1、EIASTANDARDFixed Capacitors for Use in Electronic Equipment - Part 1: Generic SpecificationEIA-60384-1 (IEC 60384-1:2016, IDT) October 2017 Electronic Components Industry Association ANSI/EIA-60384-1-2017 Approved: October 5, 2017EIA-60384-1NOTICEEIA Engineering Standards and Publications are design
2、ed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of
3、such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA
4、 members, whether the standard is to be used either domestically or internationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it a
5、ssume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is identical (IDT) with the International Standard IEC Publication 60384-1:2016 Edition 5: Fixed Capacitors for use in Electronic Equipment Part 1: Generic Specification. This document is the EIA Standar
6、d EIA-60384-1-2017: Fixed Capacitors for use in Electronic Equipment Part 1: Generic Specification.The text, figures and tables of IEC 60384-1:2016 are used in this Standard with the consent of the IEC and the American National Standards Institute (ANSI). The IEC copyrighted material has been reprod
7、uced with permission from ANSI. The IEC Foreword and Introduction are not part of the requirements of this standard but are included for information purposes only. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is t
8、he responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5390.01, formulated under the cognizance of the Steering Committee for Passive Electronic Comp
9、onents Standards (S-1).Published by Electronic Components Industry Association 2017 Engineering Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE ! DONT VIOLATE THE LAW!This document is copyrighted by the ECIA and may not be reproduced without permission. Organizations may obtain pe
10、rmission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS Markit 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5186), International (303-397-7956) i CONTENTS FOREWORD viiiINTRODUCTION . x1 General . 11
11、.1 Scope . 11.2 Normative references 12 Technical data . 32.1 Symbols, units and abbreviated terms . 32.1.1 General . 32.1.2 Letter symbols . 32.1.3 Abbreviations . 42.2 Terms and definitions 42.3 Preferred values and additional technical requirements 92.3.1 General . 92.3.2 Preferred values of nomi
12、nal capacitance . 92.3.3 Preferred values of rated voltage . 92.3.4 Rated a.c. load 92.3.5 Rated pulse load 102.3.6 Temperature derated voltage . 102.4 Marking . 112.4.1 General . 112.4.2 Coding . 113 Quality assessment procedures . 114 Tests and measurement procedures 124.1 General . 134.2 Standard
13、 atmospheric conditions 134.2.1 Standard atmospheric conditions for testing 134.2.2 Recovery conditions 134.2.3 Referee conditions . 144.2.4 Reference conditions . 144.3 Drying . 144.4 Visual examination and check of dimensions 144.4.1 Visual examination 144.4.2 Dimensions (gauging) 144.4.3 Dimensio
14、ns (detail) 154.5 Insulation resistance . 154.5.1 Preconditioning 154.5.2 Measuring conditions . 154.5.3 Test points . 154.5.4 Test methods . 164.5.5 Temperature compensation . 164.5.6 Conditions to be prescribed in the relevant specification 164.6 Voltage proof 184.6.1 General . 184.6.2 Test circui
15、t (for the test between terminations) 194.6.3 Test . 194.6.4 Requirements 21ii 4.6.5 Conditions to be prescribed in the relevant specification 214.7 Capacitance 214.7.1 Measuring frequency and measuring voltage . 214.7.2 Measuring equipment 224.7.3 Conditions to be prescribed in the relevant specifi
16、cation 224.8 Tangent of loss angle and equivalent series resistance (ESR) 224.8.1 Tangent of loss angle 224.8.2 Equivalent series resistance (ESR) 234.9 Leakage current 234.9.1 Preconditioning 234.9.2 Test method 234.9.3 Power source 234.9.4 Measuring accuracy . 234.9.5 Test circuit . 234.9.6 Condit
17、ions to be prescribed in the relevant specification 234.10 Impedance 244.11 Self-resonant frequency and inductance . 254.11.1 Self-resonant frequency (fr) . 254.11.2 Inductance . 284.11.3 Conditions to be prescribed in the relevant specification 284.12 Outer foil termination 284.13 Robustness of ter
18、minations . 294.13.1 General . 294.13.2 Test Ua1 Tensile 294.13.3 Test Ub Bending (half of the sample) 304.13.4 Test Uc Torsion (remaining sample) . 304.13.5 Test Ud Torque . 304.13.6 Visual examination 304.14 Resistance to soldering heat . 314.14.1 Preconditioning and initial measurement 314.14.2 T
19、est procedure 314.14.3 Recovery . 314.14.4 Final inspection, measurement and requirements 314.15 Solderability 314.15.1 General . 314.15.2 Preconditioning 314.15.3 Test procedure 324.15.4 Final inspection, measurements and requirements. 324.16 Rapid change of temperature 324.16.1 Initial measurement
20、 . 324.16.2 Test procedure 324.16.3 Final inspection, measurements and requirements. 324.17 Vibration . 334.17.1 Initial measurement . 334.17.2 Test procedure 334.17.3 Electrical test (intermediate measurement) 334.17.4 Final inspection, measurements and requirements. 334.18 Bump (repetitive shock)
21、33iii 4.18.1 Initial measurement . 334.18.2 Test procedure 334.18.3 Final inspection, measurements and requirements. 334.19 Shock . 344.19.1 Initial measurement . 344.19.2 Test procedure 344.19.3 Final inspection, measurements and requirements. 344.20 Container sealing 344.21 Climatic sequence. 344.
