1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - drw 06-11-13 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 P
2、MIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. H. Johnson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY D. A. DiCenzo MICROCIRCUIT, LINEAR, HIGH CURRENT AND AGENCIES OF
3、 THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-07-28 SOURCE DRIVERS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-88519 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E052-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S
4、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-
5、PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88519 01 V X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: De
6、vice type Generic number Circuit function 01 UDS2981 High current source drivers 02 UDS2983 High current source drivers 1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style V GDIP1-T18 or CDIP2-T18 18 Dual-in-
7、line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VS): Device type 01 . 50 V dc Device type 02 . 80 V dc Continuous collector current (IOUT). -500 mA Input voltage range (VIN) 15 V dc Output voltage (VOUT): Device type
8、 01 . 50 V dc Device type 02 . 80 V dc Storage temperature range -65C to +150C Maximum power dissipation (PDany one driver) 1.1 W Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC). 28C/W Thermal resistance, junction-to-ambient (JA) 75C/W Junction temperature (T
9、J) +175C 1.4 Recommended operating conditions. Supply voltage range (VS): Device type 01 . 5 V dc to 50 V dc Device type 02 . 35 V dc to 80 V dc Ambient operating temperature range (TA) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST
10、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of t
11、his drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MI
12、L-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online
13、at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein,
14、 the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for n
15、on-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in ac
16、cordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of t
17、he device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensio
18、ns shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Test circuit and waveforms. The test circuit and waveforms sh
19、all be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical t
20、est requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CENTER COLU
21、MBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxOutput leakage current IOLVS= 50 V, VIN= 0.25 V, VOUT= 0
22、V 2/ 1, 2, 3 01 200 A VS= 80 V, VIN= 0.25 V, VOUT= 0 V 02 200 Collector-emitter saturation voltage VCE(SAT) VIN= 2.4 V, IOUT= -350 mA 1 All 2.0 V IN= 2.4 V, IOUT= -100 mA 2 All 3/ 1.8 IN= 2.4 V, IOUT= -200 mA 1.9 VIN= 2.4 V, IOUT= -100 mA 3 All 2.0 IN= 2.4 V, IOUT= -200 mA 2.1 Input current (outputs
23、 open) IIN(ON) VIN= 2.4 V 1, 2, 3 All 295 A IN= 3.85 V 600 IN= 12 V 2.3 mA IIN(OFF) VIN= 0 V, VS= 50 V 1, 2, 3 01 10 A IN= 0 V, VS= 80 V 02 10 Output source current (minimum) IOUTVIN= 2.4 V, VCE= 2.2 V 1, 2, 3 All -200 mA Supply current (outputs open) ISVIN= 2.4 V, VS= 50 V 2/ 1 01 10 mA 2, 3 20 VIN
24、= 2.4 V, VS= 80 V 2/ 1 02 10 2, 3 20 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC
25、 FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxTurn-on delay time tPHLVS= 35 V, RL= 175, TA= +25C, See figure 2 9 01 2.0 s VS= 50 V, RL= 250, TA= +25C,
26、See figure 2 02 2.0 Turn-off delay time tPLHVS= 35 V, RL= 175, TA= +25C, See figure 2 9 01 10 s VS= 50 V, RL= 250, TA= +25C, See figure 2 02 10 Clamp diode leakage current IRVS= VOUT= 50 V, All inputs VIN= 0.25 V 1, 2, 3 01 50 A VS= VOUT= 80 V, All inputs VIN= 0.25 V 02 50 Clamp diode forward voltag
27、e VFIF= 200 mA, VIN= VS= open 1, 2, 3 All 1.75 V 1/ VS= 50 V for device type 01 and VS= 80 V for device type 02, unless otherwise specified. 2/ All inputs simultaneously. 3/ Pulse tested. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PI
28、N listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance
29、 indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance.
30、A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product me
31、ets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of
32、 change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onsho
33、re at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device types 01,
34、 02 Case outline V Terminal number Terminal symbol 1 IN 1 2 IN 2 3 IN 3 4 IN 4 5 IN 5 6 IN 6 7 IN 7 8 IN 8 9 VS10 GND 11 OUT 8 12 OUT 7 13 OUT 6 14 OUT 5 15 OUT 4 16 OUT 3 17 OUT 2 18 OUT 1 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without l
35、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Test circuit and timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
36、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A
37、. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test cir
38、cuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specifie
39、d in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MI
40、L-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 9 Groups C and D end-point electrical parameters (met
41、hod 5005) 1, 2, 3, 9 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests s
42、hall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88519 DEFENSE SUPPLY CE
43、NTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. Th
44、e test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the inten
45、t specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended u
46、se. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepare
47、d specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and in
48、dustrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephon
