1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update to the latest DLA Land and Maritime drawing format. 21 Mar 13 Michael A. Radecki Prepared in accordance with ASME Y14.100 REV PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Fred W. Lester DESIGN ACTIV
2、ITY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing January 5, 2006 CHECKED BY Fred W. Lester TITLE OSCILLATOR, CRYSTAL CONTROLLED, 5 VOLT, ENABLE/TRI-STATE, 312KHZ TO 120 MHZ, TTL AND CMOS COMPATIBLE, SURFACE MOUNT APPROVED BY Michael A. Radecki SIZE A CODE IDENT. NO. 037Z3 DW
3、G NO. 05014 REV A PAGE 1 OF 8 AMSC N/A 5955-2013-E01 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBU
4、S, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05014 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements of a enable/tri-state, miniature, surface mount crystal controlled oscillator with a frequency range of 312 kilohertz (kHZ) to 120 megahertz (MHz), TTL and CMOS compatible, rate
5、d at 5 volts, meeting the requirements of MIL-PRF-55310 product level B, type 1, class 2 supplied to the requirements of this drawing specified herein. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as follows: 05014 * * * | | | | | | | | Drawing E = enable GP = gold Nominal number
6、T = tri-state plated frequency N = neither GS = gold (see 1.2.2) (see 1.2.1) plated, solder Dipped (see 6.3) 1.2.1 Enable/Tristate. This device has optional output enable or tri-state (see table I and II). Table I. Enable/Tristate. PIN 1 1/ PIN 3 E Low High Z High Frequency Output T Low High Z High
7、Frequency Output N NC Frequency Output 1/ Normally high (internal pull-up resistor). Table II. Enable (E) vs. Tri-state (T). Enable: When pin 1 is low, the oscillator stops oscillating; however, the output (pin 3) is in a high impedance (Z) state. Tri-state: When pin 1 is low, the internal oscillato
8、r continues to run; however, the output (pin 3) is in a high impedance (Z) state. E T Current consumption When pin 1 is low Low High Output recovery delay When pin 1 changes from low to high Delayed Immediate Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
9、HS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05014 REV A PAGE 3 1.2.2 Nominal frequency. The nominal frequency expressed in hertz is identified by a field of eight characters consisting of digits and a letter (M or K) representing, simultaneously, the dec
10、imal point and the kilohertz or megahertz multiplier. All digits preceding and following the letter (M or K) of the group represent significant figures. The following are examples of using the eight characters in constructing the frequency. Compressed Used for frequencies notation In the noted range
11、 DDDKDDDD 312.0000 to 999.9999 kilohertz DMDDDDDD 1.000000 to 9.999999 megahertz DDMDDDDD 10.00000 to 99.99999 megahertz DDDMDDDD 100.0000 to 120.0000 megahertz Where D signifies a single digit from 0 to 9. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in se
12、ctions 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must
13、meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specifie
14、d herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55310 - Oscillator, Crystal Controlled, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electron
15、ic and Electrical Component Parts. MIL-STD-790 - Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic parts. MIL-STD-1686 - Electrostatic Discharge Cont
16、rol Program for the Protection of Electrical and Electronic Parts, Assemblies, and Equipment (Excluding Electrically Initiated Explosive Devices). (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or https:/assist.dla.mil or from DLA Document Services, Building 4/
17、D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.5). AMERICAN S
18、OCIETY FOR TESTING AND MATERIALS (ASTM) ASTM B454 - Tin, Electrodeposited Coatings of (Copies of this document are available online at http:/www.astm.org/ or from the American Society for Testing and Materials (ASTM) International, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959.) Provided b
19、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05014 REV A PAGE 4 2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited
20、 herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Interface and physical dimensions. The individual item requirements shall be as specified herein and t
21、able III. 3.2 Electrical characteristics and other requirements. Electrical characteristics and other requirements shall be as specified in table III. NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerances are .005
22、(0.13 mm) for three place decimals and . .02 (0.5 mm) for two place decimals. 4. Lead numbers are for reference only and are not marked on unit. FIGURE 1. Design and dimensions. Typical Maximum Dimensions Inches mm Inches mm A 0.256 6.50 0.263 6.68 B 0.197 5.00 0.204 5.18 C 0.051 1.30 0.055 1.40 D 0
23、.055 1.40 N/A N/A E 0.060 1.52 0.070 1.78 Pin No. Function 1 Output Enable (E), Tri-state (T), or NC (N) 2 Ground 3 Output 4 VDD Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z
24、3 DWG NO. 05014 REV A PAGE 5 TABLE III. Requirements Requirements Specified value or condition. Dimensions and configurations See figure 1. Supply voltage 5 volts 10 percent Minimum output voltage high level The minimum output voltage high level, VOH, shall not be less than 0.9 VDD. Maximum output v
