1、Designation: F2678 10Standard Practice forPreparing Panel Underlayments, Thick Poured GypsumConcrete Underlayments, Thick Poured Lightweight CellularConcrete Underlayments, and Concrete Subfloors withUnderlayment Patching Compounds to Receive ResilientFlooring1This standard is issued under the fixed
2、 designation F2678; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revi
3、sion or reapproval.1. Scope1.1 This practice includes recommendations for preparingand smoothing panel underlayments, gypsum concrete andconcrete subfloors with patching compounds upon whichresilient flooring may be installed.1.2 This practice does not cover the adequacy of thesubfloor assembly to p
4、erform its structural requirements, whichis governed by local building codes.1.3 This practice does not supersede in any manner theresilient flooring, underlayment or adhesive manufacturerswritten instructions. Consult the individual resilient flooring,underlayment or adhesive manufacturer for speci
5、fic recom-mendations.1.4 The values stated in inch-pound units are to be regardedas standard. The values given in parentheses are mathematicalconversions to SI units that are provided for information onlyand are not considered standard.1.5 This standard does not purport to address all of thesafety c
6、oncerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2C109/C109M Test Method for Compressi
7、ve Strength ofHydraulic Cement Mortars (Using 2-in. or 50-mm CubeSpecimens)C472 Test Methods for Physical Testing of Gypsum, Gyp-sum Plasters and Gypsum ConcreteF141 Terminology Relating to Resilient Floor CoveringsF710 Practice for Preparing Concrete Floors to ReceiveResilient FlooringF1482 Practic
8、e for Installation and Preparation of PanelType Underlayments to Receive Resilient FlooringF2419 Practice for Installation of Thick Poured GypsumConcrete Underlayments and Preparation of the Surface toReceive Resilient FlooringF2471 Practice for Installation of Thick Poured LightweightCellular Concr
9、ete Underlayments and Preparation of theSurface to Receive Resilient Flooring3. Terminology3.1 Definitions used in this practice shall be in accordancewith Terminology F141.4. Significance and Use4.1 This practice provides minimum recommendations forpreparing and smoothing panel underlayments, thick
10、 pouredgypsum concrete underlayments, thick poured lightweightcellular concrete underlayments and concrete subfloors withpatching compounds. Actual requirements for materials to beused, mixtures, and other details are generally included as partof the project plans or specification details and may va
11、ry fromthe minimum recommendations set forth in this practice.5. Product Requirements5.1 The patching compound shall be able to be applied fromfeatheredge up to the manufacturers specified thickness overlarge areas.5.2 The patching compound may require the addition of anadditive other than water.1Th
12、is practice is under the jurisdiction of ASTM Committee F06 on ResilientFloor Coverings and is the direct responsibility of Subcommittee F06.40 onPractices.Current edition approved June 1, 2010. Published August 2010. DOI: 10.1520/F267810.2For referenced ASTM standards, visit the ASTM website, www.a
13、stm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.5.3 The
14、 patching compound shall be able to be covered byresilient floorings as soon as the patching hardens and driessufficiently.5.4 The dried patching compound shall be moisture-free,mildew-resistant and alkali-resistant.5.5 For commercial installations, the patching compoundshall develop a minimum of 30
15、00 psi compressive strengthafter 28 days when tested in accordance with Test MethodC109/C109M (air-cured only) or with Test Methods C472.6. Material Acceptance6.1 All patching compounds shall be delivered in theiroriginal, factory packaging.7. Material Storage, Conditioning and Protection7.1 All pat
16、ching compounds shall be kept dry in a tempera-ture controlled environment on site and protected from theweather at least 48 h prior to use. The temperature shall not bebelow 65F (18C) or above 100F (38C). Refer to thepatching compound manufacturers recommendation for morespecific instruction.7.2 Al
17、l patching compounds shall be kept off the ground andaway from damp and cold surfaces.7.3 Protect the applied patching compound from excessiveheat and drafty conditions while curing.7.4 Protect the applied patching compound and the entiresubfloor from traffic, dirt or dust or other contaminates such
