloy, with a minimum of 4 percent lead) 1
14、.2.6 Group C testing option. To require MIL-PRF-55681 group C testing, use the appropriate letter from table IV. If group C testing is not desired, leave this location blank. NOTE: Ordering group C options that contain a 2,000 hour life test may extend the processing time by 90 days or more. TABLE I
15、V. Group C testing option. Letter Group C testing option C Full group C L 2,000 hour life test only M 1,000 hour life test only H Low voltage humidity only N/A No group C testing. 1.3 MIL-PRF-55681 vs. DSCC Drawing 05006. When available, MIL-PRF-55681/1 and MIL-PRF-55681/7 capacitors are preferred o
16、ver DSCC Drawing 05006 capacitors. The military specification requires failure rate level verification and provides additional quality assurance provisions that are not required in this drawing. Refer to tables VI and VIII for MIL-PRF-55681/1 and MIL-PRF-55681/7 availability guidance. 2. APPLICABLE
17、DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ens
18、ure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specification
19、s, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (See 6.2). DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, U
20、nencapsulated, Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification For. MIL-PRF-55681/1 - Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Styles CDR01, CDR02, CDR03, and CDR04. MIL-PR
21、F-55681/7 - Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR31, Metric. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Components, Test Methods for. MIL-STD-1285 - Marking of Electrical and Electr
22、onic Parts. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license
23、from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05006 REV F PAGE 4 T W Y L NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Dimensions and tolerances are for bare chips. For solder coated terminations
24、 (symbol U), add .020 inch (0.51 mm) to the positive length tolerance and .015 inch (0.38 mm) to the positive width and thickness tolerances. FIGURE 1. Case dimensions and configuration. 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
25、 text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements sha
26、ll be in accordance with MIL-PRF-55681, and as specified herein. Unless otherwise stated, these capacitors shall be capable of meeting all electrical, environmental, and mechanical requirements of MIL-PRF-55681. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as
27、 specified in MIL-PRF-55681 and herein (see figure 1). 3.2.1 Tin plated finishes. Tin plating is prohibited as a final finish or as an undercoat. Tin-lead (Sn-Pb) finishes are acceptable provided that the minimum lead content is 4 percent (see 6.4). 3.3 Electrical characteristics. Inches mm .008 0.2
28、0 .020 0.51 .050 1.27 .055 1.40 .080 2.03 Dimensions L .008 W .008 T Max Y .008 .080 .050 .055 .020 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05006 REV F PAGE 5
29、3.3.1 Dielectric type. The dielectric type shall be BP (30 ppm/C), BR (+15, -40 percent) or BX (+15, -25 percent) ceramic in accordance with MIL-PRF-55681. TABLE V. Voltage-temperature limits. Symbol Capacitance change with reference to +25C Step A through step D of MIL-PRF-55681 table XIII Percent
30、rated voltage Step E through step G of MIL-PRF-55681 table XIII BP 0 30 ppm/C 100 0 30 ppm/C BR 15 percent 100 +15, -40 percent BX 15 percent 100 +15, -25 percent 3.3.2 Capacitance. Capacitance shall be in accordance with tables VI, VII, and VIII when measured in accordance with method 305 of MIL-ST
31、D-202. The following conditions shall apply: a. Test frequency: 1 MHz 50kHz (for all BP characteristic capacitors 1,000 pF); or 1kHz 50Hz for all other capacitors. b. Test voltage: 1.0 volt 0.2 volt rms. 3.3.3 Dissipation factor (+25C). The dissipation factor shall not exceed 0.15 percent for BP cha
32、racteristic capacitors, 5.0 percent for 10V BR and BX characteristic capacitors, 3.5 percent for 16V and 25V BR and BX characteristic capacitors, and 2.5 percent for 50V to 200V BR and BX characteristic capacitors. 3.3.4 Insulation resistance. At +25C: minimum of 100,000 megohms or 1,000 megohm-micr
33、ofarads, whichever is less. At +125C: minimum of 10,000 megohms or 100 megohm-microfarads, whichever is less for BR and BX dielectrics; and minimum of 1,000 megohms or 10 megohm-microfarads, whichever is less for BP dielectric. 3.4 Solderability. In accordance with MIL-PRF-55681, except the sample s
34、ize shall be 5 pieces with zero defectives permitted. 3.5 Moisture resistance. In accordance with MIL-PRF-55681, with the following exceptions: a. Polarizing voltage shall be rated voltage. b. Testing may be performed on chips with a larger width and/or length as long as they are cut from the same w
35、afer(s) as those used for production. 3.6 Marking. As a minimum, marking shall be on the package due to the small size of the chips. The package marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in paragraph 1.2 with manufacturers name or CAGE code and date code.
36、 The manufacturer may, at their option, mark some information on the chips. 3.7 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed in the MIL-PRF-55681 Qualified Products Database for at least one part, or perform the group A and grou
37、p C inspections specified herein on a sample of parts agreed upon by the manufacturer and DLA Land and Maritime-VAT. 3.8 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.9 Recycled, recovered, or environmenta
38、lly preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.10 Workmanship. In
39、 accordance with MIL-PRF-55681. 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not required. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO.
40、 05006 REV F PAGE 6 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for delivery shall consist of all tests specified in group A of MIL-PRF-55681. ESR testing and PPM testing and calculation are not applicable. When optional group C testing is requested, t
41、erminal strength and series resonance are not applicable. In addition, the life test sample shall be 25 with one defective permitted. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel
42、is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency
43、, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general
44、 or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Capacitors conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. This
45、 drawing is intended exclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When a military specification exists and the product covered by this drawing has been qualified for listing, this drawing becomes obsolete and will not be used
46、 for new design. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of par
47、ts by the manufacturer. c. Requirements for notification of change of product to acquiring activity, if applicable. d. Requirements for packaging and packing. 6.3 Replaceability. Capacitors covered by this drawing will replace the same commercial device covered by a contractor-prepared specification
48、 or drawing. 6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products th
49、at use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.5 Users of record. Coordinatio
