1、BRITISH STANDARD BS EN 61747-2:1999 IEC61747-2: 1998 Liquid crystal and solid-state display devices Part 2: Liquid crystal display modules Sectional specification The European Standard EN61747-2:1999 has the status of a British Standard ICS 31.120BSEN61747-2:1999 This British Standard, having been p
2、repared under the directionof the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comesinto effect on 15April1999 BSI 02-2000 ISBN 0 580 32156 8 National foreword This British Standard is the English language version of EN61747-2:1999. It is identi
3、cal with IEC61747-2:1998. The UK participation in its preparation was entrusted by Technical CommitteeEPL/47, Semiconductors, to SubcommitteeEPL/47/3, Performance of opto-electronic semiconductor devices and liquid crystal displays, which has the responsibility to: aid enquirers to understand the te
4、xt; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this subcomm
5、ittee can be obtained on request to its secretary. From1January 1997, all IEC publications have the number60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publications may conta
6、in identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The British Standards which implement these intern
7、ational or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisio
8、ns of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theEN title page, p
9、ages 2 to 10 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSEN61747-2:1999 BSI 02-2000 i Contents Page
10、 National foreword Inside front cover Foreword 2 Text of EN 61747-2 3ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61747-2 January 1999 ICS 31.120 English version Liquid crystal and solid-state display devices Part 2: Liquid crystal display modules Sectional specification (IEC 61747-2
11、:1998) Dispositifs daffichage cristaux liquides et semiconducteurs Partie 2: Modules daffichage cristaux liquides Spcification intermdiaire (CEI 61747-2:1998) Flssigkristall- und Halbleiter-Anzeige- Bauelemente Teil 2: Flssigkristall-Anzeigemodule (LCD-Module) Rahmenspezifikation (IEC 61747-2:1998)
12、This European Standard was approved by CENELEC on1999-01-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical r
13、eferences concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENEL
14、EC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, CzechRepublic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Nethe
15、rlands, Norway, Portugal, Spain, Sweden, Switzerland and UnitedKingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1999 CENEL
16、ECAll rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61747-2:1999 EEN61747-2:1999 BSI 02-2000 2 Foreword The text of document47C/215/FDIS, future edition1 of IEC61747-2, prepared by SC47C, Optoelectronic, display and imaging devices, of IECTC4
17、7, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN61747-2 on1999-01-01. The following dates were fixed: This part2 is to be used in conjunction with IEC61747-1 1) . Annexes designated “normative” are part of the body of the standard. In this st
18、andard,Annex ZA is normative. Annex ZA has been added by CENELEC. Endorsement notice The text of the International Standard IEC61747-2:1998 was approved by CENELEC as a European Standard without any modification. Contents Page Foreword 2 1 Scope 3 2 Normative reference 3 3 Definitions 3 4 Quality as
19、sessment procedure 3 4.1 Primary stage of manufacture 3 4.2 Manufacturing process 4 4.3 Subcontracting 4 4.4 Structural similarity procedures 4 4.5 Qualification approval procedure 5 4.6 Quality conformance inspection 5 4.7 Capability approval procedure 5 4.8 Screening 5 4.9 Delayed deliveries 5 5 T
20、est and measurement procedures 6 Annex ZA (normative) Normative references to international publications with their corresponding European publications 10 Table 1 Test-dependent criteria for structural similarity 6 Table 2 Inspection requirements for qualification approval test 7 Table 3 Groups and
21、categories of assessed quality 8 Table 4 Group ALot-by-lot inspections 8 Table 5 Group BLot-by-lot inspections 8 Table 6 Group CPeriodic inspections 8 Table 7 Sampling requirements for group A tests 9 Table 8 Sampling requirements for group B and C tests 9 Table 9 Screening test item and conditions
22、9 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1999-10-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2001-10-01 1) Under vote as prEN 61747-1.EN61747-2:
23、1999 BSI 02-2000 3 1 Scope This sectional specification applies to liquid crystal and solid-state display modules such as the following: static/segment type liquid crystal display modules; passive matrix monochrome liquid crystal display modules; passive matrix colour liquid crystal display modules;
24、 active matrix monochrome liquid crystal display modules; active matrix colour liquid crystal display modules. It gives details of the Quality Assessment Procedures, the inspection requirements, screening sequences, sampling requirements, and test and measurement procedures required for the assessme
25、nt of liquid crystal display modules. NOTE 1Instead of the Qualification Approval Procedure, the Capability Approval Procedure (see Rules of Procedure QC001002, subclause11.7), which is at present under consideration, may be used for all products manufactured in a defined process. NOTE 2All the requ
26、irements of this specification remain valid, unless modified by the requirements set out by the new clause: Capability Approval Procedure (under consideration). 2 Normative reference The following normative document contains provisions which, through reference in this text, constitute provisions of
27、this part of IEC61747. At the time of publication, the edition indicated was valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC61747 are encouraged to investigate the possibility of applying the most recent edition of the normative document in
28、dicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 61747-1:1998, Liquid crystal and solid-state display devicesPart 1: Generic specification. 3 Definitions 3.1 production line a single set of process operations including one or several of the fol
29、lowing manufacturing phases: a) connection of external electronic circuit devices to cell; b) finishing and final electrical and optical measurements; c) screening (if applicable). NOTEQuality assessment procedures are not included in these phases. 3.2 production lot devices of the same type, manufa