18、 assweeping compounds until final installation of the resilientfloor covering.8. General Guidelines8.1 General Specifications:8.1.1 The patching compound shall not be applied to asubfloor containing frost. The subfloor surface temperatureshall not be below 50F (10C) or above 95F (35C). Thetemperatur
19、e conditions for installing resilient flooring productsand the patching compound is typically 65 to 85F (18 to 30C)for 48 h before, during and after the installation. The completeinstallation shall remain within the range of 55 to 95F (13 to35C) thereafter.8.1.2 All subfloors shall be clean and free
20、 of dust, oil,grease, paint, tar, wax, curing compounds, sealers, from releaseagents, primers, free alkali, loosely bonded toppings, looseparticles, old adhesive residues and any other substance thatmay prevent or reduce adhesion of the patching compound.8.1.3 Any substance that may reduce or preven
21、t the adhe-sion from the subfloor shall be completely removed bymechanical means only. Refer to supplementary requirementsection.8.1.4 Structural lightweight concretes having a minimumdensity of 115 lb/ft3(1842 kg/m3) and a minimum compressivestrength of 3000 psi can be suitable substrates to receiv
22、epatching compounds.8.1.5 The temperature of a heated subfloor must not exceed85F (30C).8.1.6 All moving joints such as expansion joints, isolationjoints and any cracks exhibiting movement shall not be filledwith patching compound or covered with resilient flooring.Consult the resilient flooring man
23、ufacturer regarding the use ofan expansion joint covering system.8.2 Panel Underlayment:8.2.1 All panel underlayment used shall be recommendedby either the panel underlayment manufacturer or the resilientflooring manufacturer.8.2.2 All panel underlayment shall be installed in accor-dance with the St
24、andard Practice F1482.8.2.3 All wood structural panel floor assemblies shall bedouble-layered. The subfloor panel shall be58 in. (16 mm)thick minimum wood structural panels (usually Exterior GradePlywood) over joist 16 in. (41 cm), typically on center. Joistcenter spacing shall comply with local bui
25、lding codes. Thesecond layer shall be a minimum14 in. (6.4 mm) thick, andsufficiently smooth to receive resilient flooring (thicker boardsmay be required for commercial applications). The adjacentedges of the underlayment panels shall not be more than132 in.(1.6 mm) above or below each other. End jo
26、ints of panelunderlayment shall be offset from subfloor panel joints by atleast one joist spacing. Panel underlayment edge joints shall beoffset from subfloor panel edge joints by at least 2 in.8.3 Concrete Subfloors:8.3.1 All concrete subfloors shall meet the requirementsoutlined in Practice F710.8
27、.3.2 All concrete subfloors shall have a minimum densityof 115 lb/ft3(1842 kg/m3).8.3.3 Due to the varying porosity of concrete subfloors, werecommend that a bond test be performed to ensure adequatebond. If an adequate bond is not achieved, abrasively preparethe concrete subfloor surface according
28、to the patching com-pound manufacturers recommendation. Methods such asgrinding or shot blasting are appropriate.8.3.4 Porous concrete substrate may require being primed.Refer to the patching compound manufacturers recommenda-tion.8.4 Gypsum Concrete Subfloors:8.4.1 All gypsum concrete subfloors sha
29、ll meet the require-ments outlined in Practice F2419.8.4.2 All gypsum concrete subfloors shall have a minimumdensity of 105 lb/ft3(1460 kg/m3).8.4.3 Porous gypsum concrete substrates may require beingprimed. Refer to the patching compound manufacturers rec-ommendation.8.4.4 Due to the varying porosi
30、ty of gypsum concretesubfloors, we recommend that a bond test be performed toensure adequate bond. If an adequate bond is not achieved,refer to the patching compound manufacturers recommenda-tion.8.5 Poured Lightweight Cellular Concrete Subfloors:8.5.1 All poured lightweight cellular concrete subflo
31、orsshall meet the requirements outlined in Practice F2471.8.5.2 All poured lightweight cellular concrete subfloorsshall have a minimum density of 110 lb/ft3(1762 kg/m3).8.5.3 Porous poured lightweight cellular concrete substratemay require being primed. Refer to the patching compoundmanufacturers re
32、commendation.F2678 1028.5.4 Due to the varying porosity of poured lightweightcellular concrete subfloors, we recommend that a bond test beperformed to ensure adequate bond. If an adequate bond is notachieved, refer to the patching compound manufacturersrecommendation.9. Installation of Patching Comp
