1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. - gap 00-11-30 Raymond Monnin B Boilerplate update and part of five year review. tcr 07-07-05 Robert M. Heber THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED
2、. REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS A
3、VAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, MEMORY, DIGITAL, CMOS 16K X 4 SRAM WITH OE, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-03-27 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89892 SHEET 1 OF 14 DSCC FORM
4、 2233 APR 97 5962-E404-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This
5、 drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89892 01 X A Drawing number Device type (see 1.2.1) Ca
6、se outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 4C198L-25 16K X 4 Static RAM with OE 25 ns (data retention) 02 4C198-25 25 ns 03 4C198L-20 20 ns (data retention)
7、04 4C198-20 20 ns 05 4C198L-15 15 ns (data retention) 06 4C198-15 15 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual
8、-in-line package X CQCC3-N28 28 leadless chip carrier package Y CQCC4-N28 28 leadless chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc 1/ DC output current . 20 mA A
9、mbient storage temperature . -65C to +150C Temperature under bias . -55C to +125C Thermal resistance, junction-to-case (JC): Cases K, L, X, and Y See MIL-STD-1835 Power dissipation (PD) 1.0 W Lead temperature (soldering, 10 seconds) . +260C 1.4 Recommended operating conditions. Supply voltage range
10、(VCC) . +4.5 V dc to +5.5 V dc 1/ Ground voltage (VSS) (GND) . 0 V dc Input high voltage (VIH) . 2.2 V dc to VCC+0.5 V dc Input low voltage (VIL) . -0.5 V dc to 0.8 V dc 2/ Operating case temperature range (TC) . -55C to +125C 1/ All voltages referenced to VSS. 2/ VILnegative undershoots to a minimu
11、m of -2.0 V dc are allowed with a maximum 20 ns pulse width. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2
12、234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation o
13、r contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE
14、 HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue,
15、 Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
16、 exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (Q
17、ML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as d
18、ocumented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-3
19、8535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2
20、herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only. Each c
21、oated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor testing shall not be decreased unless approved by the preparing
22、 activity. Samples may be pulled anytime after seal. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements.
23、 The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the ma
24、nufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
25、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C 4.5 V VCC 5.5 V VSS= 0 V Group A subgroupsDevice type Li
26、mits Unit unless otherwise specified Min Max Input leakage current ILIVCC= max, 1, 2, 3 All 10 A VIN= GND to VCCOutput leakage current ILOVCC= max, 1, 2, 3 All 10 A OUT= GND to VCC, CE VIH, WE VILOutput low voltage VOLVCC= 4.5 V, IOL= 8 mA, 1, 2, 3 All 0.4 V VIL= 0.8 V, VIH= 2.2 V Output high voltag
27、e VOHVCC= 4.5 V, IOH= -4 mA, 1, 2, 3 All 2.4 V IL= 0.8 V, VIH= 2.2 V Operating supply current ICC1CE = VIL, outputs open, 1, 2, 3 01, 03 120 mA VCC= max, f = 1/tAVAV02, 04 130 05, 06 150 Standby power supply ICC2CE VIH, outputs open, 1, 2, 3 01, 03, 20 mA current (TTL) VCC= max, f = 0 MHz 05 02, 04,
28、 06 50 Standby power supply ICC3VCC+0.2 V CE VCC-0.2 V, 1, 2, 3 01, 03, 5 mA current (CMOS) outputs open, 05 VCC+0.2 V VIN VCC-0.2 V or +0.2 V VIN -0.2 V, 02, 04, 20 f = 0 MHz 06 Data retention current 1/ ICC4VCC= VDR1, 2, 3 01, 03, 600 A = 2.0 V 05 Input capacitance 1/ CINVI= 0 V 4 All 10 pF f = 1
29、MHz, TA= +25C, See 4.3.1c Output capacitance 1/ COUTVO= 0 V 4 All 10 pF f = 1 MHz, TA= +25C, See 4.3.1c See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENT
30、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 2/ 3/ -55C TC+125C 4.5 V VCC 5.5 V VSS= 0 V Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Read cycle ti
31、me tAVAV9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 15 Address cycle time tAVQV9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 15 Chip enable access time tELQV9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 15 Output hold from address tAVQX9, 10, 11 All 3 ns change Output enable to output tOLQV9, 10, 11 01, 02 15 ns va
32、lid 03, 04 12 05, 06 10 Chip select to output tELQX9, 10, 11 All 3 ns in low Z 1/ 4/ Output enable to output tOLQX9, 10, 11 All 3 ns in low Z 1/ 4/ Chip select to output tEHQZ9, 10, 11 01-04 15 ns in high Z 1/ 4/ 05-06 10 Output disable to output tOHQZ9, 10, 11 All 10 ns in high Z 1/ 4/ See footnote
33、s at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance
34、 characteristics Continued. Test Symbol Conditions 2/ 3/ -55C TC+125C 4.5 V VCC 5.5 V VSS= 0 V Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Write enable to output tWLQZ9, 10, 11 01, 02 15 ns in high Z 1/ 4/ 03, 04 12 05, 06 10 Data valid to end of write tDVWH9, 10, 11
35、01, 02 15 ns 03, 04 12 05, 06 10 Data hold time tWHDX9, 10, 11 All 0 ns Output active from end tWHQX9, 10, 11 All 3 ns of write 1/ 4/ Write cycle time 1/ tAVAV9, 10, 11 01, 02 25 ns 03, 04 20 05, 06 15 Chip select to end of write tELWH9, 10, 11 01, 02 20 ns 03, 04 15 05, 06 12 Address valid to end o
36、f write tAVWH9, 10, 11 01, 02 20 ns 03, 04 15 05, 06 12 Address setup time tAVWL9, 10, 11 All 0 ns Write pulse width tWLWH9, 10, 11 01, 02 20 ns 03, 04 15 05, 06 12 Write recovery time tEHAX9, 10, 11 01-06 0 ns Chip deselect to data tCDR9, 10, 11 01, 03, 0 ns retention time 05 Operation recovery tim
37、e tR9, 10, 11 01, 03, tAVAV ns 05 1/ This parameter tested initially and after any design or process change which could affect this parameter, and is therefore guaranteed to the limits specified in table I. 2/ For timing waveforms, see figure 3. 3/ AC parameters are tested using input rise and fall
38、times of 5 ns and input pulse levels of GND to 3.0 V. Both input and output timing reference levels are 1.5 V, and the output load is shown on figure 4. 4/ Transition is measured 500 mV from steady state. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,
39、-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device types 01 through 06 Case outlines K and L X and Y Terminal number Terminal symbol 1 A0NC 2 A1NC 3 A2A04 A3A15 A4A26 A5A37 A6A48 A7A59 A8A6
40、10 CE A711 OE A812 GND CE 13 WE OE 14 I/O1GND 15 I/O2NC 16 I/O3WE 17 I/O4I/O118 NC I/O219 A9I/O320 A10I/O421 A11A922 A12A1023 A13A1124 VCCA1225 - A1326 - NC 27 - NC 28 - VCCNC = no connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without
41、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device types 01 through 06 CE WE OE Mode I/O Power H X X Not selected High Z Standby L L X Write DINActive L H L Read DOUTActi
42、ve H = Logic “1“ state L = Logic “0“ state X = Dont care FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B
43、SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Switching time waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC
44、FORM 2234 APR 97 FIGURE 3. Switching time waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 11 DSCC F
45、ORM 2234 APR 97 FIGURE 3. Switching time waveforms - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 12 DSCC FO
46、RM 2234 APR 97 FIGURE 4. Output loads circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 13 DSCC FORM 2234 APR 97 3
47、.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
