1、 EIA STANDARD Surface Mount Ferrite Chip Bead Qualification Specification EIA-944 December 2013 EIA-944ANSI/EIA-944 Approved: December 10, 2013 NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and
2、purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECI
3、A from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards a
4、nd Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard
5、 is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety proble
6、ms associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5259, formulated
7、under the cognizance of the P3 Inductive Devices Standards). Published by Electronic Components Industry Association 2013 Engineering Department 2214 Rock Hill Road, Suite 170 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be reproduced without p
8、ermission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5184), International (303-397-7956) i CONTENTS Paragraph Pa
9、ge Foreword . iii Paragraph 1 Scope 1 1.1 Description . 1 1.2 Reference documents 1 2 General requirements 1 2.1 Objective. 1 2.2 Generic data 2 2.2.1 The use of generic data to satisfy qualification requirements 2 2.2.2 Qualification families 2 2.2.3 Manufacturing site (fabrication and assembly) .
10、2 2.3 Test samples . 3 2.3.1 Lot requirements . 3 2.3.2 Production requirements . 3 2.3.3 Reusability of test samples 3 2.3.4 Sample size requirements 2.3.5 Prestress and post stress test requirements 3 2.4 Definition of electrical test failure after stressing . 3 2.5 Criteria for passing qualificat
11、ion 3 2.6 Alternative testing requirements . 3 2.7 Disqualification. 3 3 Qualification and requalification 4 3.1 Qualification of a new device . 4 3.2 Changes requiring requalification . 4 3.2.1 Criteria for passing requalification 4 4 Test requirements . 4 4.1 Sampling plan . 4 4.2 Electrical chara
12、cteristics . 5 4.3 Visual and mechanical examination 5 4.4 Life test . 5 4.5 Aqueous conditions . 4.5.1 Load humidity . 6 4.6 Thermal shock 8 4.7 Vibration . 9 4.8 Shock 9 4.9 Bending . 9 4.10 Flammability 10 4.11 Solderability. 10 4.12 Resistance to soldering heat . 10 4.13 Terminal strength . 5 Pr
13、econditioning . ii Foreword This specification was prepared by the Electronic Industries Associations P-3 Committee on Inductive Components Task Force on Qualification Specifications. EIA-944 Page 1 1 Scope 1.1 Description This specification defines the qualification program for surface mount ferrit
14、e chip beads. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of their responsibility to their own companys internal qualification progra
15、m. 1.2 Reference documents The current revision of the referenced documents will be in effect at the date of agreement to the qualification plan. Subsequent qualification plans will automatically use the latest revisions of these referenced documents: MIL-STD-202 Test Method Standard - Electronic an
16、d Electrical Component Parts MIL-HDBK-53-1A Military Handbook - Guide for Attribute Lot Sampling Inspection UL-94V Tests for Flammability of Plastic Materials IEC 60068 Basic Environmental Testing Procedures IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning) 2
17、 General Requirements This specification includes requirements with the intention of developing a single set of robust qualification tests that would enable a supplier to leverage test results to satisfy the requirements of multiple original equipment manufacturer (OEM) customers. 2.1 Objective The
18、objective of this qualification program is to ensure that components meet a minimum quality and/or reliability level. 2.2 Generic data 2.2.1 The use of generic data to satisfy qualification requirements The use of generic data for qualification will be based on specific requirements associated with
19、each characteristic of the device and manufacturing process. These requirements, listed in Table 1, are the same for new components, new processes, and requalification associated with a process change. A maximum negotiable set of qualification tests must be performed for the appropriate changes prop
20、osed for the component or process. Section 2.2.2 Qualification families defines the criteria by which components are grouped into a qualification family for the purpose of considering the data from one or more components that can be generically applied to the qualification of other components within
21、 the family. For each stress test, two or more qualification families can be combined if reasoning for this is technically sound, supported by data and periodically reviewed for soundness of original assumptions. With proper attention to these qualification guidelines, greater information applicable
22、 to other devices in the family can be accumulated and used to demonstrate their reliability so that qualification testing on new devices entering a family can be minimized. For example, this can be achieved through extensive qualification and monitoring of the most complex device in the reliability
23、 family and applied to less complex devices that subsequently join this family. Sources of generic data should come from supplier-certified test labs, and can include internal suppliers qualification, user-specific qualifications and suppliers in-process monitors, as long as the test conditions and
24、endpoint test temperatures address the worst case temperature extremes and designed product life for the application or the user requesting the qualification. Justification for the use of generic data must be demonstrated by the supplier and approved by the user. EIA-944 Page 2 2.2.2 Qualification f
25、amilies The qualification must represent the same manufacturing process, materials and formulation. The supplier will provide a complete description of each process and material of significance. Samples should represent different values within the family. These values should represent the low range,
26、 and upper range of the family. There must be valid and obvious links between the data and the subject of qualification. 2.2.3 Manufacturing site (fabrication and assembly) Each manufacturing site and line is to be considered independently for site qualification, meaning that the site is proven to b
27、e capable (resources and equipment) of running particular processes with adequate yields (to be determined by the supplier). A site cannot be qualified based on the results from a different location. Qualification families do not apply across manufacturing sites. 2.3 Test samples 2.3.1 Lot requireme
28、nts Test samples shall consist of representative devices from the qualification family. Multiple lot samples are specified in Table 1. Test samples shall be composed of approximately equal numbers of devices from three nonconsecutive lots, with each assembly lot composed of a different date code sep
