1、BSI Standards PublicationSemiconductor devices mechanical and climatic test methodsPart 42: Temperature humidity storageBS EN 60749-42:2014National forewordThis British Standard is the UK implementation of EN 60749-42:2014. It isidentical to IEC 60749-42:2014.The UK participation in its preparation
2、was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The B
3、ritish Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 79091 1ICS 31.080.01Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 Octo
4、ber 2014.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60749-42:2014EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60749-42 October 2014 ICS 31.080.01 English Version Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and
5、 humidity storage (IEC 60749-42:2014) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 42: Stockage de temprature et dhumidit (CEI 60749-42:2014) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 42: Lagerung bei Wrme und Feuchte (IEC 60749-42:201
6、4) This European Standard was approved by CENELEC on 2014-09-16. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographic
7、al references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibil
8、ity of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Fo
9、rmer Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechn
10、ical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No.
11、 EN 60749-42:2014 E BS EN 60749-42:2014EN 60749-42:2014 - 2 - Foreword The text of document 47/2200/FDIS, future edition 1 of IEC 60749-42, prepared by IEC/TC 47 “Semiconductor devices.“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60749-42:2014. The following dates a
12、re fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-06-16 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2017-09-16 Attention is drawn t
13、o the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-42:2014 was approved by CENELEC as a E
14、uropean Standard without any modification. BS EN 60749-42:2014- 3 - EN 62056-9-7:2014 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and a
15、re indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod)
16、, the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60749-20 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of
17、plastic encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20 - BS EN 60749-42:2014 2 IEC 60749-42:2014 IEC 2014 CONTENTS 1 Scope 5 2 Normative references 5 3 Test equipment 5 3.1 Capacity of the equipment 5 3.2 Materials and construction of the thermostatic/humidistati
18、c chamber 5 3.3 Water to be used in the test 5 4 Procedure 5 4.1 Preconditioning . 5 4.2 Initial measurements . 6 4.3 Tests 6 Inserting and removing specimens . 6 4.3.1Test conditions 6 4.3.2Test duration . 6 4.3.3Post treatment . 7 4.3.4End-point measurement . 7 4.3.55 Failure criteria . 7 6 Inform
19、ation to be given in applicable procurement document . 8 Figure 1 Unsaturated pressurized vapour test conditions profile. 7 Table 1 Temperature and humidity storage test conditions . 6 BS EN 60749-42:2014IEC 60749-42:2014 IEC 2014 5 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 42:
20、 Temperature and humidity storage 1 Scope This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of
21、chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests. 2 Normative references The foll
22、owing documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-20, S
23、emiconductor devices Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 3 Test equipment 3.1 Capacity of the equipment The chamber to be used in this test shall be capable of maintaining the test temperature and
24、 humidity conditions specified in 4.3 throughout the test duration. 3.2 Materials and construction of the thermostatic/humidistatic chamber The chamber shall be made of materials that do not deteriorate under high humidity conditions. The design of the chamber shall prevent water condensed on the ce
25、iling of the chamber from dropping on the specimen. 3.3 Water to be used in the test Water to be used in the tests shall be distilled water or deionised water, with a resistivity of 500 m or more at 23 C. 4 Procedure 4.1 Preconditioning When the specimen is a plastic-moulded SMD, the moisture soakin
26、g and soldering heat stress treatment specified in IEC 60749-20 shall be carried out before executing this test. BS EN 60749-42:2014 6 IEC 60749-42:2014 IEC 2014 4.2 Initial measurements The initial measurements shall be carried out in accordance with the applicable procurement document. 4.3 Tests I
27、nserting and removing specimens 4.3.1The specimens shall be placed in the chamber at the high temperature and high humidity conditions required by the applicable procurement document. When putting the specimen in and out of the chamber, care shall be taken to ensure that water droplets not to adhere
28、 to the specimen and that the specimen does not come into contact with any condensed water. NOTE When a SMD is to be mounted on a jig for evaluation, the relevant conditions (board materials, size of the land, soldering method, flux cleaning, etc.) are specified in the applicable procurement documen
29、t. Test conditions 4.3.2The temperature and humidity conditions shall be selected from Table 1. Unless otherwise required by the applicable procurement document, condition C shall be used. Where Conditions D, E, and F are specified, the temperature shall be controlled from the start to the end of th
30、e test and the humidity shall be controlled between temperature ramp-up and temperature ramp-down, in accordance with the profile of Figure 1, unless otherwise specified in the applicable procurement document. Care should be taken because failure modes consisting of short-circuits (leaks) between ex
31、ternal leads through plating metal, that do not occur in the field, may occur under condition C (temperature 85 C, humidity 85 %), and conditions D, E, and F (the unsaturated pressurized vapour test). Test duration 4.3.3The test duration shall be in accordance with Table 1, except when otherwise spe
32、cified in the applicable procurement document. In this case, acceleration and diffusion models that estimate moisture exposure duration in the use conditions shall be documented and added to the procurement document. Under conditions D, E, and F, the time count shall be started when the vapour press
33、ure and temperature stabilise as shown in Figure 1. Table 1 Temperature and humidity storage test conditions Test condition Temperature Humidity Test duration Vapor pressureaC % h Pa A 40 2 90 5 8 00016824+7,4 103B 60 2 90 5 4 00016824+1,9 104C 85 2 85 5 1 00016824+5,0 104D 110 2 85 5 26480+1,2 105E
34、 120 2 85 5 16840+1,7 105F 130 2 85 5 9620+2,3 105aReference value BS EN 60749-42:2014IEC 60749-42:2014 IEC 2014 7 Figure 1 Unsaturated pressurized vapour test conditions profile Post treatment 4.3.4After completion of the test and confirmation that the interior of the chamber has returned approxima
35、tely to the specified temperature and humidity profile, the specimen shall be removed from the chamber and left at room temperature. The specimens shall be maintained at room ambient, for between 2 h and the completion of the electrical test. Under conditions D, E, and F, special care shall be taken
36、 when handling the specimen after finishing the test, because failure modes different from those ones of the tests may occur due to condensation, sudden changes in the temperature and pressure, and other relevant factors. End-point measurement 4.3.5The end-point measurements shall be carried out acc
37、ording to the applicable procurement document. These measurements shall be carried out within 48 h at room ambient after the completion of the tests, except when otherwise specified in the applicable procurement document. NOTE Where completion of the end point measurement is expected to exceed 48 h,
38、 the moisture loss can be reduced by placing the device in a moisture barrier bag sealed in ambient air without vacuum or desiccant within 6 h after removal from the test chamber. 5 Failure criteria A device will be considered to have failed if parametric limits are exceeded, or if functionality can
39、not be demonstrated under nominal and worst-case conditions, as specified in the relevant IEC %RH nullC Relative Humidity Humidity target Room humidity Temperature Temperature target Room Temperature Pa Test pressure Room pressure Vapour Pressure 3h 3h Test time Time (h) BS EN 60749-42:2014 8 IEC 60
40、749-42:2014 IEC 2014 specification or data sheet. Electrical failures due to external package damage which are an artefact of the test method shall be excluded from the failure classification. 6 Information to be given in applicable procurement document a) initial measurements (see 4.2); b) test con
41、dition (other than as specified) (see 4.3.2); c) test duration (other than as specified) (see 4.3.3); d) post treatment (other than as specified) (see 4.3.4); e) end-point measurements (other than as specified) (see 4.3.5); f) storage conditions (other than as specified) (see 4.3.5). _ BS EN 60749-4
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