22、21.1 General . 344.21.2 Initial measurements . 344.21.3 Dry heat 344.21.4 Damp heat, cyclic, Test Db, first cycle . 344.21.5 Cold. 354.21.6 Low air pressure 354.21.7 Damp heat, cyclic, Test Db, remaining cycles 354.21.8 Final measurements 354.22 Damp heat, steady state . 364.22.1 Initial measurement
23、 . 364.22.2 Test procedure 364.22.3 Final inspection, measurements and requirements. 364.23 Endurance 364.23.1 Initial measurements . 364.23.2 Test procedure 364.23.3 Conditions to be prescribed in the relevant specification 364.23.4 Test voltage . 374.23.5 Placement in the test chamber . 384.23.6 R
24、ecovery . 384.23.7 Final inspection, measurements and requirements. 384.24 Variation of capacitance with temperature . 384.24.1 Static method 384.24.2 Dynamic method 394.24.3 Methods of calculation . 394.25 Storage . 404.25.1 Storage at high temperature 404.25.2 Storage at low temperature 414.26 Sur
25、ge 414.26.1 Initial measurement . 414.26.2 Test procedure 414.26.3 Final inspection, measurements and requirements. 424.26.4 Information to be given in the relevant detail specification . 424.27 Charge and discharge tests and inrush current test . 434.27.1 Initial measurement . 434.27.2 Test procedu
26、re 434.27.3 Charge and discharge 444.27.4 Inrush current 444.27.5 Final inspection, measurements and requirements. 454.28 Pressure relief (for aluminium electrolytic capacitors) . 454.28.1 General . 45iv 4.28.2 AC test 454.28.3 DC test 454.28.4 Pneumatic test . 454.28.5 Final inspection, measurement
27、s and requirements. 454.29 Characteristics at high and low temperature 454.29.1 Test procedure 454.29.2 Requirements 464.30 Thermal stability test . 464.31 Component solvent resistance 464.31.1 Initial measurements . 464.31.2 Test procedure 464.31.3 Final inspection, measurements and requirements. 4
28、64.32 Solvent resistance of marking . 464.32.1 Test procedure 464.32.2 Final inspection, measurements and requirements. 474.33 Mounting (for surface mount capacitors only) 474.33.1 Substrate . 474.33.2 Wave soldering 474.33.3 Reflow soldering 484.34 Shear test . 504.34.1 Test procedure 504.34.2 Fina
29、l inspection, measurements and requirements. 504.35 Substrate bending test 504.35.1 Test procedure 504.35.2 Recovery . 514.35.3 Final inspection and requirements . 514.36 Dielectric absorption . 514.36.1 Test procedure 514.36.2 Requirement 524.37 Damp heat, steady state, accelerated . 524.37.1 Initi
30、al measurements . 524.37.2 Test methods . 524.37.3 Test procedures . 524.37.4 Final inspection, measurements and requirements. 524.38 Passive flammability . 524.38.1 Test procedure 524.38.2 Final inspection, measurements and requirements. 534.39 High surge current test 534.39.1 Initial measurements
31、. 534.39.2 Test procedure 534.39.3 Requirements for the charging circuit. 544.39.4 Nonconforming items . 544.40 Voltage transient overload (for aluminium electrolytic capacitors with non-solid electrolyte) . 544.40.1 Initial measurement . 544.40.2 Test procedure 544.40.3 Final inspection, measuremen
32、ts and requirements. 564.40.4 Conditions to be prescribed in the relevant specification 56v 4.41 Whisker growth test 564.41.1 General . 564.41.2 Preparation of specimen 574.41.3 Initial measurement . 574.41.4 Test procedures . 574.41.5 Test severities . 574.41.6 Final inspection, measurements and re
33、quirements. 57Annex A (informative) Interpretation of sampling plans and procedures as described in IEC 60410 for use within quality assessment systems . 58Annex B (informative) Rules for the preparation of detail specifications for capacitors and resistors for electronic equipment for use within qu
34、ality assessment systems 59B.1 Drafting . 59B.2 Reference standard 59B.3 Circulation 59Annex C (informative) Layout of the first page of a PCP/CQC specification 60Annex D (informative) Requirements for capability approval test report 61D.1 General . 61D.2 Requirements . 61D.3 Summary of test informa