29、arated by a minimum of one week. 2.3.2 Production requirements All test samples shall be processed, tested, screened and inspected on the same production site and with the same production process for which the qualification family to be qualified will be manufactured for production. 2.3.3 Reusabilit
30、y of test samples Devices which have been used for nondestructive qualification tests may be used to populate other qualification tests. 2.3.4 Sample size requirements Sample sizes used for qualification testing and/or generic data submission must be consistent with the specified minimum sample size
31、s and acceptance criteria in Table 1. 2.3.5 Pre-stress and post stress test requirements All endpoint test temperatures (room, hot and/or cold) are specified in the appropriate test paragraphs. The specific value of temperature must address the worse case temperature extremes and designed product li
32、fe for the application of the user requesting the qualification. 2.4 Definition of electrical test failure after stressing Electrical test failures are defined as those devices not meeting the requirements called out in Section 4 of this document. EIA-944 Page 3 2.5 Criteria for passing qualificatio
33、n Passing all appropriate qualification tests in this specification qualifies the device. Any unique reliability tests or conditions requested by the user and not specified in this document shall be negotiated between the supplier and user requesting the test. Any failure shall be analyzed for root
34、cause, and demonstration of corrective and preventive actions is required. 2.6 Alternative testing requirements All deviations from the qualification requirements and conditions must be approved by the user. All deviations should be clearly reported when the results of the qualification are submitte
35、d to the user for approval. 2.7 Disqualification When the number of failures for any given test in Table 1 exceeds the acceptance criteria using the procedure in 2.5, the device shall be disqualified until the root cause of the failure(s) is (are) determined and corrective and preventive actions are
36、 confirmed to be effective. New samples or data may be requested to verify the above. 3 Qualification and Requalification 3.1 Qualification of a new device The test requirements and corresponding test conditions for the qualification of a new device are listed in Table 1. For each qualification, the
37、 supplier must present data for all of these tests, either specific to the device to be qualified or acceptable qualification family data. Justification for the use of generic data must be demonstrated by the supplier and approved by the user. 3.2 Changes requiring requalification Changes to a devic
38、e, or the processes used in its fabrication, will require retesting as agreed upon between the supplier and the user. The supplier and the user should agree upon the appropriate test plan prior to starting the requalification. 3.2.1 Criteria for passing requalification Passing all appropriate requal
39、ification tests specified in this document agreed upon by both the user and the supplier, qualifies the change per this document. All requalification failures shall be analyzed for root cause, and demonstration of corrective and preventative actions is required. EIA-944 Page 4 4 Test Requirements 4.
40、1 Sampling Plan The sample size per lot in Table 1 is selected from one manufacturing lot. The total sample size per family shall consist of a minimum of three manufacturing lots separated by at least one week of date. Any reduction in sample size can only be authorized by the user. Table 1Ferrite c
41、hip bead qualification test program; approval levels and sampling plan Test method Ferrite chip bead inspection Sample size per lot Total sample size Defects permitted 4.2 Electrical characteristics 83 249 0 4.3 Visual and mechanical 5 15 0 4.4 Life 16 48 0 4.5 Load Humidity 16 48 0 4.6 Thermal shoc
42、k 16 48 0 4.7 Vibration 5 15 0 4.8 Shock 5 15 0 4.9 Bending 5 15 0 4.10 Flammability Present certificate of compliance 4.11 Solderability 10 30 0 4.12 Resistance to soldering heat 5 15 0 4.13 Terminal Strength 5 15 0 4.2 Electrical characteristics The total samples required in Table 1 shall be measu
43、red initially at ambient room temperature, relative humidity, and atmospheric pressure (253C, 502%, 760mm Hg) before subsequent testing. Initial electrical parameters shall meet the requirements listed in the applicable product specifications. The initial parameter testing shall include the measurem
44、ent of impedance and DC resistance. Impedance values shall be measured at 100 MHz. In addition, the rated current shall be defined as the current required to achieve a self temperature rise (T) of: a) 25 oC for Signal level beads (30 B 20 C 15 D 10 E 5 EIA-944 Page 5 4.3 Visual and Mechanical Examin
45、ation The ferrite chip beads shall be visually examined to verify that no defects in workmanship exist. Mechanical dimensions will be measured and shall meet the requirements defined in the detailed specification sheet or reference documents. Unless otherwise specified, when ferrite chip beads are t
46、ested in accordance with the environmental and other stress tests listed below, there shall be no evidence of mechanical damage or measurable discontinuity. This test may be conducted at room temperature. EIA-944 Page 6 4.4 Life Test Ferrite chip beads shall be tested in accordance with MIL-STD-202,
47、 Method 108, Test Condition D where applicable except: a) Preconditioning is required as specified in Section 5. b) Test temperature shall be 125* 2 oC. c) Apply maximum rated DC current for 1000 hours minimum. d) Measurements shall be taken at 0 h, 250 h, 500 h, and 1000 h. The beads shall be allow
48、ed to stabilize at room temperature for 24 hours before measurements are taken. e) The impedance value shall not change by more than (Refer to Maximum Impedance Change Chart Table 2) of the initial value at the intermediate or final measurements; the DC resistance (DCR) value shall not exceed the in
49、itial specification value at intermediate or final measurements; no physical or mechanical damage shall be observed. *85 2 oC for high current ferrite beads. 4.5 Aqueous Conditions Test 4.5.1 Load Humidity Test (Steady State) Ferrite chip beads shall be tested in accordance with MIL-STD-202, Method 103, Test Condition D where applicable except: a) Preconditioning as specified in Section 5, is required. b) Test temperature (+85 2) oC. c) Relative humidity shall be held at 85%. d) Apply 100% of the rated current continuously for 1000 hours. e) Measurements shall be ta
