1、SMD-5962-76600 REV A m 9999996 OL2824L TT3 m NOTICE OF REVISION (NOR) THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED. 1. DATE (YYMMOD) Form Approved 98-06-1 O OM6 No. 0704-0 188 I I b. ADDRESS (Street, Ciw State, Z Code) 5. CAGE CODE I. ORIGINATOR Defense Supply Center, Co
2、lumbus 67268 3990 East Broad Street Columbus, OH 43216-5000 1. TYPED NAME (Fitst Middle initiaal, 7. CAGE CODE Last) 67268 3. TITLE OF DOCUMENT MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, 10. REVISION LETTER 8-STAGE PRESEUABLE SYNCHRONOUS DOWN COUNTERS 2. PROCURING ACTIVITY NO. 3. DODAAC 6. NOR
3、NO. 5962-R106-98 8. DOCUMENT NO. 5962-96600 11. ECP NO. No users listed. MONOLITHIC SILICON a. CURRENT b. NEW initial A 13. DESCRIPTION OF REVISION Sheet 1: Revisions Itr column; add A“. Revisions description column; add “Changes in accordance with NOR 5962-R106-98. Revisions date column; add 98-06-
4、10. Revision level block; add “A“. Rev status of sheets; for sheets 1, 4, and 16 through 24, add “W. this document.“ Revision level block; add “A“. Sheet 4: Add new paragraph which states; 3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to Sheets 16 through 24: Add
5、attached appendix A. a (xone) CONTINUED ON NEXT SHEETS X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised doc
6、ument. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT 1 c. TYPED NAME (fitst, Middle hitiad Last) DSCC-VAC I MONICA L. POELKING d. TITLE CHIEF, CUSTOM MICROELECTRONICS TEAM 15a. ACTIVITY ACCOMPLISHING REVISION DSCC-VAC e. SIGNATURE MONICA L. POELKING b. REVISION COMPLETED (Sisnature) JOSEPH
7、 A. KERBY f. DATE SIGNED (WMMDD) c. DATE SIGNED (WMMDD) 98-06-1 O DD Form 1695, APR 92 Previous editions are obsolete. Licensed by Information Handling ServicesSMD-59b2-9bb00 REV A m 999999b 0328242 93T m STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 APPENDIX
8、 A APPENDIX A FORMS A PART OF SMD 5962-96600 SIZE 5962-96600 A REVISION LEVEL SHEET A 16 Document No: 5962-96600 Revision: A Sheet: 2 of 10 NOR NO: 5962-R106-98 10. SCOPE 10.1 Score. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers
9、List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified
10、herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. 10.2 PIN. Th
11、e PIN shall be as shown in the following example: 59,62 96600 i 4 T Federal RHA Device Device Die Die Details Stock class designator type class code designator (see 10.2.1) (see 10.2.2) designator (see 10.2.4) (see 10.2.3) 5 Drawing Number 10.2.1 RHA desianator. Device classes Q and V RHA identified
12、 die shall meet the MIL-PRF-38535 specified RHA levels. A 10.2.2 Device tvoeis). The device type(s) shall identify the circuit function as follows: dash (-) indicates a non-RHA die. Device tvpe Generic number Circuit function o1 02 401 028 Radiation Hardened, CMOS, dual cascaded 4-bit BCD presettabl
13、e synchronous down counter Radiation Hardened, CMOS, 8-bit binary presettable synchronous down counter 401036 10.2.3 Device class desianator. Device class Device reauirements documentation Q or V Certification and qualification to the die requirements of MIL-PRF-38535. DSCC FORM 2234 APR 97 Licensed
14、 by Information Handling ServicesSMD-59b2-7bb00 REV A = 999999b 0328243 876 M STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96600 SIZE 5962-96600 A REVISION LEVEL SHEET A 17 Document No: 5962-96600 Revision: A Sh
15、eet: 3 of 1 O NOR NO: 5962-RI 06-98 10.2.4 Die Details. The die details designation shall be a unique letter which designates the dies physical dimensions, bonding pad location(s) and related electrical function), interface materials, and other assembly related information, for each product and vari
16、ant supplied to this appendix. 10.2.4.1 Die Phvsical dimensions. Die TvDes Fiaure number O1 02 A- 1 A-2 10.2.4.2 Die Bondina Dad locations and Electrical functions. Die TvDes Fiaure number O1 A- 1 02 A-2 10.2.4.3 Interface Materials. Die TvDes Fiaure number o1 A- 1 02 A-2 10.2.4.4 Assemblv related i
17、nformation. o1 A- 1 02 A-2 10.3 Absolute maximum ratinas. See paragraph 1.3 within the body of this drawing for details. 10.4 Recommended oDeratina conditions. See paragraph 1.4 within the body of this drawing for details. 20. APPLICABLE DOCUMENTS 20.1 Government specifications. standards, bulletin.
