1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Changes IAW NOR 5962-R021-93. - wlm 92-11-20 Monica L. Poelking D Update boilerplate to MIL-PRF-38535 requirements. - CFS 01-10-19 Thomas M. Hess E Made change to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requirements. LTG 05-03-18 Thoma
2、s M. Hess F Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 11-08-25 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Sandra B. Rooney DLA LAND AND MARITIME COLUMBUS, O
3、HIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 10-TO-4 LINE PRIORITY ENCODE
4、R, MONOLITHIC SILICON DRAWING APPROVAL DATE 84-11-27 REVISION LEVEL F SIZE A CAGE CODE 14933 84064 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E456-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AN
5、D MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The co
6、mplete PIN is as shown in the following example: 84064 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC147 10-to-4 line pr
7、iority encoder 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-lineF GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Le
8、ad finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current. 2
9、0 mA DC output current (per pin) 25 mA DC VCCor GND current (per pin) . 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (
10、TJ) +175C 5/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) . -55C to +125C Input rise or fall time: VCC= 2.0 V . 0 to 1000 ns VCC= 4.5 V . 0 to 500 ns VCC= 6.0 V . 0 to 400 ns _ 1/ Stresses above the absolute maxim
11、um rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full specified VCC
12、range and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. 5/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for Resal
13、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The followin
14、g specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Gen
15、eral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit
16、Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document
17、 to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copi
18、es of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
19、of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN cla
20、ss level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance w
21、ith the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
22、 These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall b
23、e as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. Provi
24、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.2.4 Logic diagram. The logic diagram shall be as specified on figur
25、e 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the
26、full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The par
27、t shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix
28、 A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approv
29、ed source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7
30、 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects
31、 this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the review
32、er. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol
33、 Test conditions -55C TC+125C unless otherwise specified 1/ Group A subgroups Limits Unit Min Max High level output voltage VOH2/ VIN= VIHor VILIOH= -20 A VCC= 2.0 V 1, 2, 3 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHor VILIOH= -4.0 mA VCC= 4.5 V 3.7 VIN= VIHor VILIOH= -5.2 mA VCC= 6.0 V 5.2 Low le
34、vel output voltage VOL2/ VIN= VIHor VILIOL= +20 A VCC= 2.0 V 1, 2, 3 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1 VIN= VIHor VILIOL= +4.0 mA VCC= 4.5 V 0.4 VIN= VIHor VILIOL= +5.2 mA VCC= 6.0 V 0.4 High level input voltage VIH2/ VCC= 2.0 V 1, 2, 3 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low level input voltage
35、VIL2/ VCC= 2.0 V 1, 2, 3 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Input capacitance CINVIN= 0.0 V, TC= +25C See 4.3.1c 4 10 pF Quiescent supply current ICCVCC= 6.0 V VIN= VCCor GND 1, 2, 3 160 A Input leakage current IINVCC= 6.0 V VIN= VCCor GND 1, 2, 3 1.0 A Functional tests See 4.3.1d 7 Propagation del
36、ay time, input to output, high-to-low, low-to-high tPHL, tPLH2/ TC= +25C CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 220 ns VCC= 4.5 V 44 VCC= 6.0 V 37 TC= -55C and +125C CL= 50 pF 10% See figure 4 VCC= 2.0 V 10, 11 330 ns VCC= 4.5 V 66 VCC= 6.0 V 56 Transition time high-to-low, low-to-high tTHL, tTLH3/
37、 TC= +25C CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 75 ns VCC= 4.5 V 15 VCC= 6.0 V 13 TC= -55C and +125C CL= 50 pF 10% See figure 4 VCC= 2.0 V 10, 11 110 ns VCC= 4.5 V 22 VCC= 6.0 V 19 See footnotes on next sheet. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
38、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ For a power supply of 5 V 10% the worst case output voltages (VOHand VOL) occur for HC a
39、t 4.5 V. Thus, the 4.5 V values should be used when designing with this supply. Worst case VIHand VILoccur at VCC= 5.5 V and 4.5 V respectively. (The VIHvalue at 5.5 V is 3.85 V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage, and so the 6.0 V values should
40、be used. Power dissipation capacitance (CPD), typically 180 pF, determines the no load dynamic power consumption, PD= CPDVCC2f + ICCVCC, and the no load dynamic current consumption, IS= CPDVCCf + ICC. 2/ For VCC= 2.0 V and 6.0 V, this parameter shall be guaranteed, if not tested, to the limits speci
41、fied in table I. 3/ Transition time (tTHL, tTLH), if not tested, shall be guaranteed to the specified parameters. Device type 01 Case outlines E and F 2 Terminal number Terminal symbol 1 4 NC2 5 4 3 6 5 4 7 6 5 8 7 6 C NC 7 B 8 8 GND C 9 A B 10 9 GND 11 1 NC 12 2 A 13 3 9 14 D 1 15 NC 2 16 VCCNC 17
42、3 18 D 19 NC 20 VCCNC = No internal connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FO
43、RM 2234 APR 97 Inputs Outputs 1 2 3 4 5 6 7 8 9 D C B A H H H H H H H H H H H H H X X X X X X X X L L H H L X X X X X X X L H L H H H X X X X X X L H H H L L L X X X X X L H H H H L L H X X X X L H H H H H L H L X X X L H H H H H H L H H X X L H H H H H H H H L L X L H H H H H H H H H L H L H H H H
44、H H H H H H H L H = High voltage level L = Low voltage level X = Irrelevant FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AND MARITIME COLUMBUS, OHI
45、O 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. CL= 50 pF minimum or equivalent (includes test jig and probe capacitance). 2. Input signal from pulse generator: VIN= 0.0 V to VCC; PRR 1MHz; ZO= 50; tr = 6.0 ns; tf= 6.0 ns; trand tfshall be measured from 0.1 VCCto 0.9 VCC and fr
46、om 0.9 VCC to 0.1 VCC, respectively; duty cycle = 50 percent. 3. Timing parameters shall be tested at a minimum input frequency of 1 MHz. 4. The outputs are measured one at a time with one transition per measurement. FIGURE 4. Switching waveforms and test circuit. Provided by IHSNot for ResaleNo rep
47、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84064 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accorda
48、nce with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specif