35、tion (for each CQC) . 61D.4 Measurement record . 61Annex E (informative) Guide for pulse testing of capacitors . 62E.1 Overview. 62E.2 Typical capacitor pulse conditions . 62E.3 Effect of inductance on pulse testing . 64Annex F (informative) Guidance for the extension of endurance tests on fixed cap
36、acitors . 65F.1 Overview. 65F.2 Guidelines 65Annex G (normative) Damp heat, steady state with voltage applied, for metallized film capacitors only 66G.1 Overview. 66G.2 Test procedure 66Annex H (normative) Accelerated damp heat, steady state, for multilayer ceramic capacitors only 67H.1 Mounting of
37、capacitors 67H.2 Initial measurement 67H.3 Test procedure 67H.4 Recovery 67H.5 Final inspection, measurements and requirements 67Annex Q (informative) Quality assessment procedures 68Q.1 General . 68Q.1.1 Scope of this annex . 68Q.1.2 Quality assessment definitions 69Q.1.3 Rework 69Q.1.4 Alternative
38、 test methods 70Q.1.5 Certified test records of released lots 70Q.1.6 Unchecked parameters 70Q.1.7 Delayed delivery 70vi Q.1.8 Repair . 71Q.1.9 Registration of approvals . 71Q.1.10 Manufacture outside the geographical limits 71Q.2 Qualification approval (QA) procedures . 71Q.2.1 Eligibility for qual
39、ification approval . 71Q.2.2 Application for qualification approval . 71Q.2.3 Subcontracting 71Q.2.4 Test procedure for the initial product qualification approval 71Q.2.5 Granting of qualification approval 72Q.2.6 Maintenance of qualification approval 72Q.2.7 Quality conformance inspection . 72Q.3 C
40、apability approval (CA) procedures . 72Q.3.1 General . 72Q.3.2 Eligibility for capability approval . 73Q.3.3 Application for capability approval . 73Q.3.4 Subcontracting 73Q.3.5 Description of the capability . 73Q.3.6 Demonstration and verification of capability . 73Q.3.7 Granting of capability appr
41、oval 73Q.3.8 Maintenance of capability approval 73Q.3.9 Quality conformance inspection . 74Q.4 Technology approval (TA) procedure 74Q.4.1 General . 74Q.4.2 Eligibility for technology approval 74Q.4.3 Application of technology approval 74Q.4.4 Subcontracting 75Q.4.5 Description of technology 75Q.4.6
42、Demonstration and verification of the technology . 75Q.4.7 Granting of technology approval 75Q.4.8 Maintenance of technology approval 75Q.4.9 Quality conformance inspection . 75Bibliography 76Figure 1 Reactive power against frequency 10Figure 2 Relation between category temperature range and applied
43、 voltage 11Figure 3 Voltage-proof test circuit 19Figure 4 Schematic diagram of the impedance measuring circuit . 24Figure 5 Capacitor mounting arrangement . 25Figure 6 Capacitor mounting arrangement . 27Figure 7 Typical diagram of an absorption oscillator-wavemeter 27Figure 8 Schematic diagram of th
44、e measuring circuit . 28Figure 9 Test circuit . 29Figure 10 Test circuit for electrolytic capacitors . 37Figure 11 Relay circuit . 41Figure 12 Thyristor circuit 42Figure 13 Voltage waveform across capacitor 42vii Figure 14 Voltage and current waveform 44Figure 15 Suitable substrate for mechanical te
45、sts 49Figure 16 Suitable substrate for electrical tests 50Figure 17 High surge current test . 54Figure 18 Voltage transient overload test circuit . 55Figure 19 Voltage waveform 56Table 1 Referee conditions 14Table 2 Measurement of insulation resistance 15Table 3 Measuring points . 18Table 4 Tensile
46、force . 30Table 5 Torque 30Table 6 Number of cycles 35Table 7 Severities and requirements 53viii INTERNATIONAL ELECTROTECHNICAL COMMISSION _ FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT Part 1: Generic specification FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide o
47、rganization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activiti
48、es, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dea
49、lt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each te
