1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Remove vendors CAGE 18234, 27014 and 34335. Change to Military drawing format. Add LCC package. 87-06-18 N. A. Hauck F Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 02-12-09 Raymond Monnin G Corre
2、ct marking paragraph. Editorial changes throughout. - gap 05-12-06 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE
3、SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, DECODERS, MONOLITHIC AND AGENCIES OF THE DEPARTMENT OF
4、 DEFENSE DRAWING APPROVAL DATE 76-03-19 SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 76007 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E454-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE
5、 SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number
6、(PIN). The complete PIN is as shown in the following example: 76007 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS139 2
7、to 4 line decoder 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish.
8、 The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage -0.5 V dc to +7.0 V dc Input voltage range -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range. -65C to +150C Maximum power dissipation (PD) 1/ 61mW Lead temperature (soldering, 10 seco
9、nds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7
10、V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE SUPPLY CENTER COLUMBUS
11、COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the i
12、ssues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STA
13、NDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise
14、 indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited h
15、erein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A
16、 for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product
17、 in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or functio
18、n of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical di
19、mensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth tables shall be as specified o
20、n figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range.
21、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test S
22、ymbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOH VCC = 4.5 V, IOH = -400 A VIL= 0.7 V, VIH= 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOL VCC= 4.5 V, IOL= 4 mA VIL= 0.7 V, VIH= 2.0 V 1, 2, 3 All 0.4 V Inpu
23、t clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 100 A Low level input current IIL VCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -400 A Short-circuit output current IOS VCC= 5.5 V, VO
24、UT= 0.0 V 1/ 1, 2, 3 All -6 -130 mA Supply current ICCVCC= 5.5 V 1, 2, 3 All 11 mA Functional tests See 4.3.1c 7 All tPHL19 All 33 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 46 ns 38 Propagation delay time, high-to-low level, 2/ select to Y (two levels of delay) CL= 50 pF 10% 10, 11 All 53 n
25、s tPLH19 20 CL= 15 pF 10% 10, 11 All 28 ns 25 Propagation delay time, low-to-high level, 2/ select to Y (two levels of delay) CL= 50 pF 10% 10, 11 All 35 ns tPHL29 38 CL= 15 pF 10% 10, 11 All 53 ns 43 Propagation delay time, high-to-low level, 2/ select to Y (three levels of delay) CL= 50 pF 10% 10,
26、 11 All 60 ns tPLH29 29 CL= 15 pF 10% 10, 11 All 41 ns 34 Propagation delay time, low-to-high level, 2/ select to Y (three levels of delay) CL= 50 pF 10% 10, 11 All 48 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
27、STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type
28、 Limits Unit Min Max tPHL39 All 32 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 45 ns 37 Propagation delay time, high-to-low level, 2/ enable to Y (two levels of delay) CL= 50 pF 10% 10, 11 All 52 ns tPLH39 24 CL= 15 pF 10% 10, 11 All 34 ns 29 Propagation delay time, low-to-high level, 2/ enab
29、le to Y (two levels of delay) CL= 50 pF 10% 10, 11 All 41 ns 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the man
30、ufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,
31、 OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 Device types 01 01 Case outlines E, F 2 Terminal number Terminal symbols Terminal symbols 1 1 G N/C 2 1A 1 G 3 1B 1A 4 1Y0 1B 5 1Y1 1Y0 6 1Y2 N/C 7 1Y3 1Y1 8 GND 1Y2 9 2Y3 1Y3 10 2Y2 GND 11 2Y1 N/C 12 2Y0 2Y3 13 2B 2Y2 14 2A 2Y1 15 2 G
32、2Y0 16 VCC N/C 17 - - - 2B 18 - - - 2A 19 - - - 2 G 20 - - - VCCFIGURE 1. Terminal connections. Inputs Outputs Enable Select G B A Y0 Y1 Y2 Y3 H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L H = High level L = Low level X = Irelevant FIGURE 2. Truth table. Provided by IHSNot fo
33、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or net
34、working permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in tab
35、le II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark.
36、A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of
37、compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer
38、s product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Not
39、ification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made
40、 available onshore at the option of the reviewer. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be condu
41、cted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
42、available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test pa
43、rameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups
44、 A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. P
45、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76007 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test
46、 requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Group C and D end-point electrical parameters (m
47、ethod 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1
48、005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 o