18、 and handbooks. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a pari of this drawing to the extent specified herein.
19、DSCC FORM 2234 APR 97 Licensed by Information Handling ServicesSMD-5962-96600 REV A D 9999996 0328244 702 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321 6-5000 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96600 SIZE 5962-96600 A REVISION LEVEL SHEET A 18 Document
20、No: 5962-96600 Revision: A Sheet: 4 of 10 NOR NO: 596243106-98 SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Methods and Procedures for Microelectronics. HANDBOOK DEPARTMENT OF DEF
21、ENSE MIL-HDBK-103 - List of Standardized Military Drawings (SMDs). (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific 20.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited here
22、in, the 30. REQUIREMENTS 30.1 Item Reauirements. The individual item requirements for device classes Q and V shall be in accordance with acquisition functions should be obtained from the contracting activity or as directed by the contracting activity). text of this drawing shall take precedence. MIL
23、-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit or function as described herein. specified in MIL-PRF-38535 and the manufacturers QM plan, for device classes Q and V and herein.
24、 30.2 DeSian, construction and Dhvsical dimensions. The design, construction and physical dimensions shall be as 30.2.1 Die Phvsical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figures A-1 and A2. 30.2.2 Die bondina Dad locations and electrical functions. The die
25、 bonding pad locations and electrical functions shall be 30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figures A-1 and A2. 30.2.4 Assemblv related information. The assembly related information shall be as specified in 10.2.4.4 and figures A-
26、1 30.2.5 Truth table. The truth table shall be as defined within paragraph 3.2.3 of the body of this document. as specified in 10.2.4.2 and on figures A-1 and A2. and A2. Licensed by Information Handling ServicesSMD-5962-9bb00 REV A 9999996 0128245 b49 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CE
27、NTER COLUMBUS I COLUMBUS, OHIO 43216-5000 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96600 SIZE 5962-96600 A REVISION LEVEL SHEET A 19 I Document No: 5962-96600 I Revision: A NOR NO: 5962-R106-98 I Sheet: 5 of 10 30.3 Electrical Derformance characteristics and Dost- irradiation Darameter limits.
28、 Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. 30.4 Electrical test reauirements. The wafer probe test requirements shall include functional and parametric testing sufficie
29、nt to make the packaged die capable of meeting the electrical performance requirements in table I. 30.5 Markinq. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, th
30、e manufacturers identification and the PIN listed in 10.2 herein. The certification mark shall be a “QML“ or “Q“ as required by MIL-PRF-38535. 30.6 Certification of comoliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to
31、supply to the requirements of this drawing (see 60.4 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the
32、 requirements herein. 30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. 40. QUALITY ASSURANCE PROVISIONS 40.1 SamDlina and inmection. For device classes
33、Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modifications in the QM plan shall not effect the form, fit or function as described herein. 40.2 Screeninq. For device classes Q and
34、 V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturers QM plan. As a minimum it shall consist of: a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007. b) 100% wafer probe (see paragraph 30.4). c) 100% internal visual
35、 inspection to the applicable class Q or V criteria defined within MIL-STD-883 TM201 O or the alternate procedures allowed within MIL-STD-883 TM5004. DSCC FORM 2234 APR 97 Licensed by Information Handling ServicesAPPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96600 STANDARD MICROCIRCUIT DRAWING COLU