33、ounds9.1 Materials:9.1.1 Trowelable patching compound.9.1.2 Water shall be potable and cool. Water temperatureshall not exceed 73F (23C).9.1.3 Clean mixing container.9.1.4 Mechanical mixer and mixing paddle recommendedby the patching compound manufacturer.9.2 Mixing and Application:9.2.1 In a clean
34、container, pour the required amount of wateror liquid additive, and then gradually add the required amountof the patching compound while slowly mixing with themechanical mixer. Mix thoroughly until a smooth and lump-free consistency is obtained.9.2.2 Apply the patching compound mix to the subfloorus
35、ing a flat-edge steel trowel to fill surface cracks, grooves,depressions and other irregularities in order to meet the floorcovering manufacturer recommendations.9.2.3 Protrusions should be ground off, driven flush, sandedsmooth or driven below the surface, then patched and sanded inorder to meet th
36、e floor covering manufacturer recommenda-tions.10. Field Quality Control10.1 To determine representative compressive strengths,specimens of the patching compounds shall be taken at the jobsite from an unopened package. The compressive strength testsshall be done in accordance with Test Method C109/C
37、109M,(air-cured only) or with Test Methods C472.11. Protection11.1 Protect the subfloor from traffic, dirt or dust from othertrades until final installation of resilient floor covering.11.2 The surface of the subfloor shall be cleaned of all loosematerial by scraping, brushing, vacuuming, other meth
38、ods, ora combination thereof, recommended by the resilient flooringmanufacturer, immediately before commencing installation ofresilient flooring.12. Keywords12.1 concrete subfloors; gypsum concrete subfloors; panelunderlayment; patching compounds; poured lightweight cellu-lar concrete subfloorsSUPPL
39、EMENTARY REQUIREMENTSS1. RECOMMENDED WORK PRACTICES FOR REMOVAL OF RESILIENT FLOORCOVERINGSThe following supplementary requirements shall apply only when specified by the purchaser in thepurchase order or contract.S1.1 Asbestos WarningDo not sand, dry sweep, dryscrape, drill, saw, beadblast, or mech
40、anically chip or pulverizeexisting resilient flooring, backing, lining felt, paint, asphaltic“cutback” adhesives, or other adhesives. These products maycontain asbestos fibers or crystalline silica.Avoid creating dust.Inhalation of such dust is a cancer and respiratory tract hazard.Smoking by indivi
41、duals exposed to asbestos fibers greatlyincreases the risk of serious bodily harm. Unless positivelycertain that the product is a non-asbestos-containing material,you must presume it contains asbestos. Regulations mayrequire that the material be tested to determine asbestoscontent. The Resilient Flo
42、or Covering Institute (RFCI) docu-ment, “Recommended Work Practices for Removal of ResilientFloor Coverings,” should be consulted for a defined set ofinstructions addressed to the task of removing all resilient floorcovering structures.S1.2 Lead Paint CautionCertain paints may contain lead.Exposure
43、to excessive amounts of lead dust presents a healthhazard. Refer to applicable federal, state, and local laws and,“Lead-Based Paint: Interim Guidelines for Hazard Identifica-tion andAbatement in Public and Indian Housing,” (September1990) or subsequent editions published by the U.S. Departmentof Hou
44、sing and Urban Development regarding: (1)Appropriatemethods for identifying lead-based paint and removing suchpaint; and (2) any licensing, certification, and training require-ments for persons performing lead abatement work.S1.3 Adhesive Remover CautionThere are a number ofcommercial adhesive remov
45、ers on the market that will properlyremove adhesive residue from a subfloor, however, there areconcerns that these products can adversely affect the bondingof the new floor covering. The Resilient Floor CoveringInstitute (RFCI) document, “Recommended Work Practices forRemoval of Resilient Floor Cove
46、rings,” and the resilientflooring manufacturers written instructions should be con-sulted for a defined set of instructions which should befollowed if existing adhesives must be removed (see S1.1).S1.4 Residual Asphalt Adhesive(Also see S1.1 and S1.3.)Many resilient floorings may not be installed wh
47、en residualasphalt adhesive residue is present. Consult the ResilientFlooring Manufacturers written recommendations concerninguse of resilient flooring products in these situations.F2678 103ASTM International takes no position respecting the validity of any patent rights asserted in connection with
48、any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technic
49、al committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is c
