DLA SMD-5962-89497 REV B-2006 MICROCIRCUIT MEMORY DIGITAL CMOS 256K X 4 VIDEO RAM MONOLITHIC SILICON《硅单片256K X 4 视频内存互补型金属氧化物半导体数字存储微电路》.pdf
《DLA SMD-5962-89497 REV B-2006 MICROCIRCUIT MEMORY DIGITAL CMOS 256K X 4 VIDEO RAM MONOLITHIC SILICON《硅单片256K X 4 视频内存互补型金属氧化物半导体数字存储微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89497 REV B-2006 MICROCIRCUIT MEMORY DIGITAL CMOS 256K X 4 VIDEO RAM MONOLITHIC SILICON《硅单片256K X 4 视频内存互补型金属氧化物半导体数字存储微电路》.pdf(51页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03 and 04. Add case outline M. Add vendor CAGE 01295 as source of supply for device types 03 and 04. Update boilerplate. Editorial changes throughout. 94-11-01 M. A. Frye B Corrected number of leads for case outline package T in
2、section 1.2.4 from 32 to 28. Updated boilerplate as part of 5 year review. ksr 06-02-27 Raymond Monnin REV B B B B B B B B B B B B B B B SHEET 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 REV B B B B B B B B B B B B B B B B B B B B SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 RE
3、V STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Rajesh Pithadia DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Kenneth Rice COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY AL
4、L APPROVED BY Michael Frye DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-12-16 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 256K X 4 VIDEO RAM, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89497 SHEET 1 OF 49 DSCC FORM 2233 APR 97 5962-E223-06 Pro
5、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89497 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two produc
6、t assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA)
7、 levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 89497 01 M X A | | | | | | | | | | | | | | | | | Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5)
8、/ (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with
9、 the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time Access time 01 256K x 4, multiport video RAM 120 ns 35 ns 02 256K x 4, multiport video
10、 RAM 100 ns 30 ns 03 256K x 4, multiport video RAM 120 ns 35 ns 04 256K x 4, multiport video RAM 100 ns 30 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self
11、-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline
12、letter Descriptive designator Terminals Package style T See figure 1 28 “J“ lead chip carrier U CDFP4-F28 28 Flat pack X See figure 1 28 Dual-in-line Y See figure 1 28 “J“ lead chip carrier Z See figure 1 28 Rectangular leadless chip carrier M See figure 1 28 Zig-zag in-line 1.2.5 Lead finish. The l
13、ead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. Provided by IHSNot
14、for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89497 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 2/ Voltage range on any pin except DQ a
15、nd SDQ -1 V dc to 7 V dc Voltage range on DQ and SDQ - -1 V dc to VCCVoltage range on VCC- 0 V dc to 7 V dc Short circuit output current (per output) - 50 mA Power dissipation (PD) - 1 W Storage temperature range - -65C to 150C Lead temperature (soldering, 10 seconds) - +300C Thermal resistance, jun
16、ction-to-case (JC): Case U - See MIL-STD-1835 Cases X, Y, Z, and T - 10C/W 3/ Case M- 5C/W 3/ Junction temperature (TJ) 4/ - +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 5/ - +4.5 V dc to +5.5 V dc Supply voltage (VSS)- 0.0 V dc High level input voltage range (VIH) - 2.9 V
17、dc to VCC Low level input voltage range (VIL) 6/ - -1.0 V dc to 0.6 V dc System transition times, rise and fall (tt) - 3 ns to 50 ns Case operating temperature range (TC)- -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, stand
18、ards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for
19、. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these
20、 documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2/ Stresses above the absolute maximum rating may cause permanent damage to the devic
21、e. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein. 4/ Maximum junction temperature shall not be exceeded except for allowable sho
22、rt duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 5/ All voltage values in this drawing are with respect to VSS. 6/ The algebraic convention, where the more negative (less positive) limit is designated as minimum, is used in this drawing for voltage levels only.
23、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89497 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following do
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
本资源只提供5页预览,全部文档请下载后查看!喜欢就下载吧,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLASMD596289497REVB2006MICROCIRCUITMEMORYDIGITALCMOS256KX4VIDEORAMMONOLITHICSILICON 单片 256 KX4 视频 内存

链接地址:http://www.mydoc123.com/p-699428.html