25、oltage low level The maximum output voltage low level, VOL, shall not be more than 0.1 VDD. Calibration tolerance 100 parts per million (ppm) Frequency stability over temperature 100 ppm Frequency-voltage tolerance Initial frequency-voltage tolerance over the operating voltage range shall be 4 ppm m
26、aximum at acquisition. Measurements shall be taken at -55 C, +23 C to +125 C. Supply current 5 volts 14 mA for 50 MHz 12 mA for 40 MHz 10 mA for 30 MHz 8 mA for 24 MHz CMOS load 15 Pico farads (pF) Start-up time 5 milliseconds (ms) maximum Rise/Fall time 3 nanoseconds (ns) typical, 6 ns maximum. Dut
27、y cycle 40 percent minimum, 60 percent maximum. Aging, first year 10 ppm maximum. 1.5 ppm per 30 days and 3 ppm per 90 days. Shock, survival 3,000 g peak 0.3 ms, sine Vibration, survival 20 g RMS 10-2000 Hz random Seal Hermetic, in accordance with MIL-PRF-55310. Maximum leakage rate shall be 5 x 10-
28、8atm-cc/s. AC Characteristics The output shall be connected to a load of 15 picofarads to ground. DC Characteristics Negative current values indicate current flowing out of the device. Operating temperature range -55C to +125C Storage temperature range -55C to +125C 3.3 Marking. Marking of the minia
29、ture crystal oscillator unit is not required; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. 3.4 Pure tin. The use of pure tin, a
30、s an underplate or final finish, is prohibited both internally and externally. Tin content of crystal oscillator components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.5 Recycled, recovered, or environmentally preferabl
31、e materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compliance. A
32、 certificate of compliance shall be required from manufacturers requesting to be an approved source of supply (see 4.7 and 6.7). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z
33、3 DWG NO. 05014 REV A PAGE 6 3.7 Workmanship. The miniature crystal oscillator units shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 QPL system. The QPL system specified in MIL-PRF-55310 and maintained in accordance with
34、 MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Screening. Miniature crystal oscillator units to be delivered shall have been subjected to and passed all the screening tests in accordance with paragraph 4
35、.4 of MIL-PRF-55310, product level B, class 2, type 1. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consists of group A and B inspections of MIL-PRF-55310 for product level B, class 2, type 1 crystal oscillators. 4.4.1.1 Group A inspe
36、ction. Group A inspection shall be in accordance with paragraph 4.7.1.4 of MIL-PRF-55310. 4.4.1.2 Group B inspection. Group B inspection shall be in accordance with paragraph 4.7.1.5 of MIL-PRF-55310. 4.4.2 Certification. The acquiring activity, at its discretion, may accept a certificate of complia
37、nce with group B requirements in lieu of performing group B tests (see 6.5d). 4.5 Responsibility for inspection. Unless otherwise specified in the contract or purchase order, the contractor is responsible for the performance of all inspection, examination, and test requirements specified herein. Exc
38、ept as otherwise specified in the contract or purchase order, the contractor may use his own or any other facilities suitable for the inspection requirements specified herein, unless disapproved by the Government. The Government reserves the right to perform any of the inspections, examinations, or
39、tests set forth in this description where such inspections, examinations, and tests are deemed necessary to assure supplies and services conform to prescribed requirements. 4.6 Contractor certification statement. The contractor shall certify and maintain objective quality evidence that the product o
40、ffered meets the requirements of this drawing, and that the product conforms to the producers own drawings, specifications, standards, quality assurances practices, and is the same as the product provided as a bid sample. The Government reserves the right to require proof of such conformance prior t
41、o the first delivery and thereafter as may be otherwise provided for under the provisions of the contract. 4.7 Certificate of compliance. A certificate of compliance shall accompany all miniature crystal oscillator units supplied to this drawing. 5. PACKAGING 5.1 Packaging. For acquisition purposes,
42、 the packaging requirements shall be as specified in the contract or order (see 6.5). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements
43、are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM produc
44、ts, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER
45、, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05014 REV A PAGE 7 6.1 Intended use. Crystal oscillators conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available fo
46、r OEM application. This drawing is intended exclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When a military specification exists and the product covered by this drawing has been qualified for listing, this drawing will become in
47、active for new design. The qualified product will be the preferred item for all applications. 6.2 ESD Sensitive Units. ESD sensitive devices shall be packaged in accordance with MIL-STD-1686 in a manner that shields the items from extraneous radiation and/or static electricity, or discharge. All pac
48、kaging shall be marked ESD sensitive as specified in MIL-STD-1686. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of ti
