1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions Rev 03 2012 02 16 N Status No replacement named N. Benipal, NA 2006 03 08 Revised Inserted 3.0; Deleted 3.7, 3.8, 4 1985 12 20 Released CAP1-CR535123 Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page 1 of 6 CH
2、IP RESISTANT COATING, ONE-COMPONENT URETHANE, ESB-M99J337-A PAINTABLE, HEAT CURING, NON MASKING, 130 MICROMETER MINIMUM FILM THICKNESS CHIP RESISTANT COATING, ONE-COMPONENT URETHANE, ESB-M99J337-A2 PAINTABLE, HEAT CURING, NON-MASKING, 130 MICROMETER MINIMUM FILM THICKNESS, ACCENT TOPCOAT COMPATIBLE
3、NOT TO BE USED FOR NEW DESIGN 1. SCOPE The materials defined by these specifications are heat curing one-component urethane coatings which can be sprayed to a 130 - 200 micrometer film on cathodic electrocoated CRS and cathodic electrocoated galvanized steel. The materials shall provide a paintable
4、corrosion resistant film which will withstand stone chipping. 2. APPLICATION These specifications were released originally for a one-component urethane coating that provides stone chipping protection on a vehicles lower bodyside. This area of a vehicle received severe stone chipping abuse. Since the
5、 material has good adhesion at extremely low film thicknesses, no masking operations are required during its application. ESB-M99J337-A2 is also capable of a wet-on-wet-on-wet application, under the body spray primer and followed by a low gloss topcoat. This 3 layer system is cured by the spray prim
6、er bake cycle. 3. REQUIREMENTS Material specification requirements are to be used for initial qualification of materials. The material shall meet all requirements detailed in this section. Approved production material applied and tested under identical conditions shall be used as the control. In the
7、 event that both the sample under test and the control material fail any requirements, that test shall be repeated. These requirements apply to both laboratory-prepared and production batches of the coating. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers mus
8、t conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 COMPOSITION 3.1.1 Non-Volatile, %, min 60 (FLTM BI 102-01) ENGINEERING MATERIAL SPECIFICATION ESB-M99J337-A/A2 Copyright 2012, Ford Global Technologies, LLC Page 2 of 6 3.1.2 Toxicity The material shall be
9、 non-toxic and shall not cause skin rash or irritation (dermatitis) to exposed handlers in normal production operations. Benzene and chlorinated hydrocarbon solvents are considered toxic and their use is strictly prohibited in compounding material to these specifications. 3.2 PHYSICAL PROPERTIES 3.2
10、.1 Weight per Volume at 23 +/- 2 C, kg/L 1.15 - 1.40 3.2.2 Viscosity, KU 70 - 95 (ASTM D 562) 3.2.3 Heat Stability, KU, max 105 (FLTM BI 102-03) Test Method: Make the following exceptions to FLTM BI 102-03: . Measure the viscosity per ASTM D 562. . Place in an oven at 49 C for 5 days. 3.3 PREPARATIO
11、N OF TEST PANELS Materials submitted for initial approval shall be tested on both cold rolled steel and minimum spangle temper rolled quality galvanized steel (ESB-M1A62 type) panels for all requirements of this specification. 3.3.1 System Components 3.3.1.1 Panel Preparation with Spray Primer . Sub
12、strates: Ford PTQ cold rolled steel and WSB-M1A250-C3 98G98G galvanized steel. . Pre-treatment: ESB-M3P1 zinc phosphate. . Primer: ESB-M64J28 high build cathodic electrocoat primer, 30 - 33 micrometer followed by the specified bake cycle. . Stone Chip Material: 130 - 200 micrometer. Do not reduce th