30、ctured in the same production lines and passing through the same nominated process, normally within one month 3.3 changes in manufacturing operations 3.3.1 major changes any change in the manufacturing process or technology which could affect the quality or performance of a product supplied to an ap
31、proved specification, or which could require a product to be transferred from one structural similarity group to another (see4.4.1) represents a change considered as major. It is the responsibility of the Chief Inspector to decide whether the change is major or not any major change shall only be imp
32、lemented with notification and demonstration by test evidence of quality to the National Supervising Inspectorate (NSI) Examples of major changes are: a) driver attachment: from two bank to one bank arrangement; b) integrated backlight system: lamp position from horizontal to vertical or from top to
33、 bottom arrangement; backlight-type change from electroluminescent to cold cathode fluorescent lamp; light guide change from wedge to flat type; c) bezel material: from metal to plastic; d) connector change and/or pin assignment change: from typeA to typeB connector. NOTENot considered as a major ch
34、ange: equipment change without changing the technology. 4 Quality assessment procedure Quality assessment procedure is defined as outlined below. 4.1 Primary stage of manufacture For the purpose of this sectional specification, this stage is defined as the first process step that connects external e
35、lectronic circuit devices (including separate PWB and/or connection cables) to a liquid crystal display cell, thus converting it to a liquid crystal module.EN61747-2:1999 4 BSI 02-2000 4.2 Manufacturing process The manufacturing process of liquid crystal display modules is classified as follows: a)
36、connection of electronic circuit devices (including separate PWB and/or connection cables): this process is the set of manufacturing process operations from the primary stage to the last step for electronic circuit device connections to the cell; b) finishing process and final electrical and optical
37、 measurements: this process is the final set of manufacturing process operations comprising the assembly of a bezel, external connectors/pins and integrated backlight system to the cell if required, and marking for the completion as a liquid crystal display module; c) screening (if applicable): this
38、 phase may be part of the finishing operation(s). 4.3 Subcontracting When the approved manufacturer invokes rules of procedure, in11.1.2 of IECQC001002 concerning subcontracting, he shall ensure that the subcontracted manufacturing process is either part of or a whole of the cell and/or module manuf
39、acturing process unconditionally, including screening steps which are incorporated in them. Screening operations applied after assembly process may also be independently subcontracted. The NSI shall be satisfied that the Chief Inspector who is certifying the components under the IECQ system has been
40、 provided with the full quality assessment and inspection documentation of any operation outside the IECQ geographical area. The documentation shall include the inspection records for each sample of the product which undergoes inspection; regularly verifies that the quality assessment and inspection
41、 is applied in accordance with the agreed requirements. The Chief Inspector shall be provided and shall agree with the procedures for the transfer of the parts from the place of manufacture to the manufacturer within the IECQ geographical area who is certifying the component. The NSI shall be inform
42、ed and have access to the applicable documents. Any changes in inspection requirements and manufacturing procedures shall be reported back to the Chief Inspector who is certifying the modules. The major changes shall be reported by the approved Chief Inspector to the NSI (see3.3). The approved manuf
43、acturer shall perform the acceptance tests prescribed by the detail specification for the components he is certifying. He can perform the acceptance tests in a facility outside the IECQ geographical area, provided that this facility is supervised by the NSI. Acceptance tests can be subcontracted to
44、approved test laboratories within the IECQ geographical area. 4.4 Structural similarity procedures Structural similarity procedures are intended to permit a reduction in the number of inspection lots for quality assessment that shall be tested. Therefore, in case of reassessment by the extension of
45、approval types or the change of the design, the testing data which was performed within the same grouping products may be used. 4.4.1 Structurally similar modules Structurally similar modules are produced by one manufacturer, to the same design, with the same material, manufacturing process and meth
46、ods. The crucial criterion for the grouping of types of modules as structurally similar is that the differences between the various types have no influence on the results of the test for which the group has been formed. 4.4.2 Test-dependent criteria for structural similarity The test-dependent crite
47、ria for structural similarity applicable to groupB, lot-by-lot inspections, and groupC, periodic tests, are given inTable 1. Itemsa) toi) specify the interpretation of these criteria for structural similarity. a) Cell The material and basic design for the cell,e.g.passive matrix, active matrix, etc.
48、, shall be the same. The display area differences shall be within 50%. And the pixel number differences shall be within 50%. b) Electronic circuit devices including separate PWB The material and basic design,e.g.static driving, multiplex driving, direct addressing, matrix addressing, etc., shall be
49、the same. c) Backlight system The material and basic design for the integrated backlight system shall be the same. d) Bezel structure The material and basic design for the bezel shall be the same. e) External connection The material and the basic design for the external connection from the module shall be the same.EN61747-2:1999 BSI 02-2000 5 f) Process (common) The basic process and process material shall be the same. g) Production lines (common) The modules shall be made along the same lines. h) Markin