36、MBUS, OHIO 43216-5000 DEFENSE SUPPLY CENTER COLUMBUS Document No: 5962-96600 Revision: A Sheet: 6 of 10 NOR NO: 5962431 06-98 SIZE 5962-96600 A REVISION LEVEL SHEET A 20 40.3 Conformance insoection. 40.3.1 Grow E insoection. Group E inspection is required only for parts intended to be identified as
37、radiation assured (see 30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs 4.4.4.1,4.4.4.1.1, 4.4.4.2, 4.4.4
38、.3 and 4.4.4.4. I 50. DIECARRIER 50.1 Die carrier requirements. The requirements for the die carrier shall be in accordance with the manufacturers QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic pr
39、otection. 60. NOTES 60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes. 60.2 Comments. C
40、omments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 4321 6-5000 or telephone (61 4)-692-0674. I 60.3 Abbreviations. svmbols and definitions. The abbreviations, symbols, and definitions used herein are defined with MIL-PRF-38535 and MIL-HDBK-1331. I DSCC FORM 2234 APR 97 Licensed
41、by Information Handling ServicesSMD-5962-96600 REV A 9979996 Ol282Y7 Lill APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96600 Document No: 5962-96600 Revision: A Sheet: 7 of 10 NOR NO: 5962-Ri 06-98 I I STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321 6-5000 FIGURE A
42、-1 o DIE PHYSICAL DIMENSIONS I SIZE A 5962-96600 REVISION LEVEL SHEET A 21 Die Size: I Die Thickness: 2540 x 2997 microns. 20 +/-i mils. I o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONS 97- i05 ,464 -2.667) 4- 10 Licensed by Information Handling ServicesSMD-5962-96600 REV A 9999996 L282YB 358
43、STANDARD MICROCIRCUIT DRAWING COLUMBUS, OHIO 4321 6-5000 DEFENSE SUPPLY CENTER COLUMBUS APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96600 SIZE 5962-96600 A REVISION LEVEL SHEET A 22 Document No: 5962-96600 Revision: A Sheet: 8 of 10 NOR NO: 5962431 06-98 o INTERFACE MATERIALS Top Metallization: A
44、I Il.0kA - 14.0kA Backside Metallization None Glassivation Type: PSG Thickness 10.4kA - 15.6kA Substrate: Single crystal silicon o ASSEMBLY RELATED INFORMATION Substrate Potential: Special assembly instructions: Floating or Tied to VDD. Bond pad #I 6 (VDD) first. DSCC FORM 2234 APR 97 Licensed by In
45、formation Handling ServicesSND-5962-9bbOO REV A 9999796 0328249 294 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321 6-5000 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96600 SIZE 5962-96600 A REVISION LEVEL SHEET A 23 FIGURE A-2 o DIE PHYSICAL DIMENSIONS Die Size:
46、Die Thickness: 20 +I-1 mils. o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONS 2540 x 2997 microns. Document No: 5962-96600 Revision: A Sheet: 9 of 10 NOR NO: 5962-R106-98 NOTE: Pad numbers reflect terminal numbers when placed in Case Outlines E, X (see Figure 1). DSCC FORM 2234 APR 97 Licensed b
47、y Information Handling ServicesSMD-59b2-9bb00 REV A 9999996 0128250 TO distribution is unlimited. Licensed by Information Handling ServicesSMD-59b2-96600 99b 0085128 457 W 1. SCOPE 1.1 hall be made available onshore at the option of the reviewer. 3.10 )(icrocircuit arow ass iamt for device class y .
48、 Device class M devices covered by this drawing shall be in nicrocircuit group nhr 40 (see MIL-1-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Samlina and inswctipp. For device class Ml sampling and inspection procedures shall be in accordance with For device classes Q and VI sampling and
49、inspection procedures shall be in accordance liL-STD-883 (see 3.1 herein). iith MIL-1-38535 or as modified in the device manufacturers quality management (QM) plan. 3lan shall not affect form, fit, or function as described herein. lhe modification in the OM 4.2 Screeninq. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be :onducted on all devices prior to quality conformance inspection. For device classes P and V, screening shall be in accordance with MIL-1-38535, and shall be conducted on all devices prior to qualifi