13、e material. Within 3 minutes after the stone chip material application, make a wet-on-wet application of spray primer. . Spray Primer: ESB-M6J152, 19 - 25 micrometer; co-bake stone chip material and the spray primer as specified in para 3.3.2. ENGINEERING MATERIAL SPECIFICATION ESB-M99J337-A/A2 Copy
14、right 2012, Ford Global Technologies, LLC Page 3 of 6 . Topcoat: Prepare three sets of topcoated panels. Set I: ESB-M50J107 - Quality acrylic enamel, 38 - 51 micrometer followed by the specified bake cycle. Set II: ESB-M33J100 - Quality high solids acrylic enamel, 38 - 51 micrometer followed by the
15、specified bake cycle. Set III: ESB-M33J3-A - High solids basecoat/clearcoat; dry film thicknesses - basecoat: 15 - 20 micrometer, and clearcoat: 40 - 50 micrometer, followed by the specified bake cycle. 3.3.1.2 Panel Preparation with Spray Primer and Low Gloss Topcoat (ESB-M99J337-A2 requirement onl
16、y) . Substrates: Ford PTQ cold rolled steel and ESB-M1A62 galvanized steel. . Pre-treatment: ESB-M3P1 zinc phosphate. . Primer: ESB-M64J23 high build cathodic electrocoat primer, 30 - 33 micrometer followed by the specified bake cycle. . Stone Chip Material: 130 - 200 micrometer. Do not reduce the m
17、aterial. Within 3 minutes after the stone chip material application, make a wet-on-wet application of spray primer. . Spray Primer: ESB-M6J152, 19 - 25 micrometer. Within 3 minutes after applying the spray primer, make a wet-on-wet application of low gloss black topcoat. . G“ Gloss Black Topcoat: ES
18、B-M32J106, 39 50 micrometer. Bake this 3 layer wet-on-wet system as specified in para 3.3.2. 3.3.1.3 Panel Preparation with Spray Primer Deleted (ESB-M99J337-A requirement only) . Substrates: Ford PTQ cold rolled steel and ESB-M1A62 galvanized steel. . Pre-treatment: ESB-M3P1 zinc phosphate. . Prime
19、r: ESB-M64J23 high build cathodic electrocoat primer, 30 - 33 micrometer, followed by the specified bake cycle. . Stone Chip Material: 130 - 200 micrometer. Do not reduce the material. Bake the material as described in para 3.3.2. ENGINEERING MATERIAL SPECIFICATION ESB-M99J337-A/A2 Copyright 2012, F
20、ord Global Technologies, LLC Page 4 of 6 . Topcoat: Prepare two sets of topcoated panels. Set I: ESB-M50J107 - Quality acrylic enamel, 38 - 51 micrometer followed by the specified bake cycle. Set II: ESB-M33J100 - Quality high solids acrylic enamel, 38 - 51 micrometer followed by the specified bake
21、cycle. 3.3.2 Bake Cycle for the Stone Chip Material . Bake, min; 10 minutes at 149 +/- 2 C metal temperature. . Bake, max; 30 minutes at 163 +/- 2 C metal temperature. 3.3.3 Panel Aging Age panels 72 h at room temperature or 16 h at 43 +/- 2 C oven temperature before initiating a test program. 3.4 A
22、PPEARANCE 3.4.1 Color Gray 3.4.2 Leveling The chip coating film shall level with a minimum of orange peel. The surface of the material under test shall be equal to or better than the approved master sample for smoothness when applied and cured under identical conditions. 3.5 FILM PROPERTIES 3.5.1 Sa
23、gging and Solvent Popping No sagging or solvent popping is allowable at 1 200 micrometer dry film thickness. 3.5.2 Dry Sanding Characteristics The chip coating plus ESB-M6J152 spray primer shall dry sand (using a new sheet of 280 grit stearate filled paper for each panel) smoothly without clogging t
24、he paper and with a minimum of sand scratches. The material shall be equivalent in all respects to current approved production coating applied and tested under identical conditions. 3.5.3 Paintability No significant color shift, difference in orientation of metallic flakes (metallic paints) or other
25、 objectionable appearance defects in the topcoat over the chip coating. 3.6 RESISTANCE PROPERTIES With the exception of para 3.6.1, prepare the test panels as stated in para 3.3. For 3.6.1, prepare the panels as described therein. ENGINEERING MATERIAL SPECIFICATION ESB-M99J337-A/A2 Copyright 2012, F
26、ord Global Technologies, LLC Page 5 of 6 3.6.1 Adhesion (FLTM BI 103-01 and BI 106-01, Part B) Test Requirements: FLTM BI 103-01: Less than 3 mm creepback from the scribe. FLTM BI 106-01, Part B: No loss of topcoat or primer adhesion. Test Method: . Prepare panels per para 3.3 with the following exc
27、eption: . Apply the chip coating as a film wedge, ranging from 1 - 200 micrometer. . Scribe the entire length of the panels and salt spray test for 1000 h. . Within 30 minutes after salt spray testing, tape test the scribed area and test the coatings adhesion per FLTM BI 106-01, Part B. 3.6.2 Chip R
28、esistance at Room Temperature Followed by Salt Spray (SAE J400/FLTM BI 103-01) After tape adhesion, there shall be an SAE chip rating of 7A max (to bare metal), less than 3 mm creepback from the scribe, and no face blistering. Test Method: . Strike the test specimen with 4.7 L of gravel per SAE J400
29、. . Scribe an “X“ to the substrate on the lower 76 mm of the test specimen. . Expose to salt spray for 1000 h per FLTM BI 103-01. . Within 30 minutes after the completion of salt spray testing, apply ESF-M3G48 tape, with firm thumb pressure, to the entire surface of the part. Remove the tape by pull
30、ing one end at a 90 angle with moderate speed. 3.6.3 Chip Resistance at -30 C Followed by Salt Spray (SAE J400/FLTM BI 103-01) After tape adhesion, there shall be a chip rating of 7B max (to bare metal), less than 3 mm creepback from the scribe, and no blistering. Test Method: Same as described in p
31、ara 3.6.2 except for the following change: . Prior to gravelometer testing, condition the panels for 4 h min at -30 C. Gravelometer test panels immediately after removal from the -30 C environment. 3.6.4 Condensing Humidity, min 240 h (FLTM BI 104-02, Procedure A) No blistering or loss of gloss. ENG
32、INEERING MATERIAL SPECIFICATION ESB-M99J337-A/A2 Copyright 2012, Ford Global Technologies, LLC Page 6 of 6 3.6.5 Accelerated Weathering Resistance Panels shall show no more than a minimum degree of fading, chalking or dulling. No increase of brittleness or loss of adhesion is permitted and panels sh
33、all be completely free from evidence of cracking, checking, blistering, or peeling when exposed to the following cycle for 500 h: . 4 h at 60 C with ultraviolet light exposure. . 4 h at 50 C condensing water exposure. See para 5.1 for recommended weathering machines. 3.6.6 Florida Exposure Panels sh
34、all be prepared as in para 3.3 and 3.6.1, scribed with an “X“ to bare metal and exposed in the Miami, Florida area at 5 facing south for 12 months. There shall be no blistering, peeling or visible rusting along the scribe marks more than 3 mm total width. 3.6.7 Cold Checking Resistance (FLTM BI 107-
35、02) Shall withstand a minimum of 10 cold test cycles without cracking or noticeable dulling when cured at the minimum baking temperature. 3.6.8 Storage Stability The chip coating shall be stored at ambient room temperature below 38 C, away from all sources of heat. Heat greatly accelerates aging. Un
36、der these storage conditions, the minimum shelf life of the material shall be 3 months. When this material is stored at temperatures below 23 C, it shall be conditioned at room temperature prior to application. Adequate conditioning permits the material to obtain its maximum application properties. 5. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of these specifications. 5.1 RECOMMENDED ACCELERATED WEATHERING EQUIPMENT Equipment for para 3.6.5 is listed below: Q-Panel Company QUV Atlas Corporation UVCON
